Electronic circuit comprising transistor and resistor
A method of manufacturing an electronic circuit (or circuit module) ( 100 ) is disclosed. The electronic circuit comprises a transistor ( 1 ) and a resistor ( 2 ), the transistor comprising a source terminal ( 11 ), a drain terminal ( 12 ), a gate terminal ( 13 ), and a first body ( 10 ) of material providing a controllable semi-conductive channel between the source and drain terminals, and the resistor comprises a first resistor terminal ( 21 ), a second resistor terminal ( 22 ), and a second body ( 20 ) of material providing a resistive current path between the first resistor terminal and the second resistor terminal. The method comprises: forming the first body ( 10 ); and forming the second body ( 20 ), wherein the first body comprises a first quantity ( 100 ) of a metal oxide and the second body comprises a second quantity ( 200 ) of said metal oxide. Corresponding electronic circuits are disclosed.
1. A method of manufacturing an electronic circuit for circuit module comprising a transistor and a resistor, the transistor comprising a source terminal, a drain terminal, a gate terminal, and a first body of material providing a controllable semiconductive channel between the source and drain terminals, and the resistor comprising a first resistor terminal, a second resistor terminal, and a second body of material providing a resistive current path between the first resistor terminal and the second resistor terminal, the method comprising:
forming the first body; and
forming the second body,
wherein the first body comprises a first quantity of a metal oxide and the second body comprises a second quantity of said metal oxide,
wherein forming the first body comprises forming said first quantity of said metal oxide, and forming the second body comprises forming said second quantity of said metal oxide, and
wherein said forming of said first quantity is performed before or after said forming of said second quantity.
2. The method in accordance with claim 1 , wherein forming said first quantity comprises forming said first quantity directly or indirectly on a first region of a substrate, and forming said second quantity comprises forming said second quantity directly or indirectly on a second region of the substrate.
3. The method in accordance with claim 1 , wherein said forming of said first quantity comprises forming said first quantity using a technique selected from a list comprising: physical deposition; physical vapour deposition (PVD); chemical deposition; chemical vapour deposition (CVD); atomic layer deposition (ALD); physical-chemical deposition; evaporation; sputtering; sol-gel techniques; chemical bath deposition; spray pyrolysis; plating techniques; pulsed laser deposition (PLD); solution processing; and spin coating.
4. The method in accordance with claim 1 , wherein said forming of said second quantity comprises forming said second quantity using a technique selected from a list comprising: physical deposition; physical vapour deposition (PVD); chemical deposition; chemical vapour deposition (CVD); atomic layer deposition (ALD); physical-chemical deposition; evaporation; sputtering; sol-gel techniques; chemical bath deposition; spray pyrolysis; plating techniques; pulsed laser deposition (PLD); solution processing; and spin coating.
5. The method in accordance with claim 1 , wherein said forming of said first quantity comprises forming (e.g. by depositing or otherwise forming) a first layer, film, or sheet of said metal oxide, said first layer, film, or sheet comprising said first quantity.
6. The method in accordance with claim 5 , wherein said forming of said first body comprises patterning the first layer, film, or sheet.
7. The method in accordance with claim 1 , wherein said forming of said second quantity comprises forming (e.g. by depositing or otherwise forming) a second layer, film, or sheet of said metal oxide, said second layer, film, or sheet comprising said second quantity.
8. The method in accordance with claim 7 , wherein said forming of the second body comprises patterning the second layer, film, or sheet.
9. The method in accordance with claim 1 , further comprising doping said first body of material with a first dopant to decrease for increase) an electrical conductivity of said first body.
10. The method in accordance with claim 9 , wherein doping said first body of material comprises forming said first quantity on a source of said first dopant.
11. The method in accordance with claim 9 , wherein doping said first body of material comprises forming a source of said first dopant on said first body of material.
12. The method in accordance with claim 1 , further comprising processing said second body (e.g. processing said second quantity of said metal oxide) to increase or decrease an electrical conductivity of the second body.
13. The method in accordance with claim 12 , wherein said processing of the second body comprises exposing at least a portion of the second body to electromagnetic radiation.
14. The method in accordance with claim 13 , further comprising providing said electromagnetic radiation from a lamp.
15. The method in accordance with claim 13 , further comprising providing said electromagnetic radiation from a laser.
16. The method in accordance with claim 13 , further comprising shielding at least a portion of the first body (e.g. at least a portion of the first quantity of said metal oxide) from said electromagnetic radiation.
17. The method in accordance with claim 16 , wherein said shielding comprises using said gate terminal to shield said at least a portion of the first body or said at least a portion of the first quantity from said electromagnetic radiation.