Systems and methods for an interlocking feature on a power module
A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.
1 . A system comprising:
a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and
at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink,
wherein the first interlocking feature includes a height greater than a depth of the second interlocking feature to a form a uniform gap between the first surface of the power module and the surface of the at least one heat sink;
wherein the surface of the at least one heat sink includes a layer of thermal interface material,
wherein ideal locations for both the first interlocking feature and the second interlocking feature are determined by conducting finite element analysis, and
wherein the thermal interface material includes a pattern including a dot, serpentine, or spiral.
2 . The system of claim 1 , wherein the power module includes the second interlocking feature on a second surface of the power module, wherein the second surface is separated from the first surface by a width of the power module.
3 . The system of claim 1 , wherein the first interlocking feature is a protruding interlocking feature.
4 . The system of claim 1 , wherein the second interlocking feature is a recessed interlocking feature.
5 . The system of claim 4 , wherein the recessed interlocking feature is a blind cavity.
6 . The system of claim 1 , wherein the layer of thermal interface material includes thermal tapes, gels, thermal epoxies, solders, grease, gap-filled pads, and phase change materials.
7 . The system of claim 2 , wherein the first surface and second surface include an epoxy mold compound or a copper layer.
8 . The system of claim 7 , wherein the first interlocking feature is located on either the epoxy mold compound or the copper layer.
9 . The system of claim 1 , wherein the at least one heat sink includes an inlet port or an outlet port.
10 . The system of claim 4 , wherein the layer of thermal interface material is uniformly extended across the surface of the at least one heat sink.
11 . A method for aligning a power module and a heat sink, the method comprising:
forming a first interlocking feature on a surface of a power module;
forming a second interlocking feature on a surface of a heat sink, wherein the first interlocking feature includes a height greater than a depth of the second interlocking feature;
conducting finite element analysis to determine ideal locations for both the first interlocking feature and the second interlocking feature;
applying a layer of thermal interface material on the surface of the heat sink or power module, wherein the thermal interface material includes a pattern including a dot serpentine, or spiral; and
mating the first interlocking feature with the second interlocking feature, wherein a uniform gap is formed between the surface of the power module and the surface of the heat sink, wherein the thermal interface is applied uniformly to the gap.
12 . The method of claim 11 , wherein forming the second interlocking feature includes machining or laser drilling into the surface of the heat sink.
13 . The method of claim 11 , wherein the first interlocking feature is a protruding interlocking feature.
14 . The method of claim 11 , wherein the second interlocking feature is a recessed interlocking feature.
15 . The method of claim 11 , wherein applying the layer of thermal interface material includes using solder paste, silver sinter paste, or a pump to dispense the layer of thermal interface material onto the surface of the heat sink or power module.
16 . The method of claim 11 , further comprising:
aligning the heat sink with the power module.