Three-dimensional memory device containing dual-depth drain-select-level isolation structures and methods for forming the same
A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory openings vertically extending through the alternating stack, and memory opening fill structures located within a respective one of the memory openings. Composite drain-select-level isolation structures divide each drain-select-level electrically conductive layer into a respective plurality of electrically conductive strips. Each drain-select-level isolation structure includes a respective first drain-select-level isolation material portion vertically extending through each drain-select-level electrically conductive layers and a respective set of second drain-select-level isolation material portions vertically extending through each of the drain-select-level electrically conductive layers and at least a topmost dummy electrically conductive layer that underlies the drain-select-level electrically conductive layers.
1. A three-dimensional memory device, comprising:
an alternating stack of insulating layers and electrically conductive layers that is laterally bounded by a first backside trench fill structure and a second backside trench fill structure, wherein the electrically conductive layers comprise, from bottom to top, word-line-level electrically conductive layers, dummy electrically conductive layers, and drain-select-level electrically conductive layers comprising a respective plurality of drain-select-level electrically conductive strips that are laterally spaced apart by composite drain-select-level isolation structures;
memory openings vertically extending through the alternating stack; and
memory opening fill structures located within a respective one of the memory openings and comprising a respective vertical semiconductor channel and a respective vertical stack of memory elements,
wherein each of the composite drain-select-level isolation structures comprises:
a respective first drain-select-level isolation material portion that vertically extends through each of the drain-select-level electrically conductive layers and has a respective bottom surface above a horizontal plane including a top surface of a topmost dummy electrically conductive layer of the dummy electrically conductive layers; and
a respective set of second drain-select-level isolation material portions vertically extending through each of the drain-select-level electrically conductive layers and through at least the topmost dummy electrically conductive layer; and
wherein at least the topmost dummy electrically conductive layer comprises dummy electrically conductive strips that are laterally separated by the second drain-select-level isolation material portions and that are interconnected to each other through at least one respective electrically conductive connecting portion that underlies the respective first drain-select-level isolation material portion.
2. A three-dimensional memory device, comprising:
an alternating stack of insulating layers and electrically conductive layers that is laterally bounded by a first backside trench fill structure and a second backside trench fill structure, wherein the electrically conductive layers comprise, from bottom to top, word-line-level electrically conductive layers, dummy electrically conductive layers, and drain-select-level electrically conductive layers comprising a respective plurality of drain-select-level electrically conductive strips that are laterally spaced apart by composite drain-select-level isolation structures;
memory openings vertically extending through the alternating stack; and
memory opening fill structures located within a respective one of the memory openings and comprising a respective vertical semiconductor channel and a respective vertical stack of memory elements,
wherein each of the composite drain-select-level isolation structures comprises:
a respective first drain-select-level isolation material portion that vertically extends through each of the drain-select-level electrically conductive layers and has a respective bottom surface above a horizontal plane including a top surface of a topmost dummy electrically conductive layer of the dummy electrically conductive layers; and
a respective set of second drain-select-level isolation material portions vertically extending through each of the drain-select-level electrically conductive layers and through at least the topmost dummy electrically conductive layer; and
wherein:
the memory opening fill structures are located within a memory array region;
the second drain-select-level isolation material portions laterally extend through the memory array region and into a contact region which contains contact via structures that contact a respective one of the electrically conductive layers;
the first drain-select-level isolation material portions are located only in the contact region but not in the memory array region;
in the memory array region, the second drain-select-level isolation material portions only laterally extend straight along the first horizontal direction; and
in the contact region, the second drain-select-level isolation material portions laterally extend partially along the first horizontal direction and partially along a direction which is not parallel to the first horizontal direction.
3. A three-dimensional memory device, comprising:
an alternating stack of insulating layers and electrically conductive layers that is laterally bounded by a first backside trench fill structure and a second backside trench fill structure, wherein the electrically conductive layers comprise, from bottom to top, word-line-level electrically conductive layers, dummy electrically conductive layers, and drain-select-level electrically conductive layers comprising a respective plurality of drain-select-level electrically conductive strips that are laterally spaced apart by composite drain-select-level isolation structures;
memory openings vertically extending through the alternating stack; and
memory opening fill structures located within a respective one of the memory openings and comprising a respective vertical semiconductor channel and a respective vertical stack of memory elements,
wherein each of the composite drain-select-level isolation structures comprises:
a respective first drain-select-level isolation material portion that vertically extends through each of the drain-select-level electrically conductive layers and has a respective bottom surface above a horizontal plane including a top surface of a topmost dummy electrically conductive layer of the dummy electrically conductive layers; and
a respective set of second drain-select-level isolation material portions vertically extending through each of the drain-select-level electrically conductive layers and through at least the topmost dummy electrically conductive layer; and
further comprising a first support pillar structure vertically extending through each of the word-line-level electrically conductive layers and the dummy electrically conductive layers and protruding into one of the first drain-select-level isolation material portions.
4. The three-dimensional memory device of claim 3 , wherein a topmost surface of the first support pillar structure has a convex shape and is located below a horizontal plane including top surfaces of the first drain-select-level isolation material portions and above a horizontal plane including bottom surfaces of the first drain-select-level isolation material portions.
5. The three-dimensional memory device of claim 4 , further comprising a second support pillar structure vertically extending through each of the word-line-level electrically conductive layers and having a top surface located below a horizontal plane including a bottom surface of a topmost dummy electrically conductive layer of the dummy electrically conductive layers.
6. The three-dimensional memory device of claim 5 , wherein a topmost surface of the second support pillar structure contacts one of the second drain-select-level isolation material portions within a horizontal plane including a bottommost surface of the one of the second drain-select-level isolation material portions.
7. The three-dimensional memory device of claim 4 , further comprising a dummy memory opening fill structure that is laterally surrounded by the memory opening fill structures and having a top surface that contacts one of the second drain-select-level isolation material portions within a horizontal plane including a bottommost surface of the one of the second drain-select-level isolation material portions.