Field effect transistors with reduced gate fringe area and method of making the same
A semiconductor structure includes at least two field effect transistors. A gate strip including a plurality of gate dielectrics and a gate electrode strip can be formed over a plurality of semiconductor active regions. Deep source/drain regions are formed by implanting dopants into semiconductor active regions without implanting the dopants into inter-electrode regions of a shallow trench isolation structure. The gate strip is divided into gate stacks prior to or after formation of the deep source/drain regions.
1. A semiconductor structure, comprising:
first and second field effect transistors, wherein each of the first and second field effect transistors comprises:
a semiconductor active region including a source region, a channel region, and a drain region arranged along a first horizontal direction;
a gate dielectric contacting a top surface of the channel region;
a gate electrode overlying the gate dielectric and comprising a semiconductor gate electrode portion and a gate silicide region; and
a dielectric gate spacer laterally surrounding the gate electrode; and
a shallow trench isolation structure which laterally surrounds each of the semiconductor active regions of the first and second two field effect transistors,
wherein the shallow trench isolation structure comprises two via cavities that are laterally spaced apart along the first horizontal direction; and
the dielectric gate spacers of the first and the second field effect transistors contain downward-protruding portions which fill the two via cavities in the shallow trench isolation structure.
2. The semiconductor structure of claim 1 , wherein the two via cavities are connected by a planar top surface of the shallow trench isolation structure, and are located in an inter-gate region between the gate electrodes of the first and second field effect transistors.
3. The semiconductor structure of claim 1 , wherein each of the first and second field effect transistors comprises:
a source silicide region in contact with a respective source region; and
a drain silicide region in contact with a respective drain region.
4. The semiconductor structure of claim 3 , wherein each of the source silicide regions and the drain silicide regions of the first and second field effect transistors contact a sidewall of a respective one of the dielectric gate spacers.
5. The semiconductor structure of claim 1 , wherein each semiconductor gate electrode portion of the first and second field effect transistors comprises:
a lower semiconductor gate electrode sub-portion contacting a top surface of a respective one of the gate dielectrics; and
an upper semiconductor gate electrode sub-portion that overlies the lower semiconductor gate electrode portion and contacting a respective top surface segment of the shallow trench isolation structure.
6. The semiconductor structure of claim 1 , wherein each inter-gate region of the shallow trench isolation structure comprises:
a pair of topmost horizontal surface segments contacting a respective bottom surface segment of a neighboring pair of gate electrodes; and
an intermediate horizontal surface segment that is adjoined to the topmost horizontal surface segments by a pair of vertical surface segments and located between a respective pair of via cavities.
7. The semiconductor structure of claim 6 , wherein the intermediate horizontal surface segment is located above a planar top surface of the shallow trench isolation structure that connects upper edges of the two cavities.
8. A semiconductor structure comprising:
first and second field effect transistors, wherein each of the first and second field effect transistors comprises:
a semiconductor active region including a source region, a channel region, and a drain region arranged along a first horizontal direction;
a gate dielectric contacting a top surface of the channel region;
a gate electrode overlying the gate dielectric and comprising a semiconductor gate electrode portion and a gate silicide region; and
a pair of dielectric gate spacers located on opposite sides of the gate electrode; and
a shallow trench isolation structure which laterally surrounds each of the semiconductor active regions of the first and second two field effect transistors,
wherein each of the pair of dielectric gate spacers comprises:
over-active-region gate spacer portions overlying the semiconductor active regions; and
inter-active-region gate spacer portions overlying portions of the shallow trench isolation structure and comprising stepped sidewalls.
9. The semiconductor structure of claim 8 , wherein each of the stepped sidewalls includes:
a lower straight sidewall segment adjoined to a respective pair of straight inner sidewalls;
an upper straight sidewall segment that is laterally offset from the lower straight sidewall segment; and
a connecting surface that is adjoined to a top edge of the lower straight sidewall segment and to a bottom edge of the upper straight sidewall segment.
10. The semiconductor structure of claim 9 , wherein:
the shallow trench isolation structure has a planar top surface located in a horizontal plane and within areas that are not covered by the gate electrodes; and
the lower straight sidewall segments contact the planar top surface of the shallow trench isolation structure.
11. The semiconductor structure of claim 8 , wherein the over-active-region gate spacer portions comprise straight inner sidewalls that are perpendicular to the first horizontal direction.
12. The semiconductor structure of claim 11 , wherein the straight inner sidewalls vertically extend at least from a first horizontal plane including bottom surfaces of the gate electrodes and at least to a second horizontal plane including top surfaces of the gate electrodes.
13. The semiconductor structure of claim 8 , wherein each of the first and second field effect transistors comprises:
a source silicide region in contact with a respective source region; and
a drain silicide region in contact with a respective drain region.
14. The semiconductor structure of claim 13 , wherein each of the source silicide regions and the drain silicide regions of the first and second field effect transistors contact a sidewall of a respective one of the pair of dielectric gate spacers.
15. The semiconductor structure of claim 8 , wherein:
the shallow trench isolation structure comprises inter-gate regions located between a neighboring pair of semiconductor active regions and within an area enclosed by an outer periphery of the pair of dielectric gate spacers; and
a pair of inter-active-region gate spacer portions among the inter-active-region gate spacer portions overlies each of the inter-gate regions.
16. A method of forming a semiconductor device, comprising:
forming a shallow trench isolation structure in an upper region of a semiconductor substrate that has a doping of a first conductivity type, wherein the shallow trench isolation structure laterally surrounds a plurality of semiconductor active regions that are patterned portions of the semiconductor substrate;
forming a gate strip comprising a vertical stack of a plurality of gate dielectrics and a gate electrode strip over the plurality of semiconductor active regions, wherein the gate strip continuously extends as a single continuous structure over each of the plurality of semiconductor active regions and covers inter-electrode regions of the shallow trench isolation structure;
forming source/drain extension regions by implanting dopants of a second conductivity type into surface portions of the plurality of semiconductor active regions that are not masked by the gate strip after formation of the gate strip;
forming deep source/drain regions by implanting additional dopants of the second conductivity type into portions of the plurality of semiconductor active regions without implanting the additional dopants of the second conductivity type into the inter-electrode regions of the shallow trench isolation structure; and
dividing the gate strip into the gate stacks by removing portions of the gate strip that are overlie the inter-electrode regions of the shallow trench isolation structure after forming the source/drain extension regions and prior to or after forming the deep source/drain regions.
17. The method of claim 16 , wherein the portions of the gate strip that are overlie the inter-electrode regions of the shallow trench isolation structure are removed prior to forming the deep source/drain regions.
18. The method of claim 17 , further comprising forming dielectric gate spacers around the gate electrodes and over the inter-electrode regions of the shallow trench isolation structure, wherein the dielectric gate spacers prevent implantation of the additional dopants of the second conductivity type into the inter-electrode regions of the shallow trench isolation structure.
19. The method of claim 16 , wherein the portions of the gate strip that are overlie the inter-electrode regions of the shallow trench isolation structure are removed after forming the deep source/drain regions.
20. The method of claim 16 , wherein:
each of the gate stacks comprises a respective gate dielectric and a respective semiconductor gate electrode portion; and
the method further comprises converting a surface portion of each of the semiconductor gate electrode portions into a respective gate silicide region by reacting the surface portion of each of the semiconductor gate electrode portions with a metal.