Granted Patent B2

US 12,412,865 · App. 17/671,732 · Granted Sep 9, 2025

Inventors: Dominik Zinner (Zell an der Pram, AT); Thomas Wagenleitner (Aurolzmunster, AT); Jurgen Markus Suss (Scharding, AT); Thomas Plach (St. Florian am Inn, AT); Jurgen Mallinger (Senftenbach, AT)

Assignee: EV GROUP E. THALLNER GMBH

H01L24/75H01L21/67092H01L21/67288H01L21/6833H01L21/6838H01L24/83H01L2224/7555H01L2224/75724H01L2224/75725H01L2224/75744H01L2224/75745H01L2224/7592H01L2224/83201H01L2224/83908

Abstract

Claims (27)

1. A device for bonding a first substrate to a second substrate at mutually facing contact surfaces of the first and second substrates, said device comprising:

a first chuck configured to mount the first substrate;

a second chuck configured to mount the second substrate;

a first plate arranged between the second substrate and the second chuck; and

bend-changing means configured to deform the first plate with the second substrate with respect to the second chuck,

wherein the deformation is controlled during bonding of the first substrate to the second substrate,

wherein the second chuck has first limiting elements configured to mechanically fix the first plate in a circumferential region on the first plate, and

wherein a thickness of the first plate is in a range between 0.1 mm and 10 mm.

2. The device according to claim 1 , further comprising a second plate arranged between the first substrate and the first chuck,

wherein the first substrate with the second plate is constructed in a deformable manner with respect to the first chuck for deformation thereof before and/or during the bonding.

3. The device according to claim 2 , wherein the first chuck and/or the second chuck have bending means and/or fluid-pressure loading means for setting and/or controlling the deformations.

4. The device according to claim 2 , wherein the first chuck and/or the second chuck have first fixing means for fixing the first plate and/or second plate.

5. The device according to claim 4 , wherein at least one of the first and second plates has second fixing means connected to the first fixing means of the first and/or second chuck for fixing the first and second substrates.

6. The device according to claim 2 , wherein at least one of the first and second plates has a Young's modulus of between 0.01 GPa and 1100 GPa.

7. The device according to claim 2 , further comprising bend-measuring means configured to detect the deformations.

8. The device according to claim 4 , wherein the first fixing means is annularly arranged.

9. The device according to claim 7 , wherein the bend-measuring means comprises sensors.

10. The device according to claim 9 , where the sensors are distance sensors.

11. The device according to claim 1 , wherein the first plate comprises:

a first plate side fixable on the second chuck using the first fixing means;

a second plate side arranged opposite the first plate side to fix the second substrate on the first plate using a second fixing means; and

at least one fixing-element connection configured to connect the second fixing means to the second chuck.

12. The device according to claim 1 , wherein the first limiting elements mechanically fix the first plate at a region of the first plate that protrudes beyond the second substrate.

13. The device according to claim 1 , wherein the first limiting elements clamp the first plate to the second chuck.

14. The device according to claim 2 , wherein the first chuck has second limiting elements configured to mechanically fix the second plate in a circumferential region on the second plate.

15. The device according to claim 14 , wherein the second limiting elements mechanically fix the second plate at a region of the second plate that protrudes beyond the first substrate.

16. The device according to claim 14 , wherein the second limiting elements clamp the second plate to the first chuck.

Continuity (2)

References Cited (70)