Method of forming a FET structure by selective deposition of film on source/drain contact
A method for manufacturing a FET semiconductor structure includes providing a substrate comprising at least one source/drain contact of at least one FET, the at least one source/drain contact formed adjacent to a dummy gate of the at least one FET. A TiSi 2 film with C54 structure is selectively deposited directly on and fully covering the at least one source/drain contact relative to a vertical sidewall of a gate spacer between the at least one source/drain contact and the dummy gate. The dummy gate is replaced with a replacement metal gate.
1. A method for manufacturing a FET semiconductor structure, the method comprising:
providing a substrate comprising at least one source/drain contact of at least one FET, the at least one source/drain contact formed adjacent to a dummy gate of the at least one FET;
selectively depositing a TiSi 2 film with C54 structure directly on and fully covering the at least one source/drain contact relative to a vertical sidewall of a gate spacer between the at least one source/drain contact and the dummy gate; and
replacing the dummy gate with a replacement metal gate, wherein the selectively depositing the TiSi 2 film comprises exposing the substrate to a process gas containing a titanium-containing precursor gas and a silicon-containing precursor gas.
2. The method of claim 1 , wherein the selectively depositing the TiSi 2 film is performed before the replacing of the dummy gate with the replacement metal gate.
3. The method of claim 1 , wherein the titanium-containing precursor gas comprises TiCl 4 .
4. The method of claim 1 , wherein the silicon-containing precursor gas comprises at least one of SiH 4 , SiH 2 Cl 2 , SiHCl 3 , and SiCl 4 .
5. The method of claim 1 , wherein the process gas comprises TiCl 4 and SiH 4 .
6. The method of claim 1 , wherein the process gas further comprises H 2 gas.
7. The method of claim 1 , further comprising:
maintaining gas pressure between about 1 mTorr and about 50 mTorr; and
maintaining a substrate temperature between about 700° C. and about 800° C.
8. The method of claim 1 , further comprising depositing, after depositing the TiSi 2 film, an etch stop layer over the at least one source/drain contact, the dummy gate, the gate spacer, and the TiSi 2 film.
9. The method of claim 8 , further comprising depositing a dielectric over the etch stop layer.
10. The method of claim 1 , further comprising cleaning the at least one source/drain contact using a cleaning process prior to the selectively depositing of the TiSi 2 film.
11. The method of claim 10 , wherein the cleaning process comprises exposing the source/drain contact to a thermal H2 gas at a gas pressure between about 100 mTorr and about 700 mTorr, at a substrate temperature between about 600° C. and about 800° C., for a time period between about 10 sec and about 60 sec.
12. The method of claim 10 , wherein the cleaning process comprises exposing the source/drain contact to a thermal NH3 and HF gas at a gas pressure between about 1 Torr and about 3 Torr, at a substrate temperature between about 35° C. and about 100° C., for a time period between about 10 sec and about 60 sec.
13. The method of claim 10 , wherein the cleaning process comprises exposing the source/drain contact to a thermal NF3 and H2 gas at a gas pressure between about 1 Torr and about 3 Torr, at a substrate temperature between about 20° C. and about 100° C., for a time period between about 10 sec and about 60 sec.
14. The method of claim 1 , wherein no anneal step is performed between the selectively depositing and the replacing steps.
15. The method of claim 1 , further comprising an anneal step performed between the selectively depositing and the replacing steps.
16. A method for manufacturing a FET semiconductor structure, the method comprising:
providing a substrate comprising at least one source/drain contact of at least one FET, the at least one source/drain contact formed adjacent to a dummy gate of the at least one FET;
selectively depositing a TiSi 2 film with C54 structure directly on and fully covering the at least one source/drain contact relative to a vertical sidewall of a gate spacer between the at least one source/drain contact and the dummy gate;
replacing the dummy gate with a replacement metal gate; and
cleaning the at least one source/drain contact using a cleaning process prior to the selectively depositing of the TiSi 2 film.
17. The method of claim 16 , where the selectively depositing the TiSi 2 film comprises exposing the substrate to a process gas containing a titanium-containing precursor gas and a silicon-containing precursor gas.
18. The method of claim 16 , wherein the cleaning process comprises exposing the source/drain contact to a thermal H2 gas at a gas pressure between about 100 mTorr and about 700 mTorr, at a substrate temperature between about 600° C. and about 800° C., for a time period between about 10 sec and about 60 sec.
19. The method of claim 16 , wherein the cleaning process comprises exposing the source/drain contact to a thermal NH3 and HF gas at a gas pressure between about 1 Torr and about 3 Torr, at a substrate temperature between about 35° C. and about 100° C., for a time period between about 10 sec and about 60 sec.
20. The method of claim 16 , wherein the cleaning process comprises exposing the source/drain contact to a thermal NF3 and H2 gas at a gas pressure between about 1 Torr and about 3 Torr, at a substrate temperature between about 20° C. and about 100° C., for a time period between about 10 sec and about 60 sec.