Granted Patent B1

US 12,298,608 · App. 18/742,028 · Granted May 13, 2025

Inventors: Philip Winterbottom (San Jose, CA); David Lazovsky (Los Gatos, CA); Ankur Aggarwal (Pleasanton, CA); Martinus Bos (San Jose, CA); Subal Sahni (La Jolla, CA)

Assignee: Celestial AI Inc.

G02F1/0123G01K7/023G01K7/028G01K7/14G02F1/0113

Abstract

Claims (32)

1. A package with an optical multi-die interconnect bridge (OMIB), comprising:

a photonic IC (PIC) including:

a modulator (MOD) with a first modulator input; and

a PIC interconnect region located within two millimeters (2 mm) from the modulator;

a photo detector (PD);

an electric IC (EIC) including:

a driver circuit (DRV); and

an EIC interconnect region located within two millimeters (2 mm) from the DRV;

a photonic transceiver, including the MOD and PD, having a first portion residing in the PIC and a second portion residing in the EIC;

a first photonic path from the photonic transceiver for sending a first optical data signal from the MOD; and

a second photonic path to the photonic transceiver for receiving a second optical data signal at the PD;

wherein:

the DRV is electrically coupled with the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region;

the MOD is configured to receive a temperature-dependent bias voltage; and

a temperature dependence of the temperature-dependent bias voltage inversely matches a temperature dependence of the MOD over an extended temperature range.

2. The package of claim 1 , wherein the PIC interconnect region is located within fifty microns (50 μm) from the modulator; and the EIC interconnect region is located within fifty microns (50 μm) from the DRV.

3. The package of claim 1 , wherein:

the EIC further comprises a temperature element (TE) electrically coupled with a second modulator input of the modulator via the EIC interconnect region, a second metal interconnect, and the PIC interconnect region, and wherein the TE includes a temperature sensor and/or a temperature predictor.

4. The package of claim 1 , wherein:

the EIC further comprises a temperature element (TE) and an adder with inputs that are electrically coupled with the TE and the DRV and an output that is electrically coupled with the first modulator input via the EIC interconnect region, the first metal interconnect, and the PIC interconnect region, and wherein the TE includes a temperature sensor and/or a temperature predictor.

5. The package of claim 4 , wherein:

The TE includes a lookup table to translate a measured and/or predicted temperature to the temperature-dependent bias voltage.

6. The package of claim 1 , wherein:

the PIC further comprises a temperature sensor (TS) electrically coupled with a second modulator input of the modulator and configured to deliver the temperature-dependent bias voltage.

7. The package of claim 1 , wherein:

the PIC further comprises a temperature sensor (TS);

the EIC further comprises a temperature controller (TC) with an input coupled with the TS via the EIC interconnect region, a second metal interconnect, and the PIC interconnect region; and

the EIC further comprises an adder with inputs electrically coupled with outputs of the TC and the DRV and with an output electrically coupled with the first modulator input;

wherein:

the TC is configured to receive a first temperature-dependent signal from the TS and to convert the first temperature-dependent signal to the temperature-dependent bias voltage.

8. The package of claim 7 , wherein the TC converts the first temperature-dependent signal using temperature-linear and/or temperature-nonlinear analog circuits.

9. The package of claim 7 , wherein the TC converts the first temperature-dependent signal using digital circuits to access a memory that stores a temperature profile.

Assignments (2)

Continuity (5)

References Cited (299)

Cited By (14)

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