3D semiconductor devices and structures with metal layers
A semiconductor device including: a first silicon level including a first single crystal silicon layer and first transistors; a first metal layer disposed over it; a second metal layer disposed over the first metal layer; a third metal layer disposed over the second metal layer; a second level including second transistors, disposed over the third metal layer; a fourth metal layer disposed over the second level; a fifth metal layer disposed over the fourth metal layer, where the fourth metal layer is aligned to the first metal layer with a less than 240 nm alignment error; where the fifth metal layer includes global power delivery; each of the third transistors comprises a metal gate; a via disposed through the second level and the third level, where a typical thickness of the second metal layer is greater than a typical thickness of the third metal layer by at least 50%.
1. A semiconductor device, the semiconductor device comprising:
a first silicon level comprising a first single crystal silicon layer and a plurality of first transistors;
a first metal layer disposed over said first silicon level;
a second metal layer disposed over said first metal layer;
a third metal layer disposed over said second metal layer;
a second level comprising a plurality of second transistors, said second level disposed over said third metal layer;
a third level comprising a plurality of third transistors, said third level disposed over said second level;
a fourth metal layer disposed over said third level;
a fifth metal layer disposed over said fourth metal layer,
wherein said fourth metal layer is aligned to said first metal layer with a less than 240 nm alignment error,
wherein each of said plurality of second transistors comprises a metal gate,
wherein said fifth metal layer comprises global power delivery; and
a via disposed through said second level and through said third level,
wherein each of said plurality of third transistors comprises a metal gate,
wherein said via has a diameter of less than 450 nm, and
wherein a typical thickness of said second metal layer is greater than a typical thickness of said third metal layer by at least 50%.
2. The semiconductor device according to claim 1 , further comprising:
a fourth level comprising a second single crystal silicon layer,
wherein said fourth level is disposed over said fifth metal layer.
3. The semiconductor device according to claim 1 ,
wherein at least one of said metal gates comprises tungsten.
4. The semiconductor device according to claim 1 , further comprising:
peripheral circuits,
wherein said peripheral circuits comprise a portion of said plurality of first transistors.
5. The semiconductor device according to claim 1 ,
wherein said second metal layer comprises tungsten.
6. The semiconductor device according to claim 1 , further comprising:
a power delivery path to at least one of said plurality of second transistors,
wherein said power delivery path comprises at least a part of said second metal layer.
7. A semiconductor device, the semiconductor device comprising:
a first silicon level comprising a first single crystal silicon layer and a plurality of first transistors;
a first metal layer disposed over said first silicon level;
a second metal layer disposed over said first metal layer;
a third metal layer disposed over said second metal layer;
a second level comprising a plurality of second transistors, said second level disposed over said third metal layer;
a third level comprising a plurality of third transistors, said third level disposed over said second level;
a fourth metal layer disposed over said third level;
a fifth metal layer disposed over said fourth metal layer,
wherein said fourth metal layer is aligned to said first metal layer with a less than 240 nm alignment error,
wherein each of said plurality of second transistors comprises a metal gate, and
wherein said fifth metal layer comprises global power delivery:
a via disposed through said second level and through said third level,
wherein each of said plurality of third transistors comprises a metal gate,
wherein said via has a diameter of less than 450 nm, and
wherein a typical thickness of said second metal layer is greater than a typical thickness of said third metal layer by at least 50%; and
a power delivery path to at least one of said plurality of second transistors,
wherein said power delivery path comprises at least a part of said second metal layer,
wherein said power delivery path comprises at least a part of said third metal layer.
8. A semiconductor device, the semiconductor device comprising:
a first silicon level comprising a first single crystal silicon layer and a plurality of first transistors;
a first metal layer disposed over said first silicon level;
a second metal layer disposed over said first metal layer;
a third metal layer disposed over said second metal layer;
a second level comprising a plurality of second transistors, said second level disposed over said third metal layer;
a third level comprising a plurality of third transistors, said third level disposed over said second level;
a fourth metal layer disposed over said third level;
a fifth metal layer disposed over said fourth metal layer,
wherein said fourth metal layer is aligned to said first metal layer with a less than 240 nm alignment error; and
a via disposed through said second level and through said third level as part of a connection path between said fourth metal layer to said second metal layer,
wherein each of said plurality of second transistors comprises a metal gate,
wherein formation of said plurality of second transistors comprises a first lithography step, and
wherein formation of said plurality of third transistors comprises a second lithography step.
9. The semiconductor device according to claim 8 ,
wherein said via has a diameter of less than 450 nm.
10. The semiconductor device according to claim 8 ,
wherein said second level thickness is less than two microns.
11. The semiconductor device according to claim 8 ,
wherein at least one of said metal gates comprises tungsten.
12. The semiconductor device according to claim 8 , further comprising:
peripheral circuits,
wherein said peripheral circuits comprise a portion of said plurality of first transistors.
13. The semiconductor device according to claim 8 , further comprising:
a power delivery path to at least one of said plurality of second transistors,
wherein said power delivery path comprises at least a part of said second metal layer.
14. A semiconductor device, the semiconductor device comprising:
a first silicon level comprising a first single crystal silicon layer and a plurality of first transistors;
a first metal layer disposed over said first silicon level;
a second metal layer disposed over said first metal layer;
a third metal layer disposed over said second metal layer;
a second level comprising a plurality of second transistors, said second level disposed over said third metal layer;
a third level comprising a plurality of third transistors, said third level disposed over said second level;
a fourth metal layer disposed over said third level;
a fifth metal layer disposed over said fourth metal layer,
wherein said fourth metal layer is aligned to said first metal layer with a less than 240 nm alignment error:
a via disposed through said second level and through said third level as part of a connection path between said fourth metal layer to said second metal layer,
wherein each of said plurality of second transistors comprises a metal gate,
wherein formation of said plurality of second transistors comprises a first lithography step, and
wherein formation of said plurality of third transistors comprises a second lithography step; and
a fourth level comprising a second single crystal silicon layer,
wherein said fourth level is disposed over said fifth metal layer.
15. A semiconductor device, the semiconductor device comprising:
a first silicon level comprising a first single crystal silicon layer and a plurality of first transistors;
a first metal layer disposed over said first silicon level;
a second metal layer disposed over said first metal layer;
a third metal layer disposed over said second metal layer;
a second level comprising a plurality of second transistors, said second level disposed over said third metal layer;
a third level comprising a plurality of third transistors, said third level disposed over said second level;
a via disposed through said second level and through said third level;
a fourth metal layer disposed over said third level;
a fifth metal layer disposed over said fourth metal layer; and
a fourth level comprising a second single crystal silicon layer,
wherein said fourth level is disposed over said fifth metal layer,
wherein said fourth metal layer is aligned to said first metal layer with a less than 240 nm alignment error,
wherein each of said plurality of second transistors comprises a metal gate, and
wherein said via has a diameter of less than 450 nm.
16. The semiconductor device according to claim 15 ,
wherein said second level thickness is less than two microns.
17. The semiconductor device according to claim 15 , further comprising:
a power delivery path to at least one of said plurality of second transistors,
wherein said power delivery path comprises at least a part of said second metal layer.
18. The semiconductor device according to claim 15 ,
wherein each of said plurality of second transistors comprises a metal gate, and
wherein at least one of said metal gates comprises tungsten.
19. The semiconductor device according to claim 15 , further comprising:
peripheral circuits, and
wherein said peripheral circuits comprise a portion of said plurality of first transistors.
20. The semiconductor device according to claim 15 ,
wherein formation of said plurality of second transistors comprises a first lithography step, and
wherein formation of said plurality of third transistors comprises a second lithography step.