Patent Assignment
Reel/Frame 023191/0628
Assignment of Assignor's Interest
Recorded: 2009-09-03
Pages: 6
Assignors
KUMAR, RAJ
Executed: 2009-08-06
DREYER, MONTE
Executed: 2009-08-06
TAYLOR, MICHAEL J.
Executed: 2009-08-06
ZEPEDA, RUBEN
Executed: 2009-08-06
Assignee
DYNAMIC DETAILS, INC.
1220 SIMON CIRCLE, ANAHEIM, CALIFORNIA, 92806
Covered Property
(1)
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Related Assignments
(12)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 30, 2010
From: DDI GLOBAL CORP.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025321/0451 →
Release of Security Interest
Jun 22, 2012
From: JPMORGAN CHASE BANK, N.A.,
To: DDI GLOBAL CORP.
Reel/Frame 028425/0777 →
Change of Name
Jul 19, 2012
From: DYNAMIC DETAILS, INCORPORATED
To: DDI GLOBAL CORP.
Reel/Frame 028603/0854 →
Change of Name
Dec 31, 2013
From: DDI GLOBAL CORP.
To: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
Reel/Frame 031863/0129 →
Assignment of Assignor's Interest
Jan 10, 2014
From: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 031937/0500 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Change of Name
Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →