IP Library › Granted Patent US 12,660,554
Granted Patent B2
US 12,660,554 · App. 17/317,684 · Granted Jun 16, 2026

Lamp heating module for an epitaxy process chamber

Inventors: Tetsuya Ishikawa (San Jose, CA); Swaminathan T. Srinivasan (Pleasanton, CA); Matthias Bauer (Sunnyvale, CA); Ala Moradian (Sunnyvale, CA); Manjunath Subbanna (Bangalore, IN); Kartik Bhupendra Shah (Saratoga, CA); Kostiantyn Achkasov (Bernin, FR); Errol Antonio C. Sanchez (Tracy, CA); Michael R. Rice (Pleasanton, CA); Marc Shull (San Jose, CA); Ji-Dih Hu (San Jose, CA)
Assignee: Applied Materials, Inc.
H10P72/0602C23C16/4411C23C16/4412C23C16/482H10D48/044
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Quick Facts
Patent No.
US 12,660,554
App. No.
17/317,684
Granted
Jun 16, 2026
Kind
B2
Abstract

The present disclosure generally relates to an epitaxial chamber for processing of semiconductor substrates. In one example, the epitaxial chamber has a chamber body assembly. The chamber body assembly includes a lower window and an upper window, wherein chamber body assembly, the lower window and the upper window enclose an internal volume. A susceptor assembly is disposed in the internal volume. The epitaxial chamber also has a plurality of temperature control elements. The plurality of temperature control elements include one or more of an upper lamp module, a lower lamp module, an upper heater, a lower heater, or a heated gas passage.

Claims (38)

1 . An epitaxial chamber comprising:

a chamber body assembly;

a lower window;

an upper window, wherein chamber body assembly, wherein the lower window and the upper window enclose an internal volume;

a susceptor assembly disposed in the internal volume; and

a plurality of temperature control elements comprising:

an upper lamp module comprising:

an upper module body with a top surface and a bottom surface;

a central axis;

a plurality of lamp apertures disposed from the bottom surface of the upper lamp module towards the top surface of the upper lamp module, the plurality of lamp apertures arranged in a first zone and a second zone, said first zone and said second zone are concentric, said second zone circumscribing the first zone and said second zone located further from the central axis than the first zone, the plurality of lamp apertures comprising:

a lamp base support;

a bulb opening at the bottom surface of the upper lamp module; and an axis of each lamp aperture defined by a centerline through the lamp base support and the bulb opening of each lamp aperture and disposed at an angle to the central axis, wherein a first angle to the central axis of a first axis of a first lamp aperture is not equal to a second angle to the central axis of a second axis of a second lamp aperture, and wherein the axis of each lamp aperture is configured to orient a bulb of each lamp aperture of the upper lamp module at an angle greater than 0 degrees and less than about 45 degrees with respect to the central axis, and that the axis of each lamp aperture in the second zone further from the central axis is at an angle greater than the axis of each lamp aperture in the first zone closer to the central axis;

wherein the top surface of the upper lamp module comprises:

a raised portion of the top surface of the upper lamp module disposed radially outward of the central axis and raised relative to an outer portion of the top surface in a vertical direction;

said outer portion located further from the central axis than the raised portion in a horizontal direction;

wherein the lamp apertures are disposed through the outer portion of the top surface of the upper lamp module and a heated gas passage extending from the top surface to the bottom surface of the upper module body in the vertical direction; said heated gas passage is disposed through the center of the upper module body; and the plurality of temperature control elements further comprising:

a lower lamp module comprising:

a lower module body with a top surface and a bottom surface;

the central axis;

a plurality of lamp apertures disposed from the bottom surface of the lower lamp module towards the top surface of the lower lamp module;

a plurality of lamp apertures comprising:

a lamp base support; and

a bulb opening at the bottom surface of the lower lamp module, wherein each lamp aperture is configured to orient a bulb of each lamp aperture of the lower lamp module at an angle between greater than 0 degrees with respect to the central axis and 45 degrees from the center axis.

2 . The epitaxial chamber of claim 1 , further comprising:

an upper liner disposed inside of the internal volume and adjacent to an inject ring; and

a lower liner disposed inside of the internal volume and adjacent to a base ring.

