Plasma control method in semiconductor wafer fabrication
A method for processing a semiconductor wafer is provided. The method includes placing a first semiconductor wafer on a wafer chuck in a process chamber. The method further includes adjusting a distance between a gas dispenser positioned above the wafer chuck and an upper edge ring surrounding the wafer chuck. The method also includes producing a plasma for processing the first semiconductor wafer by exciting a gas dispenser from the gas dispenser after the adjustment. In addition, the method includes removing the first semiconductor wafer from the process chamber.
1. A method, comprising:
placing a first semiconductor wafer on a wafer chuck in a process chamber;
producing a first plasma for processing the first semiconductor wafer by exciting a first gas from a gas dispenser, such that a first feature is formed on a central region of the first semiconductor wafer and a second feature is formed on an edge region of the first semiconductor wafer, wherein the central region of the first semiconductor wafer has a circular area, and the edge region of the first semiconductor wafer has a ring area surrounding the central region, and the gas dispenser is positioned above the wafer chuck;
removing the first semiconductor wafer from the process chamber;
placing a second semiconductor wafer into the process chamber;
measuring a first dimension of the first feature, and measuring a second dimension of the second feature;
calculating a first difference between the first dimension of the first feature and a first predetermined dimension through a process control system, and calculating a second difference between the second dimension of the second feature and a second predetermined dimension through the process control system;
determining whether the first difference is acceptable through the process control system, and determining whether the second difference is acceptable through the process control system;
in response to the determination determines that the first difference of the central region of the first semiconductor wafer is not acceptable, adjusting a first vertical distance between the gas dispenser and the wafer chuck;
in response to the determination determines that the second difference of the edge region of the first semiconductor wafer is not acceptable, adjusting a second vertical distance between an upper edge ring surrounding the wafer chuck and the gas dispenser; and
after adjusting the first and second vertical distances, producing a second plasma for processing the second semiconductor wafer by exciting a second gas from the gas dispenser.
2. The method of claim 1 , wherein when an under-etching occurs to the first feature on the central region of the first semiconductor wafer, decreasing the first vertical distance between the gas dispenser and the wafer chuck.
3. The method of claim 1 , wherein when an under-etching occurs to the first feature on the edge region of the first semiconductor wafer, decreasing the second vertical distance between the upper edge ring and the gas dispenser.
4. The method of claim 1 , wherein the adjustment of the second vertical distance between the gas dispenser and the upper edge ring is performed by controlling a height of the upper edge ring with a pin passing through an outer edge ring that is positioned below the upper edge ring and surrounds the wafer chuck.
5. The method of claim 1 , wherein the adjustment of the second vertical distance between the gas dispenser and the upper edge ring is performed by controlling a height of the gas dispenser and a height of the upper edge ring.
6. A method, comprising:
placing a first semiconductor wafer above a top surface of a wafer chuck in a process chamber, wherein the top surface extends in a horizontal direction;
dispensing a processing gas through a gas dispenser, wherein the gas dispenser is positioned above the wafer chuck in a vertical direction;
producing a plasma for processing the first semiconductor wafer by exciting the processing gas, such that a first feature is formed on a central region of the first semiconductor wafer, and a second feature is formed on an edge region of the first semiconductor wafer;
measuring a first dimension of the first feature, measuring a second dimension of the second feature;
calculating a first_difference between the first dimension of the first feature, formed through the process chamber, and a first predetermined dimension through a process control system, and calculating a second difference between the second dimension of the second feature, formed through the process chamber, and a second predetermined dimension through the process control system;
determining whether the first difference is acceptable through the process control system, and determining whether the second difference is acceptable through the process control system;
placing a second semiconductor wafer into the process chamber;
in response to the determination determines that the first difference of the central region of the first semiconductor wafer is not acceptable, controlling a shape of the plasma in the vertical direction by adjusting a first vertical distance between the gas dispenser and the wafer chuck; and
in response to the determination determines that the second difference of the edge region of the first semiconductor wafer is not acceptable, controlling the shape of the plasma in the vertical direction by adjusting a second vertical distance between an upper edge ring surrounding the wafer chuck and the gas dispenser.
