US 5187671A
· Cobb
· 1993
[cited by applicant]
US 5808330A
· Rostoker et al.
· 1998
[cited by applicant]
US 6407434B1
· Rostoker et al.
· 2002
[cited by applicant]
US 6480990B1
· Sharp et al.
· 2002
[cited by applicant]
US 6829757B1
· Teig et al.
· 2004
[cited by applicant]
US 6877146B1
· Teig et al.
· 2005
[cited by applicant]
US 6928633B1
· Teig et al.
· 2005
[cited by applicant]
US 6973634B1
· Teig et al.
· 2005
[cited by applicant]
US 7096449B1
· Teig et al.
· 2006
[cited by applicant]
US 7107564B1
· Teig et al.
· 2006
[cited by applicant]
US 7117468B1
· Teig et al.
· 2006
[cited by applicant]
US 7269817B2
· Heng et al.
· 2007
[cited by applicant]
US 7310793B1
· Teig et al.
· 2007
[cited by applicant]
US 7441220B2
· Hetzel et al.
· 2008
[cited by applicant]
US 7754401B2
· Fujimura et al.
· 2010
[cited by applicant]
US 7784010B1
· Balsdon et al.
· 2010
[cited by applicant]
US 8473875B2
· Fujimura et al.
· 2013
[cited by applicant]
US 8818072B2
· Ong et al.
· 2014
[cited by applicant]
US 8898606B1
· Abou Ghaida et al.
· 2014
[cited by applicant]
US 9257367B2
· Okada et al.
· 2016
[cited by applicant]
US 20050138593A1
· Okumura
· 2005
[cited by applicant]
US 20080115099A1
· Patra
· 2008
[cited by applicant]
US 20110089345A1
· Komagata et al.
· 2011
[cited by applicant]
US 20110239181A1
· Uchino
· 2011
[cited by applicant]
US 20130022929A1
· Komagata et al.
· 2013
[cited by applicant]
US 20130031524A1
· He et al.
· 2013
[cited by applicant]
US 20130159943A1
· Agarwal et al.
· 2013
[cited by applicant]
US 20170357911A1
· Liu et al.
· 2017
[cited by applicant]
US 20200380089A1
· Gheith et al.
· 2020
[cited by applicant]
US 20220299881A1
· Zheng et al.
· 2022
[cited by applicant]
US 20230153505A1
· Chang et al.
· 2023
[cited by applicant]
US 20230168660A1
· Oriordan et al.
· 2023
[cited by applicant]
US 20230169246A1
· Oriordan et al.
· 2023
[cited by applicant]
US 20230169247A1
· Oriordan et al.
· 2023
[cited by applicant]
US 20230267265A1
· Oriordan
· 2023
[cited by applicant]
US 20230274068A1
· Fujimura
· 2023
[cited by applicant]
US 20230274069A1
· Fujimura
· 2023
[cited by applicant]
US 20230282635A1
· Fujimura
· 2023
[cited by applicant]
US 20230306177A1
· Fujimura
· 2023
[cited by applicant]
US 20230351087A1
· Oriordan et al.
· 2023
[cited by applicant]
US 20230351088A1
· Oriordan et al.
· 2023
[cited by applicant]
US 20230351089A1
· Oriordan et al.
· 2023
[cited by applicant]
US 20230359804A1
· Oriordan
· 2023
[cited by applicant]
US 20240119214A1
· Oriordan et al.
· 2024
[cited by applicant]
CN 107438842A
· 2017
[cited by applicant]
CN 111758072A
· 2020
[cited by applicant]
CN 113168085A
· 2021
[cited by applicant]
CN 113168115A
· 2021
[cited by applicant]
EP 3951496A1
· 2022
[cited by applicant]
JP 2005141679A
· 2005
[cited by applicant]
JP 2007536581A
· 2007
[cited by applicant]
JP 2011204000A
· 2011
[cited by applicant]
JP 2013077844A
· 2013
[cited by applicant]
JP 2014174288A
· 2014
[cited by applicant]
JP 2019114295A
· 2019
[cited by applicant]
JP 2021509208A
· 2021
[cited by applicant]
KR 102170578B1
· 2020
[cited by applicant]
KR 20210010897A
· 2021
[cited by applicant]
KR 102377411B1
· 2022
[cited by applicant]
TW I710763B
· 2020
[cited by applicant]
TW 202113501A
· 2021
[cited by applicant]
TW 202121050A
· 2021
[cited by applicant]
WO 2021043936A1
· 2021
[cited by applicant]
WO 2022086825A1
· 2022
[cited by applicant]
WO 2023163910A2
· 2023
[cited by applicant]
Ajayi, Tutu, et al., “OpenROAD: Toward a Self-Driving, Open-Source Digital Layout Implementation Tool Chain,” Proceedings of Government Microcircuit Applications and Critical Technology Conference, Jan. 1, 2019, 6 pages…
[cited by applicant]
Ao, Jianchang, et. al., “Delay-Driven Layer Assignment in Global Routing under Multi-tier Interconnect Structure,” ISPD '13: Proceedings of the 2013 ACM International Symposium on Physical Design, Mar. 2013, 7 pages, AC…
[cited by applicant]
Author Unknown, “D2S Enables “Stitchless” Full-Chip Inverse Lithography Technology in a Single Day for the Multi-Beam Era,” Press Release, Sep. 16, 2019, 3 pages, D2S, Inc., San Jose, California, USA.
[cited by applicant]
Author Unknown, “D2S Unveils Industry's First Mask-Wafer Double Simulation Platform,” Press Release, Sep. 20, 2011, 3 pages, D2S, Inc., San Jose, California, USA.
[cited by applicant]
Author Unknown, “Deep reinforcement learning,” Wikipedia, Sep. 21, 2020, 2 pages, Wikipedia.com.
[cited by applicant]
Author Unknown, “Design rule checking,” Wikipedia, May 27, 2020, 4 pages, Wikipedia.com.
[cited by applicant]
Author Unknown, “Marching squares,” Wikipedia, Dec. 30, 2019, 9 pages, Wikipedia.com.
[cited by applicant]
Author Unknown, “Multiple patterning,” Wikipedia, Oct. 10, 2020, 22 pages, Wikipedia.com.
[cited by applicant]
Author Unknown, “Optical proximity correction,” Wikipedia, Apr. 28, 2019, 5 pages, Wikipedia.com.
[cited by applicant]
Author Unknown, “Rasterisation,” Wikipedia, Aug. 21, 2020, 4 pages, Wikipedia.com.
[cited by applicant]
Author Unknown, “TrueMask® DS,” Exact Date Unknown but Before May 2020, 3 pages, D2S, Inc., retrieved from https://design2silicon.com/products/truemask-ds/.
[cited by applicant]
Author Unknown, “TrueMask® ILT Backgrounder Stitchless Full-Chip ILT in a Day,” Backgrounder, Sep. 2019, 6 pages, D2S, Inc., San Jose, California, USA.
[cited by applicant]
Author Unknown, “TrueMask® ILT,” Exact Date Unknown but Before May 2020, 7 pages, D2S, Inc., retrieved from https://design2silicon.com/products/truemask-ilt/.
[cited by applicant]
Cecil, Thomas, et al., “Establishing Fast, Practical, Full-Chip ILT Flows Using Machine Learning,” SPIE Proceedings 11327, Optical Microlithography XXXIII, Mar. 23, 2020, 19 pages, vol. 1132706, SPIE, San Jose, Californ…
[cited by applicant]
Chen, Kun-Yuan, et al., “Full-Chip Application of Machine Learning SRAFs on DRAM Case Using Auto Pattern Selection,” SPIE Proceedings 10961, Optical Microlithography XXXII, Oct. 10, 2019, 13 pages, vol. 1096108, SPIE, S…
[cited by applicant]
Chen, Tai-Chen, “Multilevel Full-Chip Gridless Routing With Applications to Optical-Proximity Correction,” Jun. 2007, 13 pages, IEEE, retrieved from http://cc.ee.ntu.edu.tw/˜ywchang/Papers/tcad07-mgr.pdf.
[cited by applicant]
Ibtehaz, Nabil, et. al., “MultiResUNet: Rethinking the U-Net Architecture for Multimodal Biomedical Image Segmentation,” Feb. 11, 2019, 25 pages, retrieved from https://arxiv.org/pdf/1902.04049.pdf.
[cited by applicant]
Jia, Ningning, et al., “Machine Learning for Inverse Lithography: using stochastic gradient descent for robust photomask synthesis,” Journal of Optics, Apr. 1, 2010, 9 pages, vol. 12, IOP Publishing, retrieved from http…
[cited by applicant]
Kwan, Joe, et al., “Applying Machine Learning Techniques to Accelerate Advanced Process Yield Ramp,” Jan. 5, 2021, 29 pages, Siemens Digital Industries Software, Munich, Germany.
[cited by applicant]
Lin, Yibo, et al., “Machine Learning for Yield Learning and Optimization,” 2018 IEEE International Test Conference (ITC), Oct. 29-Nov. 1, 2018, 10 pages, IEEE, Phoenix, AZ, USA.
[cited by applicant]
Liu, Peng, “Mask Synthesis Using Machine Learning Software and Hardware Platforms,” SPIE Proceedings 11327, Optical Microlithography XXXIII, Mar. 23, 2020, 17 pages, vol. 1132707, SPIE, San Jose, California, USA.
[cited by applicant]
Mitchell, Robin, “IMEC Demonstrates Buried Power Rails in FinFET CMOS,” Mar. 17, 2021, 6 pages, EPM, retrieved from https://www.electropages.com/blog/2021/03/imec-demonstrates-buried-power-rails-finfet-cmos.
[cited by applicant]
Mitra, Joydeep, et al., “RADAR: RET-Aware Detailed Routing Using Fast Lithography Simulations,” DAC '05: 42nd annual Design Automation Conference, Jun. 13-17, 2005, 6 pages, IEEE, retrieved from https://citeseerx.ist.ps…
[cited by applicant]
Naik, Mehul, “Challenges to Interconnect Scaling at 3nm and Beyond,” Applied Materials, Jun. 14, 2021, 9 pages, Applied Materials, Inc., retrieved from https://www.appliedmaterials.com/us/en/blog/blog-posts/challenges-t…
[cited by applicant]
Pang, Linyong (Leo), et al., “Study of Mask and Wafer Co-design That Utilizes a New Extreme SIMD Approach to Computing in Memory Manufacturing: Full-Chip Curvilinear ILT in a Day,” SPIE Proceedings 11148, Photomask Tech…
[cited by applicant]
Pang, Linyong, “Inverse Lithography Technology: 30 years from concept to practical, full-chip reality,” Journal of Micro/Nanopatterning, Materials, and Metrology, Aug. 31, 2021, 49 pages, vol. 20(3), SPIE, retrieved fro…
[cited by applicant]
Pang, Linyong, et al., “How GPU-Accelerated Simulation Enables Applied Deep Learning for Masks and Wafers,” Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology, Apr. 16-18, …
[cited by applicant]
Pang, Linyong, et al., “Making Digital Twins using the Deep Learning Kit (DLK),” Photomask Technology 2019, Sep. 15-19, 2019, 13 pages, SPIE, Monterey, California, USA.
[cited by applicant]
PCT International Search Report and Written Opinion of Commonly Owned International Patent Application PCT/US2023/013357, mailing date Aug. 15, 2023, 10 pages, International Searching Authority (US).