3 . The epitaxial chamber of claims 2 , wherein the plurality of temperature control elements further comprises:

a lower heater is disposed between the lower liner and the base ring.

4 . The epitaxial chamber of claim 1 , wherein the plurality of lamp apertures are disposed in three distinct zones, each zone comprising 5 to 10 lamp apertures.

5 . The epitaxial chamber of claim 1 further comprising:

a dome heater coupled to the heated gas passage and configured to supply hot air into a plenum bounded in between the upper lamp module and the upper window.

6 . The epitaxial chamber of claim 5 wherein the chamber body assembly further comprises:

a base ring;

an inject ring disposed on top of the base ring;

an upper heater disposed between an inner periphery of the inject ring and an outer periphery of an upper liner; and

a lower heater disposed between a lower liner and the base ring.

7 . The epitaxial chamber of claim 1 , wherein the top surface of the upper lamp module comprises:

the lamp apertures of the upper lamp module disposed through the outer portion of the top surface of the upper lamp module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: ISHIKAWA, TETSUYA; SRINIVASAN, SWAMINATHAN T.; BAUER, MATTHIAS; MORADIAN, ALA; SUBBANNA, MANJUNATH; SHAH, KARTIK BHUPENDRA; ACHKASOV, KOSTIANTYN; SANCHEZ, ERROL ANTONIO C.; RICE, MICHAEL R.; SHULL, MARC; HU, JI-DIH
To: APPLIED MATERIALS, INC.
Reel/Frame 057358/0939 →
Continuity (1)
Related Publication 20220367216A1 · Nov 17, 2022
References Cited (87)
US 3761678A · Eckles · 1973 [cited by examiner]
US 3984726A · Ramler · 1976 [cited by examiner]
US 4766091A · Ohtoshi · 1988 [cited by examiner]
US 5156820A · Wong et al. · 1992 [cited by applicant]
US 5970214A · Gat · 1999 [cited by examiner]
US 6301434B1 · McDiarmid et al. · 2001 [cited by applicant]
US 7410268B2 · Koren · 2008 [cited by examiner]
US 8183132B2 · Nijhawan et al. · 2012 [cited by applicant]
US 8491720B2 · Ishikawa et al. · 2013 [cited by applicant]
US 8568529B2 · Ishikawa et al. · 2013 [cited by applicant]
US 9929027B2 · Ranish et al. · 2018 [cited by applicant]
US 9960059B2 · Lin · 2018 [cited by examiner]
US 10145011B2 · Abedijaberi et al. · 2018 [cited by applicant]
US 10202707B2 · Ranish · 2019 [cited by examiner]
US 12060651B2 · Ishikawa · 2024 [cited by examiner]
US 12091749B2 · Ishikawa · 2024 [cited by examiner]
US 20030219981A1 · Ammon et al. · 2003 [cited by applicant]
US 20050103261A1 · Von Ammon et al. · 2005 [cited by applicant]
US 20070087533A1 · Nishikawa et al. · 2007 [cited by applicant]
US 20080017116A1 · Campbell et al. · 2008 [cited by applicant]
US 20080187299A1 · Shimizu et al. · 2008 [cited by applicant]
US 20100018960A1 · Gat · 2010 [cited by examiner]
US 20100092697A1 · Poppe et al. · 2010 [cited by applicant]
US 20100092698A1 · Poppe et al. · 2010 [cited by applicant]
US 20100215872A1 · Sivaramakrishnan et al. · 2010 [cited by applicant]
US 20100258049A1 · Ishikawa et al. · 2010 [cited by applicant]
US 20100258052A1 · Ishikawa et al. · 2010 [cited by applicant]
US 20100261340A1 · Nijhawan et al. · 2010 [cited by applicant]
US 20100263587A1 · Sivaramakrishnan et al. · 2010 [cited by applicant]
US 20120088356A1 · Santhanam et al. · 2012 [cited by applicant]
US 20130256292A1 · Lin · 2013 [cited by examiner]
US 20140137801A1 · Lau et al. · 2014 [cited by applicant]
US 20140199056A1 · Chang et al. · 2014 [cited by applicant]
