IP Library › Assignment 020098/0527
Patent Assignment
Reel/Frame 020098/0527

Assignment of Assignor's Interest

Recorded: 2007-11-06 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2007-10-25
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (51)
Plasma Processing Apparatus
Patent: 4,776,918 →
Application: 07/110,368 →
Disk Drive Control Unit Having Sets of Operating Command and Operation Length Information and Generating End Signal Basesd Upon Operation Le Ngth Information
Patent: 5,109,500 →
Application: 07/113,606 →
Lead Frame and Semiconductor Device
Patent: 4,942,452 →
Application: 07/158,673 →
Apparatus for Selective Deposition of Metal Thin Film
Patent: 4,979,466 →
Application: 07/320,600 →
Method of Providing a Semiconductor Ic Device with an Additional Conduction Path
Patent: 5,026,664 →
Application: 07/334,145 →
Semiconductor Device and Method of Producing the Same
Patent: 5,181,087 →
Application: 07/340,471 →
Etching Method
Patent: 4,943,344 →
Application: 07/362,099 →
Transfer Molding Process and an Apparatus for the Same
Patent: 4,954,301 →
Application: 07/378,505 →
Method for Manufacturing Semiconductor Device
Patent: 5,219,765 →
Application: 07/549,069 →
Impurity Diffusion Method
Patent: 5,387,545 →
Application: 07/805,969 →
Inspection Data Analyzing System
Patent: 5,841,893 →
Application: 07/908,550 →
Semiconductor Device and Method of Producing the Same
Patent: 5,373,191 →
Application: 07/998,856 →
Semiconductor Device with Reinforcement
Patent: 5,440,171 →
Application: 08/027,478 →
Self-Timed Semiconductor Integrated Circuit Device
Patent: 5,612,640 →
Application: 08/308,303 →
Amplifier with a Function for Switching on and Off the Output Signal
Patent: 5,541,553 →
Application: 08/398,678 →
Self-Timed Semiconductor Integrated Circuit Device
Patent: 5,869,990 →
Application: 08/792,799 →
Semiconductor Logic Element and Apparatus Using Thereof
Patent: 6,097,036 →
Application: 08/913,189 →
An Inspection System and Method Using Separate Processors For Processing Different Information Regarding A Workpiece Such As An Electronic Device
Patent: 6,185,322 →
Application: 08/958,095 →
Semiconductor Device and Its Manufacture
Patent: 6,144,052 →
Application: 09/142,011 →
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 6,197,603 →
Application: 09/157,153 →
Self-Timed Semiconductor Integrated Circuit Device
Patent: 6,239,628 →
Application: 09/245,897 →
Method of Forming Bumps
Patent: 6,213,386 →
Application: 09/315,818 →
Inspection data analyzing system
Patent: 6,339,653 →
Application: 09/523,380 →
Inspection data analyzing system
Patent: 6,330,352 →
Application: 09/525,527 →
Pin Layout of Semiconductor Integrated Circuits Including Dul Band Amplifier and Receiving Mixer
Patent: 6,407,449 →
Application: 09/547,915 →
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 6,455,335 →
Application: 09/653,624 →
Method of Forming Bumps
Patent: 6,402,014 →
Application: 09/689,804 →
Inspection Data Analyzing System
Patent: 6,628,817 →
Application: 09/752,674 →
Publication: US 2001/0001015
Polishing Slurry
Patent: 6,758,872 →
Application: 09/797,940 →
Publication: US 2002/0004360
Inspection Data Analyzing System
Patent: 6,529,619 →
Application: 09/893,889 →
Publication: US 2001/0038708
Magnetic Semiconductor Memory Apparatus and Method of Manufacturing the Same
Patent: 6,560,135 →
Application: 09/934,602 →
Publication: US 2002/0093845
Process for Fabricating a Semiconductor Device
Patent: 6,656,021 →
Application: 09/940,880 →
Publication: US 2002/0034925
Method for Polishing a Semiconductor Substrate Member
Patent: 6,656,022 →
Application: 09/940,881 →
Publication: US 2002/0090894
Memory Controller
Patent: 6,745,279 →
Application: 09/962,257 →
Publication: US 2002/0174292
Field Effect Transistor
Patent: 7,067,878 →
Application: 09/964,809 →
Publication: US 2002/0125510
Semiconductor Memory Element, Semiconductor Device and Control Method Thereof
Patent: 6,815,763 →
Application: 10/082,205 →
Publication: US 2003/0094647
Pin Arrangement for High Frequency Integrated Circuit