7. The method of claim 6 , wherein adjusting the second vertical distance between the upper edge ring and the gas dispenser comprises adjusting a height of the upper edge ring to control a width of the plasma in the horizontal direction.
8. The method of claim 6 , wherein when an under-etching occurs to the second feature, adjusting the second vertical distance between the upper edge ring and the gas dispenser comprises lowering down the gas dispenser to increase a width of the plasma in the horizontal direction.
9. The method of claim 6 , wherein when an under-etching occurs to the first feature, adjusting the first vertical distance between the gas dispenser and the wafer chuck comprises lowering down the gas dispenser to decrease a width of the plasma in the vertical direction.
10. A method, comprising:
placing a first wafer on a wafer chuck in a chamber of a wafer fabricating system, the wafer fabricating system comprising a gas dispenser in the chamber and above the wafer chuck, and an upper edge ring surrounding the wafer chuck;
producing a first plasma between the wafer chuck and the gas dispenser to form a first feature formed on a central region of the first wafer and a second feature formed on an edge region of the first wafer;
removing the first wafer from the chamber;
measuring a first dimension of the first feature, and measuring a second dimension of the second feature;
calculating a first difference between the first dimension of the first feature and a first predetermined dimension through a process control system, calculating a second difference between the second dimension of the second feature and a second predetermined dimension through the process control system;
placing a second wafer on the wafer chuck;
determining whether the first difference is acceptable through the process control system, and determining whether the second difference is acceptable through the process control system;
in response to the determination determines that the first difference of the central region of the first wafer is not acceptable, adjusting a first vertical distance between the gas dispenser and wafer chuck; in response to the determination determines that the second difference of the edge region of the first wafer is not acceptable, adjusting a second vertical distance between the upper edge ring and the gas dispenser; and
after adjusting the first and second vertical distances, producing a second plasma between the wafer chuck and the gas dispenser to form third feature on a central region of the second wafer and a fourth feature on an edge region of the second wafer.
11. The method of claim 10 , wherein adjusting the first vertical distance between the gas dispenser and the wafer chuck comprises:
initiating a vertical movement of the gas dispenser relative to the wafer chuck.
12. The method of claim 10 , wherein adjusting the second vertical distance between the upper edge ring and the gas dispenser comprises:
adjusting a height of the upper edge ring relative to the wafer chuck.
13. The method of claim 10 , wherein the first dimension is a depth of a first recess formed on the central region of the first wafer, and the second dimension is a depth of a second recess formed on the edge region of the first wafer.
14. The method of claim 1 , wherein when an over-etching occurs to the first feature on the central region of the first semiconductor wafer, increasing the first vertical distance between the gas dispenser and the wafer chuck.
15. The method of claim 1 , wherein when an over-etching occurs to the second feature on the edge region of the first semiconductor wafer, increasing the first vertical distance between the upper edge ring and the gas dispenser.
16. The method of claim 6 , wherein the first dimension is a width of a first isolation insulating layer below a first gate structure formed on the central region of the first semiconductor wafer, and the second dimension is a width of a second isolation insulating layer below a second gate structure formed on the edge region of the first semiconductor wafer.
17. The method of claim 6 , wherein the first dimension is a width of an isolation insulating layer below a gate structure formed on the central region of the first semiconductor wafer, and the second dimension is a depth of a recess formed on the edge region of the first semiconductor wafer.
18. The method of claim 6 , wherein the first dimension is a depth of a recess formed on the central region of the first semiconductor wafer, and the second dimension is a width of an isolation insulating layer below a gate structure formed on the edge region of the first semiconductor wafer.
19. The method of claim 10 , wherein the second plasma at a central region of the chamber between the wafer chuck and the gas dispenser has a different plasma density than the first plasma at the central region of the chamber between the wafer chuck and the gas dispenser.
20. The method of claim 10 , wherein the second plasma at an edge region of the chamber between the wafer chuck and the gas dispenser has a different plasma density than the first plasma at the edge region of the chamber between the wafer chuck and the gas dispenser.