US 20140273410A1 · Abedijaberi et al. · 2014 [cited by applicant]
US 20140322897A1 · Samir et al. · 2014 [cited by applicant]
US 20150096973A1 · Dunn et al. · 2015 [cited by applicant]
US 20150147053A1 · Ranish · 2015 [cited by examiner]
US 20150340257A1 · Brillhart · 2015 [cited by examiner]
US 20160056059A1 · Sun et al. · 2016 [cited by applicant]
US 20160289830A1 · Abedijaberi · 2016 [cited by examiner]
US 20160348240A1 · Burrows · 2016 [cited by examiner]
US 20170103907A1 · Chu · 2017 [cited by examiner]
US 20180005856A1 · Chang et al. · 2018 [cited by applicant]
US 20180023214A1 · Lau · 2018 [cited by examiner]
US 20180095480A1 · Bauer · 2018 [cited by examiner]
US 20180209043A1 · Lau et al. · 2018 [cited by applicant]
US 20180240666A1 · Wong et al. · 2018 [cited by applicant]
US 20190067006A1 · Hawrylchak · 2019 [cited by examiner]
US 20190110336A1 · Cong et al. · 2019 [cited by applicant]
US 20200045776A1 · Huang · 2020 [cited by examiner]
US 20200071832A1 · Lau et al. · 2020 [cited by applicant]
US 20200091010A1 · Li et al. · 2020 [cited by applicant]
US 20200105554A1 · Hu et al. · 2020 [cited by applicant]
US 20200385866A1 · Srinivasan et al. · 2020 [cited by applicant]
US 20210013055A1 · Schaller et al. · 2021 [cited by applicant]
US 20210189593A1 · Burrows et al. · 2021 [cited by applicant]
US 20220364229A1 · Ishikawa · 2022 [cited by examiner]
US 20220364231A1 · Ishikawa · 2022 [cited by examiner]
US 20220364261A1 · Ishikawa · 2022 [cited by examiner]
US 20220367216A1 · Ishikawa · 2022 [cited by examiner]
US 20240209544A1 · Ishikawa · 2024 [cited by examiner]
US 20250246461A1 · Ishikawa · 2025 [cited by examiner]
CN 103088415A · 2013 [cited by applicant]
JP 2001520456A · 2001 [cited by applicant]
JP 2009510262A · 2009 [cited by applicant]
JP 2015522939A · 2015 [cited by applicant]
JP 2016111291A · 2016 [cited by applicant]
JP 2016526279A · 2016 [cited by applicant]
JP 2016526297A · 2016 [cited by applicant]
JP 2016530710A · 2016 [cited by applicant]
JP 2017521874A · 2017 [cited by applicant]
JP 2018170514A · 2018 [cited by applicant]
JP 2019009453A · 2019 [cited by applicant]
JP 2019114699A · 2019 [cited by applicant]
KR 1020160119791A · 2016 [cited by applicant]
WO 2018042877A1 · 2018 [cited by applicant]
International Search Report and Written Opinion for International Application No. PCT/US2022/025540 dated Aug. 4, 2022. [cited by applicant]
International Search Report and Written Opinion dated Aug. 4, 2022 for Application No. PCT/US2022/025772. [cited by applicant]
International Search Report and Written Opinion for PCT/US2022/026071 dated Aug. 10, 2022. [cited by applicant]
Office Action for Japanese Application No. 2023-543348 dated Jul. 30, 2024. [cited by applicant]
Office Action for Japanese Application No. 2023-543392 dated Aug. 6, 2024. [cited by applicant]
Japanese Office Aciton for Application No. 2023-543395 dated Aug. 6, 2024. [cited by applicant]
Korean Office Action for Application No. 10-2023-7024873 dated Jun. 20, 2024. [cited by applicant]
Japanese Office Action for Application No. 2023-543395 dated Feb. 25, 2025. [cited by applicant]
European Search Report for Application No. 22808027.1 dated Jun. 20, 2025. [cited by applicant]
Taiwanese Office Action for Application No. 111116929 dated Feb. 26, 2026. [cited by applicant]
Office Action from South Korean Patent Application No. 10-2025-7014737 dated Mar. 24, 2026. [cited by applicant]