Patent Assignment
Reel/Frame 024791/0117
Assignment of Assignor's Interest
Recorded: 2010-08-04
Pages: 8
Assignors
KUMAR, RAJESH
Executed: 2010-08-03
DREYER, MONTE P.
Executed: 2010-08-03
TAYLOR, MICHAEL J.
Executed: 2010-07-16
Assignee
DDI GLOBAL CORP.
1220 SIMON CIRCLE, ANAHEIM, CALIFORNIA, 92806
Covered Property
(1)
Methods of Manufacturing Printed Circuit Boards
Patent:
8,020,292 →
Application:
12/772,086 →
Related Assignments
(11)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 30, 2010
From: DDI GLOBAL CORP.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025321/0451 →
Release of Security Interest
Jun 22, 2012
From: JPMORGAN CHASE BANK, N.A.,
To: DDI GLOBAL CORP.
Reel/Frame 028425/0777 →
Change of Name
Dec 31, 2013
From: DDI GLOBAL CORP.
To: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
Reel/Frame 031863/0129 →
Assignment of Assignor's Interest
Jan 10, 2014
From: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 031937/0500 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Change of Name
Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →