Granted Patent B2

US 12,283,584 · App. 18/407,408 · Granted Apr 22, 2025

Inventor: Ankur Aggarwal (Pleasanton, CA)

Assignee: Celestial AI Inc.

H01L25/167H01L21/56H01L23/5384G02B6/4202G02B6/4292

Abstract

Claims (34)

1. A method of manufacturing a circuit package, comprising:

connecting an analog-mixed signal portion of a die to a photonic interposer, wherein the analog-mixed signal portion of the die includes a driver and a transimpedance amplifier (TIA), wherein the photonic interposer includes a modulator and a photodetector, and wherein connecting the analog-mixed signal portion of the die includes:

connecting the driver to the modulator via a first electrical interconnect; and

connecting the TIA to the photodetector via a second electrical interconnect, wherein each of the first electrical interconnect and the second electrical interconnect have a length of less than 100 microns;

connecting an electronic portion of the die to the electrical interposer, where the die partially overlaps both the photonic interposer and the electrical interposer; and

connecting an optical element to the photonic interposer.

2. The method of claim 1 , wherein the modulator is a thermally stable modulator.

3. The method of claim 2 , wherein the thermally stable modulator is an electro-absorption modulator (EAM).

4. The method of claim 1 , further comprising electrically connecting a second die to the electrical interposer.

5. The method of claim 4 , further comprising electrically connecting the second die to the electrical portion through the electrical interposer.

6. The method of claim 5 , further comprising electrically connecting the second die to the analog-mixed signal portion through the electrical portion and the electrical interposer.

7. The method of claim 6 , further comprising electrically connecting the second die to the photonic interposer through the analog-mixed signal portion, the electrical portion, and the electrical interposer.

8. The method of claim 7 , wherein electrically connecting the second die to the photonic interposer includes electrically connecting the second die to the photonic interposer through a driver in the analog-mixed signal portion.

9. The method of claim 8 , wherein electrically connecting the second die to the photonic interposer includes electrically connecting the second die to the photonic interposer through a modulator in the photonic interposer.

10. The method of claim 7 , wherein electrically connecting the second die to the photonic interposer includes electrically connecting the second die to the photonic interposer through a transimpedance amplifier (TIA) in the analog-mixed signal portion.

11. The method of claim 10 , wherein electrically connecting the second die to the photonic interposer includes electrically connecting the second die to the photonic interposer through a photodetector in the photonic interposer.

12. The method of claim 6 , further comprising optically connecting the second die to a fiber array unit through the photonic interposer and electrically connecting the second die to the photonic interposer through the analog-mixed signal portion, the electrical portion, and the electrical interposer.

13. The method of claim 1 , further comprising rigidly connecting the photonic interposer and the electrical interposer.

14. The method of claims 1 , further comprising applying a mold to the photonic interposer and the electrical interposer to form a rigid unit.

15. The method of claim 14 , wherein the mold includes a silicon or a silicon alloy.

16. The method of claim 14 , wherein the mold includes a material that matches a thermal expansion of one or more of the photonic interposer and the electrical interposer.

17. The method of claim 1 , further comprising forming the electrical interposer as a mold.

18. The method of claim 1 , wherein the electrical interposer includes a through mold via.

19. The method of claim 1 , wherein the electrical interposer includes a bond via array.

20. The method of claim 1 , further comprising forming the photonic interposer and the electrical interposer on a carrier.

21. The method of claim 20 , further comprising debonding the photonic interposer and the electrical interposer from the carrier.

22. The method of claim 1 , further comprising applying redistribution layer to a bottom surface of one or more of the photonic interposer and the electrical interposer.

23. The method of claim 1 , further comprising applying redistribution layer to the electrical interposer.

24. The method of claim 1 , further comprising applying a redistribution layer to a top surface of the electrical interposer.

25. The method of claim 24 , further comprising attaching the die to the redistribution layer on the top surface of the electrical interposer.

26. The method of claim 1 , further comprising attaching a second die to one or more of the photonic interposer and the electrical interposer.

27. The method of claim 1 , further comprising attaching a third die to one or more of the photonic interposer, the electrical interposer, or a third interposer.

28. The method of claim 1 , wherein the first electrical interconnect is a first copper pillar, and wherein the driver is connected to a first end of the first copper pillar in the analog-mixed signal portion of the die, and wherein the modular is connected to a second end of the first copper pillar in the photonic interposer.

29. The method of claim 28 , wherein the second electrical interconnect is a second copper pillar, and wherein the TIA is connected to a first end of the second copper pillar in the analog-mixed signal portion of the die, and wherein the photodetector is connected to a second end of the second copper pillar in the photonic interposer.

Assignments (2)

Continuity (7)

References Cited (315)

Cited By (9)

US 12,436,346 US 12,442,997 US 12,442,998 US 12,442,999 US 12,443,000 US 12,468,103 US 12,674,948 US 12,674,949 US 12,699,240