Semiconductor device
A semiconductor device having a novel structure is provided. The semiconductor device includes a silicon substrate and a device provided above the silicon substrate. The device includes a transistor and a conductor. The transistor includes a metal oxide in a channel formation region. Conductivity is imparted to the silicon substrate. The conductor is electrically connected to each of a drain of the transistor and the silicon substrate through an opening provided in the device. Heat of the drain of the transistor can be efficiently released through the silicon substrate.
1. A semiconductor device comprising:
a silicon substrate without a transistor; and
a device provided above the silicon substrate,
wherein the device comprises a transistor and a first conductor,
wherein the transistor comprises a metal oxide in a channel formation region,
wherein conductivity is imparted to the silicon substrate,
wherein the first conductor is electrically connected to each of a drain of the transistor and the silicon substrate through openings provided in the device, and
wherein the first conductor is in contact with a top surface of the silicon substrate.
2. The semiconductor device according to claim 1 ,
wherein p-type conductivity is imparted to the silicon substrate.
3. The semiconductor device according to claim 1 ,
wherein the silicon substrate and the device are covered with a resin layer, and
wherein the resin layer is provided in a housing.
4. The semiconductor device according to claim 1 ,
wherein the silicon substrate is provided with a heat sink with an insulating layer therebetween.
5. A semiconductor device comprising:
a silicon substrate without a transistor;
a device provided above the silicon substrate;
a first extraction electrode; and
a second extraction electrode,
wherein the device comprises a transistor and a first conductor,
wherein the transistor comprises a metal oxide in a channel formation region,
wherein conductivity is imparted to the silicon substrate,
wherein the first conductor is electrically connected to each of a drain of the transistor and the silicon substrate through openings provided in the device,
wherein the first conductor is in contact with a top surface of the silicon substrate,
wherein the first extraction electrode is electrically connected to a second conductor connected to a source of the transistor, and
wherein the second extraction electrode is electrically connected to the silicon substrate.
6. The semiconductor device according to claim 5 ,
wherein the first extraction electrode is electrically connected to, through a metal wiring, the second conductor.
7. The semiconductor device according to claim 5 ,
wherein the second extraction electrode is directly connected to the silicon substrate.
8. The semiconductor device according to claim 5 ,
wherein p-type conductivity is imparted to the silicon substrate.
9. The semiconductor device according to claim 5 ,
wherein the silicon substrate and the device are covered with a resin layer, and
wherein the resin layer is provided in a housing.
10. The semiconductor device according to claim 5 ,
wherein the silicon substrate is provided with a heat sink with an insulating layer therebetween.