Patent Assignment
Reel/Frame 030341/0956
Release of Security Interest in Patents Recorded at R/F 027128/0763
Recorded: 2013-05-03
Received: 2013-05-03
Pages: 18
Assignor
BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Executed: 2013-05-03
Assignee
GSI GROUP CORPORATION
125 MIDDLESEX TURNPIKE, BEDFORD, MA, 01730, UNITED STATES
Covered Properties
(61)
Multiband Antenna with Grounded Element
Application:
12/971,444 →
Laser-Based Method and System for Removing One or More Target Link Structures
Application:
12/950,969 →
Method and System for Laser Processing Targets of Different Types on a Workpiece
Application:
12/793,306 →
Method and System for High-Speed, Precise Micromachining an Array of Devices
Application:
12/644,832 →
Method and System for High-Speed Precise Laser Trimming and Scan Lens for Use Therein
Application:
12/499,123 →
Link Processing with High Speed Beam Deflection
Application:
12/233,476 →
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Application:
12/165,853 →
Laser Processing of Conductive Links
Application:
12/121,684 →
System and Method for Multi-Pulse Laser Processing
Application:
11/969,000 →
Method and System for Machine Vision-Based Feature Detection and Mark Verification in a Workpiece or Wafer Marking System
Application:
11/948,425 →
Method and System for Laser Processing Targets of Different Types on a Workpiece
Application:
11/900,731 →
Flexible Scan Field
Application:
11/695,721 →
Laser-Based Method and System for Removing One or More Target Link Structures
Application:
11/700,386 →
Method and System for High-Speed Precise Laser Trimming and Scan Lens for Use Therein
Application:
11/657,810 →
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Application:
11/643,023 →
Method and System for Adaptively Controlling a Laser-Based Material Processing Process and Method and System for Qualifying Same
Application:
11/606,484 →
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Application:
11/593,797 →
Laser-Based Method and System for Processing Targeted Surface Material and Article Produced Thereby
Application:
11/514,660 →
Methods and Apparatus for Utilizing an Optical Reference
Application:
11/582,829 →
System and Method for Laser Processing at Non-Constant Velocities
Application:
11/532,160 →
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Application:
11/415,547 →
Method and System for High-Speed, Precise Micromachining an Array of Devices
Application:
11/415,653 →
Optical Scanning Method and System and Method for Correcting Optical Aberrations Introduced into the System by a Beam Deflector
Application:
11/410,684 →
Method and Apparatus for Laser Marking by Ablation
Application:
11/332,923 →
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Application:
11/305,129 →
Method and System for Laser Soft Marking
Application:
11/270,109 →
Methods and Systems for Precisely Relatively Positioning a Waist of a Pulsed Laser Beam and Method and System for Controlling Energy Delivered to a Target Structure
Application:
11/247,541 →
Method and System for High-Speed Precise Laser Trimming, Scan Lens System for Use Therein and Electrical Device Produced Thereby
Application:
11/245,282 →
Selective targeting of tumor vasculature using antibody molecules
Application:
10/507,178 →
Method and System for High-Speed, Precise Micromachining an Array of Devices
Application:
11/131,668 →
Methods and Systems for Processing a Device, Methods and Systems for Modeling Same and the Device
Application:
11/125,367 →
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
Application:
11/114,520 →
Pulse Control in Laser Systems
Application:
11/005,981 →
Flexible Scan Field
Application:
10/967,895 →
High-Speed, Precision, Laser-Based Method and System for Processing Material of One or More Targets Within a Field
Application:
10/903,120 →
Laser Processing
Application:
10/899,133 →
Laser System and Method for Material Processing with Ultra Fast Lasers
Application:
10/787,517 →
High-Speed Precision Positioning Apparatus
Application:
10/747,552 →
Laser-Based System for Memory Link Processing with Picosecond Lasers
Application:
10/683,086 →
Method and System for Calibrating a Laser Processing System and Laser Marking System Utilizing Same
Application:
10/438,533 →
High Speed, Laser-Based Marking Method and System for Producing Machine Readable Marks on Workpieces and Semiconductor Devices with Reduced Subsurface Damage Produced Thereby
Application:
10/438,501 →
Method and System for Machine Vision-Based Feature Detection and Mark Verification in a Workpiece or Wafer Marking System
Application:
10/439,069 →
Laser Processing
Application:
10/428,938 →
Method and System for High-Speed, Precise Micromachining an Array of Devices
Application:
10/397,541 →
Antenna Which Can Be Operated in a Number of Frequency Bands
Application:
10/365,335 →
Method and System for High Speed Measuring of Microscopic Targets
Application:
10/244,891 →
Method and System for High Speed Measuring of Microscopic Targets
Application:
10/114,750 →
Methods and Systems for Precisely Relatively Positioning a Waist of a Pulsed Laser Beam and Method and System for Controlling Energy Delivered to a Target Structure
Application:
10/107,702 →
Methods and Systems for Processing a Device, Methods and Systems for Modeling Same and the Device
Application:
10/108,101 →
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Application:
10/107,890 →
Method and System for Processing One or More Microstructures of a Multi-Material Device
Application:
10/107,028 →
High-Speed, Precision, Laser-Based Method and System for Processing Material of One or More Targets Within a Field
Application:
10/107,027 →
Energy-Efficient Method and System for Processing Target Material Using an Amplified, Wavelength-Shifted Pulse Train
Application:
10/053,930 →
Laser Processing
Application:
10/036,431 →
Controlling Laser Polarization
Application:
10/013,956 →
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
Application:
10/001,104 →
Hand-Held Device
Application:
09/976,841 →
Laser Processing
Application:
09/968,541 →
Method and Subsystem for Generating a Trajectory to Be Followed by a Motor-Driven Stage When Processing Microstructures at a Laser- Processing Site
Application:
09/858,784 →
Method and Subsystem for Determining a Sequence in Which Microstructures Are to Be Processed at a Laser-Processing Site
Application:
09/858,691 →
Controlling Laser Polarization
Application:
09/770,275 →