IP Library Patent Application 60518864
Patent Application Provisional
App. No. 60/518,864 · Confirmation No. 3333

Bump-on-lead flip chip interconnection

Inventor: Rajendra D. Pendse
Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2003-11-10 TRNA Transmittal of New Application 1 View
2003-11-10 SPEC Specification 6 View
2003-11-10 CLM Claims 1 View
2003-11-10 ABST Abstract 1 View
2003-11-10 DRW Drawings-only black and white line drawings 5 View
2003-11-10 ADS Application Data Sheet 3 View
2003-11-10 ARTIFACT Artifact sheet indicating an item has been filed which cannot be scanned 1 View
2003-11-10 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/518,864
Filed
2003-11-10