Patent Assignment
Reel/Frame 024906/0631
Merger
Recorded: 2010-08-31
Pages: 24
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
NEC ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties
(20)
Reception Apparatus Using Spread Spectrum Communication Scheme
Semiconductor Device
Semiconductor Device with a Line and Method of Fabrication Thereof
Semiconductor Device with Seal Ring
Method of Manufacturing a Semiconductor Device Comprising a Gate Stack
Semiconductor Device and Method of Fabricating the Same
Method of Fabricating Semiconductor Device
Method of Manufacturing a Semiconductor Device
Semiconductor Device with a Line and Method of Fabrication Thereof
Semiconductor Device with a Line and Method of Fabrication Thereof
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device
Semiconductor Device
Method of Cleaning Semiconductor Substrate, and Method of Manufacturing Semiconductor Device and Semiconductor Substrate Processing Apparatus for Use in the Same
Application:
12/365,937 →
Publication:
US 2009/0149017
Semiconductor Chip with Seal Ring and Sacrificial Corner Pattern
Method of Fabricating Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device with a Line and Method of Fabrication Thereof
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 14, 2004
From: KOYAMA, MASAYUKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016089/0280 →
Assignment of Assignor's Interest
Dec 17, 2004
From: OKUDA, TAKASHI; MORIMOTO, YASUO; MARUYAMA, YUKO; KUMAMOTO, TOSHIO
To: RENESAS TECHNOLOGY CORP.; RENESAS DEVICE DESIGN CORP.
Reel/Frame 016104/0492 →
Assignment of Assignor's Interest
Aug 16, 2005
From: MAEKAWA, KAZUYOSHI; MORI, KENICHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016896/0633 →
Assignment of Assignor's Interest
Nov 4, 2005
From: FURUSAWA, TAKESHI; MIURA, NORIKO; GOTO, KINYA; MATSUURA, MASAZUMI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017192/0075 →
Assignment of Assignor's Interest
Mar 9, 2006
From: YUGAMI, JIRO; INOUE, MASAO; MORI, KENICHI; SAKASHITA, SHINSUKE
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017670/0851 →
Assignment of Assignor's Interest
Aug 30, 2006
From: KUMADA, TERUHIKO; NOBUTOKI, HIDEHARU; YASUDA, NAOKI; GOTO, KINYA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018252/0500 →
Assignment of Assignor's Interest
Nov 13, 2006
From: ISHIBASHI, TAKEO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018593/0306 →
Assignment of Assignor's Interest
Jan 4, 2007
From: ICHINOSE, KAZUHITO; YUTANI, AKIE
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018708/0446 →
Assignment of Assignor's Interest
Jun 20, 2007
From: MURATA, TATSUNORI; ASAI, KOYU; IUCHI, HIROAKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 019455/0910 →
Change of Name
Aug 31, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024906/0667 →
Assignment of Assignor's Interest
Apr 29, 2016
From: RENESAS ELECTRONICS CORPORATION
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 038425/0710 →
Change of Address
Nov 2, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 045807/0091 →
Merger
Nov 2, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044020/0503 →
Merger and Change of Name
Nov 2, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.; RENESAS SOLUTIONS CORPORATION
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 044020/0475 →
Merger
Nov 2, 2017
From: RENESAS DEVICE DESIGN CORP.
To: RENESAS LSI DESIGN CORPORATION
Reel/Frame 044020/0419 →
Merger
Nov 2, 2017
From: RENESAS DESIGN CORP.
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 044020/0377 →
Change of Name
Nov 2, 2017
From: RENESAS LSI DESIGN CORPORATION
To: RENESAS DESIGN CORP.
Reel/Frame 044020/0347 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 044020 Frame: 0377. Assignor(S) Hereby Confirms the Merger.
Dec 11, 2017
From: RENESAS DESIGN CORP.
To: RENESAS MICRO SYSTEMS CO., LTD.
Reel/Frame 045645/0850 →
Change of Name
Dec 11, 2017
From: RENESAS MICRO SYSTEMS CO., LTD.
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 044353/0309 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →