Granted Patent B2

US 12,191,257 · App. 18/407,410 · Granted Jan 7, 2025

Inventor: Ankur Aggarwal (Pleasanton, CA)

Assignee: CELESTIAL AI INC.

H01L23/5381G02B6/1225G02B6/136G02B6/43H01L23/49822H01L24/08H01L24/16H01L25/0652H01L2224/08146H01L2224/08153H01L2224/16146H01L2224/16155H01L2924/12043H01L2924/141H01L2924/1434H01L2924/182

Abstract

Claims (47)

1. A circuit package, comprising:

a photonic interposer;

an electrical interposer;

a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the photonic interposer includes a modulator; and

a plurality of electrical interconnects between the photonic interposer and the die.

2. The circuit package of claim 1 , wherein the modulator is a thermally stable modulator.

3. The circuit package of claim 2 , wherein the thermally stable modulator is an electro-absorption modulator (EAM).

4. The circuit package of claim 1 , wherein the photonic interposer includes a photodetector.

5. The circuit package of claim 4 , wherein the photodetector includes a photodiode.

6. The circuit package of claim 1 , wherein one or more of the plurality of electrical interconnects are less than 100 microns in length.

7. The circuit package of claim 1 , wherein one or more of the plurality of electrical interconnects is one or more of one or more of soldering bumps, wires, copper pillars, wirebonds, through-substrate vias (TSVs), through-dielectric via (TDVs), re-distribution layers (RDLs), or landing pads.

8. The circuit package of claim 1 , wherein the photonic interposer includes a photonic integrated circuit.

9. A circuit package, comprising:

a photonic interposer;

an electrical interposer;

a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the analog-mixed signal portion includes a driver; and

a plurality of electrical interconnects between the photonic interposer and the die.

10. The circuit package of claim 9 , wherein the plurality of electrical interconnects includes a first electrical interconnect connecting the photonic interposer to the analog-mixed signal portion, and wherein the driver is connected to a first end of the first electrical interconnect.

11. The circuit package of claim 10 , wherein the photonic interposer includes a modulator, wherein the modulator is connected to a second end of the first electrical interconnect.

12. A circuit package, comprising:

a photonic interposer;

an electrical interposer;

a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the analog-mixed signal portion includes a transimpedance amplifier (TIA); and

a plurality of electrical interconnects between the photonic interposer and the die.

13. The circuit package of claim 12 , wherein the plurality of electrical interconnects includes a second electrical interconnect connecting the photonic interposer and the analog-mixed signal portion, and wherein the TIA is connected to a first end of the second electrical interconnect.

14. The circuit package of claim 13 , wherein the photonic interposer includes a photodetector, and wherein the photodetector is connected to a second end of the second electrical interconnect of the plurality of electrical interconnects.

15. A circuit package, comprising:

a photonic interposer;

an electrical interposer;

a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer;

a plurality of electrical interconnects between the photonic interposer and the die; and

a second die including a processing element, the processing element electrically connected to the electrical interposer.

16. The circuit package of claim 15 , wherein the second die is electrically connected to the electronic portion through the electrical interposer.

17. The circuit package of claim 16 , wherein the second die is electrically connected to the analog-mixed signal portion through the electronic portion and the electrical interposer.

18. The circuit package of claim 17 , wherein the second die is electrically connected to the photonic interposer through the analog-mixed signal portion, the electronic portion, and the electrical interposer.

19. The circuit package of claim 18 , wherein the second die is electrically connected to the photonic interposer through a driver in the analog-mixed signal portion.

20. The circuit package of claim 19 , wherein the second die is electrically connected to the photonic interposer through a modulator in the photonic interposer.

21. The circuit package of claim 18 , wherein the second die is electrically connected to the photonic interposer through the analog-mixed signal portion, the electronic portion, and the electrical interposer and optically connected to a fiber array unit through the photonic interposer.

22. A circuit package, comprising:

a photonic interposer;

an electrical interposer;

a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer;

a plurality of electrical interconnects between the photonic interposer and the die; and

a fiber array unit (FAU) between the photonic interposer and the die.

23. The circuit package of claim 22 , wherein one or more of a modulator or a photodetector are connected to the FAU with an FAU connection.

24. The circuit package of claim 23 , wherein the FAU connection is a bidirectional channel.

25. The circuit package of claim 24 , wherein the bidirectional channel includes one or more waveguides.

Assignments (2)

Continuity (7)

References Cited (320)

Cited By (13)

US 12,493,155 US 12,494,403 US 12,561,059 US 12,564,047 US 12,566,305 US 12,566,551 US 12,571,971 US 12,615,087 US 12,650,563 US 12,663,580 US 12,674,948 US 12,674,949 US 12,699,240