IP Library › Assignment 025026/0625
Patent Assignment
Reel/Frame 025026/0625

Merger

Recorded: 2010-09-23 Pages: 23
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Properties (10)
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 6,197,603 →
Application: 09/157,153 →
Process for Producing Semiconductor Device and Semiconductor Device Produced Thereby
Patent: 6,635,945 →
Application: 09/580,953 →
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 6,455,335 →
Application: 09/653,624 →
Method for Producing Semiconductor Device and Apparatus Usable Therein
Patent: 6,465,264 →
Application: 09/654,612 →
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,946,723 →
Application: 09/809,181 →
Publication: US 2002/0025655
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 6,566,150 →
Application: 10/171,695 →
Publication: US 2002/0182796
Packaging Device for Holding a Plurality of Semiconductor Devices to Be Inspected
Patent: 6,864,568 →
Application: 10/252,546 →
Publication: US 2003/0015779
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 7,198,962 →
Application: 10/411,283 →
Publication: US 2003/0203521
Process for Producing Semiconductor Device and Semiconductor Device Produced Thereby
Patent: 6,858,515 →
Application: 10/638,485 →
Publication: US 2004/0077152
Semiconductor Device and Manufacturing Method Thereof
Patent: 7,378,333 →
Application: 11/168,460 →
Publication: US 2005/0245061
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 1998
From: KOHNO, RYUJI; KUMAZAWA, TETSUO; KITANO, MAKOTO; ARIGA, AKIHIKO
To: HITACHI LTD
Reel/Frame 009476/0340 →
Assignment of Assignor's Interest May 30, 2000
From: ISHITSUKA, NORIO; MIURA, HIDEO; IKEDA, SHUJI; YOSHIDA, YASUKO
To: HITACHI, LTD.
Reel/Frame 010833/0183 →
Assignment of Assignor's Interest Dec 22, 2000
From: KOHNO, RYUJI; SHIMIZU, HIROYA; KANAMARU, MASATOSHI; HOSOGANE, AYSUSHI
To: HITACHI, LTD.
Reel/Frame 011368/0053 →
Assignment of Assignor's Interest Mar 16, 2001
From: SATOH, TOSHIYA; OGINO, MASAHIKO; SEGAWA, TADONORI; YAMAGUCHI, YOSHIHIDE
To: HITACHI, LTD.
Reel/Frame 011665/0704 →
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0585 →
Assignment of Assignor's Interest Apr 16, 2004
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015261/0938 →
Assignment of Assignor's Interest Nov 6, 2007
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 020098/0527 →
Assignment of Assignor's Interest Dec 8, 2009
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023607/0855 →