Magnetic tunnel junction with dual reference layers having parallel magnetization directions and methods for operating the same
A magnetoresistive memory cell includes a first electrode; a second electrode; and a layer stack located between the first electrode and the second electrode and comprising, from one end to another, a first reference layer, a first tunnel barrier layer, a free layer, a second tunnel barrier layer, and a second reference layer. A first one of the first reference layer and the second reference layer comprises a positive spin polarization material. A second one of the first reference layer and the second reference layer comprises a negative spin polarization material. A magnetization direction of the second reference layer is parallel to a magnetization direction of the first reference layer.
1 . A device comprising a magnetoresistive memory cell which comprises:
a first electrode;
a second electrode; and
a layer stack located between the first electrode and the second electrode and comprising, from one end to another, a first reference layer, a first tunnel barrier layer, a free layer, a second tunnel barrier layer, and a second reference layer,
wherein:
a first one of the first reference layer and the second reference layer comprises a positive spin polarization material, wherein the positive spin polarization material causes a spin direction of electrons passing through the positive spin polarization material to align along a magnetization direction of the positive spin polarization material;
a second one of the first reference layer and the second reference layer comprises a negative spin polarization material, wherein the negative spin polarization material causes a spin direction of electrons passing through the negative spin polarization material to align along an opposite direction of a magnetization direction of the negative spin polarization material; and
a magnetization direction of the second reference layer is parallel to a magnetization direction of the first reference layer.
2 . The device of claim 1 , wherein the device comprises a spin transfer torque (STT) magnetoresistive random memory (MRAM) array comprising a plurality of dual magnetic tunnel junction STT-MRAM memory cells.
3 . The device of claim 1 , wherein the magnetoresistive memory cell further comprises a first magnetic polarizer layer located between the first electrode and the first reference layer.
4 . The device of claim 3 , further comprising a first antiferromagnetic coupling layer is located between the first magnetic polarizer layer and the first reference layer.
5 . The device of claim 4 , wherein the first magnetic polarizer layer has a magnetization direction that is antiparallel to the magnetization direction of the first reference layer.
6 . The device of claim 4 , wherein the first magnetic polarizer layer comprises a hard magnetization layer or a ferromagnetic multilayer structure including a superlattice, an exchange-bias-inducing antiferromagnetic layer, or a stack of at least one ferromagnetic material layer and at least one antiferromagnetic layer.
7 . The device of claim 4 , wherein the magnetoresistive memory cell further comprises a second magnetic polarizer layer located between the second electrode and the second reference layer.
8 . The device of claim 7 , further comprising a second antiferromagnetic coupling layer is located between the second magnetic polarizer layer and the second reference layer.
9 . The device of claim 7 , wherein:
the second magnetic polarizer layer has a magnetization direction that is antiparallel to the magnetization direction of the second reference layer; and
the magnetization direction of the first magnetic polarizer layer is parallel to the magnetization direction of the second magnetic polarizer layer.
10 . The device of claim 1 , wherein:
the first tunnel barrier layer is in contact with a first surface of the free layer and with a surface of the first reference layer; and
the second tunnel barrier layer is in contact with a second surface of the free layer and with a surface of the second reference layer.
11 . The device of claim 1 , wherein:
the second reference layer overlies the first reference layer;
the first reference layer comprises the positive spin polarization material; and
the second reference layer comprises the negative spin polarization material.
12 . The device of claim 1 , wherein:
the second reference layer overlies the first reference layer;
the first reference layer comprises the negative spin polarization material; and
the second reference layer comprises the positive spin polarization material.
13 . The device of claim 1 , wherein:
the positive spin polarization material comprises Fe, Co, Ni or an alloy thereof; and
the negative spin polarization material comprises Fe 1-x Cr x where x<0.7, a Mn 2 VGa Heusler alloy, Fe 4 N or SrRuO 3 .
14 . The device of claim 1 , wherein:
the layer stack is a vertical stack in which the first reference layer, the first tunnel barrier layer, the free layer, the second tunnel barrier layer, the second reference layer are arranged along a vertical direction; and
the layer stack is located over a support.
15 . A method of operating a spin transfer torque (STT) magnetoresistive random memory (MRAM) device, comprising:
providing a magnetoresistive memory cell which comprises a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode and comprising, from one end to another, a first reference layer, a first tunnel barrier layer, a free layer, a second tunnel barrier layer, a second reference layer, wherein the first reference layer and the second reference layer have magnetization directions that are parallel to each other, and wherein a first one of the first reference layer and the second reference layer comprises a positive spin polarization material, wherein the positive spin polarization material causes a spin direction of electrons passing through the positive spin polarization material to align along a magnetization direction of the positive spin polarization material, and a second one of the first reference layer and the second reference layer comprises a negative spin polarization material, wherein the negative spin polarization material causes a spin direction of electrons passing through the negative spin polarization material to align along an opposite direction of a magnetization direction of the negative spin polarization material;
applying a read bias across the first electrode and the second electrode while the magnetization directions of the first reference layer and the second reference layer are parallel to each other; and
determining a magnetization direction of the free layer relative to the magnetization directions of the first reference layer and the second reference layer based on a magnitude of electrical current that flows through the layer stack under the read bias.
16 . The method of claim 15 , further comprising programming the magnetoresistive memory cell into a parallel state in which the magnetization direction of the free layer is parallel to the magnetization directions of the first reference layer and the second reference layer by flowing a programming electrical current through the free layer while the magnetization directions of the first reference layer and the second reference layer are parallel to each other.
17 . The method of claim 15 , further comprising programming the magnetoresistive memory cell into an antiparallel state in which the magnetization direction of the free layer is antiparallel to the magnetization directions of the first reference layer and the second reference layer by flowing a programming electrical current through the free layer while the magnetization directions of the first reference layer and the second reference layer are parallel to each other, wherein the magnetoresistive memory cell stores binary data only in the parallel state and the antiparallel state.
18 . The method of claim 15 , wherein:
the positive spin polarization material comprises Fe, Co, Ni or an alloy thereof; and
the negative spin polarization material comprises Fe 1-x Cr x where x<0.7, a Mn 2 VGa Heusler alloy, Fe 4 N or SrRuO 3 .
19 . The method of claim 15 , wherein the magnetoresistive memory cell further comprises:
a first magnetic polarizer layer located between the first electrode and the first reference layer;
a first antiferromagnetic coupling layer is located between the first magnetic polarizer layer and the first reference layer;
a second magnetic polarizer layer located between the second electrode and the second reference layer; and
a second antiferromagnetic coupling layer is located between the second magnetic polarizer layer and the second reference layer.
20 . The device of claim 1 , wherein the magnetoresistive memory cell is configured to store binary data by being in one of only two stable data states consisting of:
a parallel state in which the magnetization direction of the free layer is parallel to the magnetization directions of the first and second reference layers; and
an antiparallel state in which the magnetization direction of the free layer is antiparallel to the magnetization directions of the first and second reference layers.