Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact
Semiconductor devices with a conformal coating in contact with a ground plane at a bottom side of the semiconductor devices and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a first surface of a package substrate. The semiconductor device can also include a molded material covering at least a portion of the package substrate and the semiconductor die. The semiconductor device can also include a ground plane in the package substrate and exposed through an opening in a second surface of the package substrate opposite the first surface. The semiconductor device can also include a conformal coating coupled to the ground plane through the opening that can shield the semiconductor device from electromagnetic interference.
1 . A method of manufacturing a semiconductor device, the method comprising:
forming a package substrate, the package substrate including a first surface having a die attach area, a second surface opposite the first surface, an opening in the second surface, and a ground plane positioned between the first surface and the second surface, the ground plane including a bottom surface facing the second surface and exposed through the opening and the second surface; and
applying a conformal coating over the package substrate such that (a) the conformal coating is positioned over a side of the first surface of the package substrate opposite the second surface and (b) the conformal coating extends along a side of the package substrate from the first surface to the opening in the second surface of the package substrate where a portion of the conformal coating is electrically connected to the ground plane through the opening in the second surface of the package substrate.
2 . The method of claim 1 , further comprising, before applying the conformal coating, applying a solder mask over the second surface of the package substrate and etching the solder mask to expose the bottom surface of the ground plane through the package substrate, the opening, and the solder mask.
3 . The method of claim 2 , wherein the etching of the solder mask includes forming the opening by removing a portion of the solder mask and a portion of the package substrate, and wherein the portion of the solder mask and the portion of the package substrate extend around at least part of a perimeter of the package substrate.
4 . The method of claim 2 , wherein applying the conformal coating includes applying the conformal coating before removing the solder mask from over the package substrate.
5 . The method of claim 2 , further comprising removing the solder mask from over the package substrate before applying the conformal coating.
6 . The method of claim 1 , wherein:
the method further comprises forming a molded material over at least a portion of the first surface of the package substrate; and
applying the conformal coating includes applying the conformal coating over (i) a top surface of the molded material opposite a surface of the molded material that contacts the first surface of the package substrate and (ii) a plurality of side surfaces of the molded material and the package substrate.
7 . The method of claim 1 , further comprising forming a trace in the package substrate extending from the bottom surface of the ground plane to the second surface of the package substrate, wherein the portion of the conformal coating contacts the trace at the second surface of the package substrate.
8 . The method of claim 2 , wherein the etching of the solder mask includes forming the opening by removing a portion of the solder mask and a portion of the package substrate, and wherein the portion of the solder mask and the portion of the package substrate extend around an entirety of a perimeter of the package substrate.
9 . The method of claim 2 , wherein the etching of the solder mask includes forming the opening by removing a portion of the solder mask and a portion of the package substrate such that the opening is a trench or moat formed in the solder mask and the package substrate.
10 . The method of claim 9 , wherein applying the conformal coating includes applying the conformal coating over the package substrate such that the conformal coating envelopes part of the solder mask positioned over the second surface of the package substrate between the side of the package substrate and the opening.
11 . A method of manufacturing a semiconductor device, the method comprising:
forming a package substrate using a plurality of substrates and/or dielectric materials, and wherein forming the package substrate includes:
positioning a ground plane between (i) a first surface of a first substrate and/or dielectric material of the plurality and (ii) a second surface of a second substrate and/or dielectric material of the plurality; and
exposing a bottom surface of the ground plane that faces the second surface via an opening formed in the package substrate at the second surface,
wherein:
the first surface is a topmost surface of the package substrate relative to all other substrates and/or dielectric materials of the plurality, is located at a first side of the package substrate, and includes a die attach area, and
the second surface is a bottommost surface of the package substrate relative to all other substrates and/or dielectric materials of the plurality and is located at a second side of the package substrate opposite the first side.
12 . The method of claim 11 , wherein positioning the ground plane between the first surface and the second surface includes positioning the ground plane between the first surface and the second surface such that the bottom surface of the ground plane is embedded within the package substrate a non-zero depth into the package substrate from the second surface.
13 . The method of claim 11 , further comprising forming a conductive trace extending from the bottom surface of the ground plane to the second surface.
14 . The method of claim 11 , further comprising forming the opening in the package substrate.
15 . The method of claim 14 , wherein forming the opening includes applying a solder mask over the second surface of the package substrate and etching the solder mask and the package substrate.
16 . The method of claim 14 , wherein forming the opening includes forming the opening about at least part of a perimeter of the package substrate.
17 . The method of claim 14 , wherein forming the opening includes forming a trench or moat in at least the second substrate and/or dielectric material.
18 . A method of manufacturing a semiconductor device, the method comprising:
forming a package substrate, the package substrate including a first surface, a second surface opposite the first surface, a ground plane positioned between the first surface and the second surface, and an opening at the second surface, wherein the ground plane includes a bottommost surface that faces the second surface and that is exposed via the opening; and
applying a conformal coating over the package substrate such that the conformal coating (i) extends along a side of the package substrate from the first surface to the second surface of the package substrate, (ii) wraps around the package substrate from the side of the package substrate to the opening in the second surface, and (iii) is electrically connected to the bottommost surface of the ground plane through the opening.
19 . The method of claim 18 , further comprising, before applying the conformal coating, applying a solder mask over the second surface of the package substrate and etching the solder mask to form the opening and expose the bottommost surface of the ground plane through second surface of the package substrate.
20 . The method of claim 19 , wherein etching the solder mask to form the opening includes removing a portion of the solder mask and a portion of the package substrate, and wherein the portion of the solder mask and the portion of the package substrate extend around at least part of a perimeter of the package substrate.