Semiconductor device
A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.
1. A semiconductor device comprising:
a first redistribution layer;
a first semiconductor die over the first redistribution layer;
a second semiconductor die over the first redistribution layer, the second semiconductor die being separated from the first semiconductor die by an encapsulant;
a second redistribution layer over the first semiconductor die, the second semiconductor die, and the encapsulant;
a first linking device electrically connecting the first semiconductor die to the second semiconductor die through the second redistribution layer; and
a second linking device located on an opposite side of the first redistribution layer than the first semiconductor die.
2. The semiconductor device of claim 1 , further comprising an external connection adjacent to the first linking device.
3. The semiconductor device of claim 2 , wherein the first linking device has a first thickness and the external connection has a second thickness greater than the first thickness.
4. The semiconductor device of claim 3 , wherein the second thickness is about 300 μm.
5. The semiconductor device of claim 4 , wherein the first thickness is about 200 μm.
6. The semiconductor device of claim 2 , further comprising a support substrate connected to the external connection, the first linking device being located between the support substrate and the second redistribution layer.
7. The semiconductor device of claim 1 , further comprising a dielectric material coplanar with the first linking device.
8. The semiconductor device of claim 1 , further comprising:
a first redistribution layer over the first linking device;
first conductive material electrically connecting the first semiconductor die to the first redistribution layer and second conductive material electrically connecting the second semiconductor die to the first redistribution layer; and
external connectors located on an opposite side of the first redistribution layer from the first linking device.
9. A semiconductor device comprising:
a substrate;
a first external connection and a second external connection bonded to the substrate;
a first link device located between the first external connection and the second external connection;
a first redistribution layer in electrical connection with the first external connection, the second external connection, and the first link device;
a first semiconductor device connected to the first link device through the first redistribution layer; and
a second semiconductor device connected to the first link device through the first redistribution layer.
10. The semiconductor device of claim 9 , further comprising a third external connection located between the substrate and the first link device.
11. The semiconductor device of claim 10 , further comprising a through substrate via electrically connected to the third external connection.
12. The semiconductor device of claim 9 , further comprising an encapsulant surrounding the first semiconductor device and the second semiconductor device.
13. The semiconductor device of claim 12 , further comprising a through via extending through the encapsulant.
14. The semiconductor device of claim 13 , wherein the through via is electrically connected to a second link device located on an opposite side of the second semiconductor device than the first link device.
15. The semiconductor device of claim 14 , wherein the second link device comprises active devices.
16. A semiconductor device comprising:
a first semiconductor device attached to a first redistribution layer;
a first linking device attached to the first redistribution layer, the first linking device being separated from the first semiconductor device, wherein the first linking device is located between the first semiconductor device and the first redistribution layer;
an encapsulant on an opposite side of the first redistribution layer from the first semiconductor device;
a first through via extending through the encapsulant and connecting the first redistribution layer to a second redistribution layer, the second redistribution layer being connected to a second semiconductor device embedded within the encapsulant; and
a third semiconductor device bonded to the second redistribution layer.
17. The semiconductor device of claim 16 , a second linking device bonded to the second redistribution layer, the second linking device linking the second semiconductor device to a fourth semiconductor device embedded within the encapsulant, the second linking device being located between the third semiconductor device and the second redistribution layer.
18. The semiconductor device of claim 17 , further comprising electrical connectors connecting the third semiconductor device to the second linking device.
19. The semiconductor device of claim 18 , further comprising through vias extending through the second linking device, the through vias extending through the second linking device being electrically connected to the electrical connectors.
20. The semiconductor device of claim 19 , wherein the third semiconductor device is bonded to the second redistribution layer through solder balls and wherein the solder balls have a thickness that is greater than a thickness of the second link device.