Semiconductor device
The semiconductor device includes a semiconductor layer which has a main surface, a switching device which is formed in the semiconductor layer, a first electrode which is arranged on the main surface and electrically connected to the switching device, a second electrode which is arranged on the main surface at an interval from the first electrode and electrically connected to the switching device, a first terminal electrode which has a portion that overlaps the first electrode in plan view and a portion that overlaps the second electrode and is electrically connected to the first electrode, and a second terminal electrode which has a portion that overlaps the second electrode in plan view and is electrically connected to the second electrode.
1 . A manufacturing method for a semiconductor device, the method comprising:
a step of preparing a semiconductor layer that has a main surface, and that has an active region and a non-active region provided around the active region;
a step of forming an FET structure that has a gate electrode, a source region or an emitter region, and a drain region or a collector region in the active region;
a step of forming a first insulating layer that has contact holes in the active region;
a step of forming a first metal film that has a portion embedded in the contact hole, on the first insulating layer;
a step of forming a first main surface electrode that is electrically connected to the gate electrode of the FET structure, and forming a second main surface electrode that is electrically connected to the source region or the emitter region of the FET structure, by removing a part of the first metal film;
a step of forming a second insulating layer that covers a part of the first main surface electrode and a part of the second main surface electrode, on the first insulating layer;
a step of forming a second metal film on the second insulating layer, the first main surface electrode and the second main surface electrode that are exposed from the second insulating layer;
a step of forming a first pad that overlaps the second main surface electrode as viewed in plan and is electrically connected to the first main surface electrode, and forming a second pad that overlaps the second main surface electrode as viewed in plan and is electrically connected to the second main surface electrode, by removing a part of the second metal film;
a step of forming a third insulating layer on the first pad, the second pad, and the second insulating layer; and
a step of exposing a part of the first pad and a part of the second pad, by removing a part of the third insulating layer, wherein
the second pad includes a first portion which rides on the second insulating layer and a second portion other than the first portion, and
an upper surface of the second portion of the second pad is placed lower than an upper surface of the part of the first pad which is exposed from the third insulating layer.
2 . The manufacturing method for the semiconductor device according to claim 1 , further comprising:
a step of forming an end insulating layer that covers the non-active region.
3 . The manufacturing method for the semiconductor device according to claim 2 , wherein the step of forming the third insulating layer includes a step of forming the third insulating layer so as to cover the end insulating layer formed in the non-active region.
4 . The manufacturing method for the semiconductor device according to claim 2 , wherein the step of forming the end insulating layer is performed simultaneously with the step of forming the second insulating layer.
5 . The manufacturing method for the semiconductor device according to claim 1 , further comprising:
a step of forming an end insulating layer that covers the non-active region, wherein
the step of forming the first insulating layer includes a step of forming the first insulating layer in the non-active region,
the step of forming the end insulating layer includes a step of forming the end insulating layer so as to cover the first insulating layer formed in the non-active region, and
the step of forming the third insulating layer includes a step of forming the third insulating layer so as to cover the end insulating layer formed in the non-active region.
6 . The manufacturing method for the semiconductor device according to claim 1 , wherein the step of forming the first metal film on the first insulating layer includes:
a step of embedding tungsten in the contact holes, and
a step of forming an aluminum-based metal material on the first insulating layer and the tungsten.
7 . The manufacturing method for the semiconductor device according to claim 6 , wherein the step of embedding the tungsten in the contact holes includes a step of embedding the tungsten via a barrier film made of titanium or titanium nitride.
8 . The manufacturing method for the semiconductor device according to claim 1 , further comprising:
a step of forming a plating layer on the upper surface of the second pad that is exposed from the third insulating layer.
9 . The manufacturing method for the semiconductor device according to claim 8 , wherein the plating layer includes a first metal layer including nickel as a main component.
10 . The manufacturing method for the semiconductor device according to claim 8 , wherein the plating layer includes a first metal layer including nickel as a main component and a second metal layer made of palladium formed on the first metal layer.
11 . The manufacturing method for the semiconductor device according to claim 8 , further comprising:
a step of bonding a metal plate on the plating layer via a bonding material.
12 . The manufacturing method for the semiconductor device according to claim 1 , wherein
the step of forming the second insulating layer includes a step of forming the second insulating layer so as to have a through hole that selectively exposes a part of the first main surface electrode, and
the first pad is electrically connected to the first main surface electrode via the through hole.
13 . The manufacturing method for the semiconductor device according to claim 12 , further comprising:
a step of bonding a bonding wire to the first pad so as not to overlap the through hole as viewed in plan.
14 . The manufacturing method for the semiconductor device according to claim 1 , wherein the step of preparing the semiconductor layer includes a step of preparing the semiconductor layer made of SiC.
15 . The manufacturing method for the semiconductor device according to claim 1 , wherein
the FET structure includes the gate electrode, the source region, and the drain region,
the first main surface electrode is a main surface gate electrode,
the second main surface electrode is a main surface source electrode,
the first pad is a gate pad, and
the second pad is a source pad.