[cited by applicant]
Pradipta, Geraldo, et al., “A Machine Learning Based Parasitic Extraction Tool,” Oct. 31, 2019, 3 pages, University of Minnesota, Minneapolis, Minnesota, USA.
[cited by applicant]
Prasad, Divya, “Can we Bury our Scaling Problems with Buried Power Rails and Back-side Power Delivery?,” Mar. 5, 2020, 8 pages, Arm Limited, retrieved from https://community.arm.com/arm-research/b/articles/posts/can-we-…
[cited by applicant]
Ren, Haoxing (Mark), “Machine Learning and Deep Learning Applications in Design Automation and Practical Issues,” DAC '19: 56th Annual Design Automation Conference 2019, Jun. 2-6, 2019, 55 pages, Association for Computi…
[cited by applicant]
Ronneberger, Olaf, et. al., “U-Net: Convolutional Networks for Biomedical Image Segmentation,” May 18, 2015, 8 pages, retrieved from https://arxiv.org/pdf/1505.04597.pdf.
[cited by applicant]
Shi, Xuelong, et al., “Physics based feature Vector Design: a Critical Step Towards Machine Learning based Inverse Lithography,” SPIE Proceedings 11327, Optical Microlithography XXXIII, Mar. 23, 2020, 8 pages, vol. 1132…
[cited by applicant]
Sole, Marc Pons, “Layout Regularity for Design and Manufacturability,” Doctoral Thesis, Jul. 8, 2012, 185 pages, Technical University of Catalonia, Barcelona, Spain.
[cited by applicant]
Sperling, Ed, “Design Rule Complexity Rising,” Semiconductor Engineering—Deep Insights for the Tech Industry, Apr. 19, 2018, 16 pages, SMG, retrieved from https://semiengineering.com/design-rule-complexity-rising/.
[cited by applicant]
Teig, Steven L., “The X architecture: not your father's diagonal wiring,” SLIP '02: Proceedings of the 2002 international workshop on System-level interconnect prediction, Apr. 6, 2002, 5 pages, ACM, retrieved from http…
[cited by applicant]
Wang, Shibing, et al., “Efficient Full-Chip SRAF Placement Using Machine Learning for Best Accuracy and Improved Consistency,” SPIE Proceedings 10587, Optical Microlithography XXXI, Mar. 20, 2018, 10 pages, vol. 105870N…
[cited by applicant]
Wang, Shibing, et al., “Machine Learning Assisted SRAF Placement for Full Chip,” SPIE Proceedings 10451, Photomask Technology 2017, Oct. 16, 2017, 8 pages, vol. 104510D, SPIE, Monterey, California, USA.
[cited by applicant]
Yang, Dingcheng, et al., “CNN-Cap: Effective Convolutional Neural Network Based Capacitance Models for Full-Chip Parasitic Extraction,” Jul. 14, 2021, 9 pages, retrieved from https://arxiv.org/pdf/2107.06511.pdf.
[cited by applicant]
Dai, Wayne Wei-Ming, “Rubber band routing and dynamic data representation,” 1990 IEEE International Conference on Computer-Aided Design, Nov. 11-15, 1990, 4 pages, IEEE, Santa Clara, California, USA.
[cited by applicant]
Staepelaere, David Joseph, “Geometric Transformations for a Rubber-band Sketch,” Master's Thesis, Sep. 1992, 71 pages, University of California at Santa Cruz, Santa Cruz, CA.
[cited by applicant]
Shao, Hao-Chiang, et. al., “From IC Layout to Die Photograph: A CNN-Based Data-Driven Approach” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 40, No. 5, May 2021, pp. 957-970, IEEE.
[cited by applicant]
Dounde, Amit, et al., “A Study of Curvilinear Routing in IN5 Standard Cells: Challenges and Opportunities,” Photomask Technology 2019, Sep. 26, 2019, p. 48, SPIE.
[cited by applicant]