Granted Patent B2

US 12,216,318 · App. 18/610,502 · Granted Feb 4, 2025

Inventors: Philip Winterbottom (San Jose, CA); David Lazovsky (Los Gatos, CA); Ankur Aggarwal (Pleasanton, CA); Martinus Bos (San Jose, CA); Subal Sahni (La Jolla, CA)

Assignee: Celestial AI Inc.

G02B6/4295G02B6/4246G02B6/428G02B6/43G02F1/0157G02B6/4245

Abstract

Claims (37)

1. A package with a first die, the first die comprising:

a first interconnect region;

a first photonic transceiver portion electrically coupled with the first interconnect region;

a second interconnect region electrically coupled with the first interconnect region via an electrical coupling included in the first die;

a first photonic path from the first photonic transceiver portion to an optical interface (OI); and

a second photonic path from the OI to the first photonic transceiver portion;

wherein:

the first interconnect region is configured to electrically couple the first photonic transceiver portion to a second photonic transceiver portion residing in an analog/mixed-signal die (an AMS die);

the second interconnect region is configured to electrically couple an interface (I/F 1 ), residing in a general die, to the second photonic transceiver portion; and

electrical interconnects in the first interconnect region are less than two millimeters (2 mm) in length.

2. The package of claim 1 , wherein:

the AMS die is stacked on top of the first die and the general die is separately stacked on top of the first die less than about two millimeters (2 mm) from and side by side with the AMS die.

3. The package of claim 2 , wherein:

the second photonic transceiver portion in the AMS die comprises a first driver (DRV 1 ) and a first transimpedance amplifier (TIA 1 );

an AMS die first interconnect region is electrically and physically coupled with the first interconnect region via first electrical interconnects;

the interface (I/F 1 ) is electrically coupled with a general die first interconnect region; and

the general die first interconnect region is electrically and physically coupled with the second interconnect region via second electrical interconnects.

4. The package of claim 3 , wherein:

signals between the first photonic transceiver portion, the second photonic transceiver portion, and the interface (I/F 1 ) use a bus protocol according to a UCle and/or PCIe standard.

5. The package of claim 1 , wherein the first die is a photonic integrated circuit (PIC) and the AMS die and the general die are electric integrated circuits (EICs).

6. The package of claim 1 , wherein the optical interface (OI) comprises a fiber array unit (FAU) and a grating coupler (GC).

7. The package of claim 1 , wherein the first photonic transceiver portion comprises:

a first optical modulator (MOD 1 ) coupled between the first interconnect region and the first photonic path; and

a first photodetector (PD 1 ) coupled between the first interconnect region and the second photonic path.

8. The package of claim 7 , wherein the first die further comprises:

an optical multiplexer (MUX) optically coupled between MOD 1 and the OI; and

an optical demultiplexer (DEMUX) optically coupled between the OI and PD 1 .

9. The package of claim 1 , wherein:

the first die further comprises:

a second optical modulator (MOD 2 );

a second photodetector (PD 2 );

a third interconnect region coupled with MOD 2 and PD 2 ; and

wherein the package further comprises a second die with a second die first interconnection region electrically and physically coupled with the third interconnect region via third electrical interconnects.

10. The package of claim 1 , further comprising:

a light engine configured to interface with the first die via fibers.

11. The package of claim 1 , wherein:

the OI is configured to interface with an external device optical interface.

Assignments (2)

Continuity (6)

References Cited (295)

Cited By (15)

US 12,399,333 US 12,401,006 US 12,401,007 US 12,401,008 US 12,401,009 US 12,436,346 US 12,442,997 US 12,442,998 US 12,442,999 US 12,443,000 US 12,468,103 US 12,663,580 US 12,674,948 US 12,674,949 US 12,699,240