Backmetal removal methods
Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; stress relief etching the second side of the semiconductor substrate; applying a backmetal over the second side of the semiconductor substrate; removing one or more portions of the backmetal through jet ablating the second side of the semiconductor substrate; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.
1. A method of forming a semiconductor package, the method comprising:
forming a plurality of notches into a first side of a semiconductor substrate;
forming an organic material over the first side of the semiconductor substrate and the plurality of notches;
thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches;
stress relief etching the second side of the semiconductor substrate;
applying a backmetal over the second side of the semiconductor substrate;
removing one or more portions of the backmetal through jet ablating the second side of the semiconductor substrate; and
singulating the semiconductor substrate through the organic material into a plurality of semiconductor packages.
2. The method of claim 1 , wherein the organic material is applied using a molding process.
3. The method of claim 1 , wherein a perimeter of each of a plurality of semiconductor die comprised in the semiconductor substrate each comprises a closed shape.
4. The method of claim 1 , wherein forming the organic material over the first side of the semiconductor substrate further comprises forming a permanent die support structure, a temporary die support structure, or any combination thereof comprising a perimeter comprising a closed shape.
5. The method of claim 4 , further comprising forming one of a second permanent die support structure or a temporary die support structure coupled to the second side of the semiconductor substrate.
6. The method of claim 4 , wherein the one of the permanent die support structure, the temporary die support structure, or any combination thereof comprises two or more layers.
7. A method of forming a semiconductor package, the method comprising:
forming a plurality of notches into the first side of a semiconductor substrate;
forming an organic material over the first side of the semiconductor substrate and the plurality of notches;
thinning a second side of the semiconductor substrate opposite the first side toward the plurality of notches to expose the organic material in the plurality of notches;
applying a backmetal over the second side of the semiconductor substrate;
removing one or more portions of the backmetal coupled with the organic material through jet ablating the second side of the semiconductor substrate; and
singulating the semiconductor substrate into a plurality of semiconductor packages.
8. The method of claim 7 , wherein the organic material is applied using a molding process.
9. The method of claim 7 , a perimeter of each of a plurality of semiconductor die comprised in the semiconductor substrate each comprises a closed shape.
10. The method of claim 7 , wherein forming the organic material over the first side of the semiconductor substrate further comprises forming a permanent die support structure, a temporary die support structure, or any combination thereof comprising a perimeter comprising a closed shape.
11. The method of claim 10 , further comprising forming one of a second permanent die support structure or a temporary die support structure coupled to the second side of the semiconductor substrate.
12. The method of claim 10 , wherein the one of the permanent die support structure, the temporary die support structure, or any combination thereof comprises two or more layers.
13. The method of claim 7 , further comprising forming a plurality of electrical connectors on the first side of the semiconductor substrate.
14. A method of forming a semiconductor package, the method comprising:
forming an organic material over the first side of the semiconductor substrate and a plurality of notches in the semiconductor substrate;
thinning a second side of a semiconductor substrate opposite the first side toward the plurality of notches to expose the organic material in the plurality of notches;
applying a backmetal over the second side of the semiconductor substrate;
removing one or more portions of the backmetal through jet ablating the second side of the semiconductor substrate; and
singulating the semiconductor substrate into a plurality of semiconductor packages.
15. The method of claim 14 , wherein the plurality of notches are die streets between a plurality of die comprised on the semiconductor substrate.
16. The method of claim 14 , wherein a perimeter of each of a plurality of semiconductor die comprised in the semiconductor substrate each comprises a closed shape.
17. The method of claim 14 , wherein forming the organic material over the first side of the semiconductor substrate further comprises forming a permanent die support structure, a temporary die support structure, or any combination thereof comprising a perimeter comprising a closed shape.
18. The method of claim 17 , further comprising forming one of a second permanent die support structure or a temporary die support structure coupled to the second side of the semiconductor substrate.
19. The method of claim 17 , wherein the one of the permanent die support structure, the temporary die support structure, or any combination thereof comprises two or more layers.
20. The method of claim 14 , further comprising forming a plurality of electrical connectors on the first side of the semiconductor substrate.