Patent: 6,639,310 →
Application: 10/083,547 →
Publication: US 2002/0079569
Method of Forming Bumps
Patent: 6,869,008 →
Application: 10/155,730 →
Publication: US 2002/0166886
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 6,566,150 →
Application: 10/171,695 →
Publication: US 2002/0182796
Method for Manufacturing Semiconductor Device and Electronic Device and Method for Calculating Connection Condition
Patent: 7,217,645 →
Application: 10/372,392 →
Publication: US 2003/0230806
Semiconductor Device and Manufacturing Method Thereof Including a Probe Test Step and a Burn-in Test Step
Patent: 7,198,962 →
Application: 10/411,283 →
Publication: US 2003/0203521
Polishing Method
Patent: 7,132,367 →
Application: 10/441,063 →
Publication: US 2005/0074967
Method for Manufacturing Semiconductor Device and Apparatus for Manufacturing Thereof
Patent: 6,908,860 →
Application: 10/457,369 →
Publication: US 2004/0043608
Semiconductor Integrated Circuit
Patent: 6,768,192 →
Application: 10/631,793 →
Publication: US 2004/0021208
Semiconductor Integrated Circuit
Patent: 6,847,108 →
Application: 10/812,081 →
Publication: US 2004/0178497
Memory controller
Application: 10/824,504 →
Publication: US 2004/0193779
Semiconductor Memory Element, Semiconductor Device and Control Method Thereof
Patent: 7,045,853 →
Application: 10/957,680 →
Publication: US 2005/0056884
Semiconductor Integrated Circuit
Patent: 7,369,817 →
Application: 11/012,120 →
Publication: US 2005/0101282
Method for Manufacturing Semiconductor Device and Apparatus for Manufacturing Thereof
Patent: 7,144,298 →
Application: 11/133,300 →
Publication: US 2005/0221608
Polishing Method
Patent: 7,279,425 →
Application: 11/581,375 →
Publication: US 2007/0029285
Polishing Method
Patent: 7,563,716 →
Application: 11/693,383 →
Publication: US 2007/0167015
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jan 5, 1988
From: YAMAGUCHI, YASUHIRO; TAKEUCHI, KINICHI, SUCCESSOR OF TAKAHIKO TAKEUCHI, DEC'D; OTSUBO, TORU
To: HITACHI, LTD.
Reel/Frame 004839/0337 →
Assignment of Assignors Interest. Apr 6, 1989
From: HONGO, MIKIO; MIZUKOSHI, KATSURO; SANO, SHUZO; KAMIMURA, TAKASHI
To: HITACHI, LTD., 6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN, A CORP. OF JAPAN
Reel/Frame 005061/0623 →
Assignment of Assignors Interest. Feb 23, 1990
From: KITANO, MAKOTO; KAWAI, SUEO; NISHIMURA, ASAO; MIURA, HIDEO
To: HITACHI, LTD., A CORP. OF JAPAN
Reel/Frame 005232/0758 →
Assignment of Assignors Interest. Apr 10, 1990
From: SAEKI, JUNICHI; KANEDA, AIZO; NISHI, KUNIHIKO
To: HITACHI, LTD.
Reel/Frame 005294/0546 →
Assignment of Assignors Interest. Dec 12, 1991
From: KIYOTA, YUKIHIRO; NAKAMURA, TOHRU; ONAI, TAKAHIRO; INADA, TAROH
To: HITACHI, LTD., A CORPORATION OF JAPAN
Reel/Frame 005943/0658 →
Assignment of Assignors Interest. Mar 23, 1992
From: YOSHIDA, TORU; SAKAGUCHI, SUGURU; KANEDA, AIZO; SERIZAWA, KOOJI
To: HITACHI, LTD.
Reel/Frame 006056/0718 →
Assignment of Assignor's Interest Mar 20, 1995
From: MIYANO, ICHIRO; SERIZAWA, KOOJI; SAKAGUCHI, SUGURU; ISHIDA, TOSHIHARU
To: HITACHI, LTD.
Reel/Frame 007404/0416 →
Assignment of Assignor's Interest Mar 11, 1996
From: CHUJO, NORIO; HAYASHI, YOSHIHIKO; OSAKI, AKIO
To: HITACHI, LTD
Reel/Frame 007850/0028 →
Assignment of Assignor's Interest Oct 25, 1996
From: MURABAYASHI, FUMIO; YAMAUCHI, TATSUMI; KOBAYASHI, YUTAKA
To: HITACHI, LTD.
Reel/Frame 008193/0299 →
Assignment of Assignor's Interest Sep 8, 1997
From: TESHIMA, TATSUYA; MIZUTA, HIROSHI; YAMAGUCHI, KEN
To: HITACHI, LTD.
Reel/Frame 008827/0404 →
Assignment of Assignor's Interest Aug 31, 1998
From: KUSHIDA, KEIKO; HIRATANI, MASAHIKO; TORII, KAZUYOSHI; TAKATANI, SHINICHIRO
To: HITACHI LTD
Reel/Frame 009594/0521 →
Assignment of Assignor's Interest Sep 18, 1998
From: KOHNO, RYUJI; KUMAZAWA, TETSUO; KITANO, MAKOTO; ARIGA, AKIHIKO
To: HITACHI LTD
Reel/Frame 009476/0340 →
Assignment of Assignor's Interest May 21, 1999
From: INOUE, KOSUKE; NISHIMURA, ASAO; SUZUKI, TAKAMICHI; FUJII, TERU
To: HITACHI, LTD.
Reel/Frame 009998/0753 →
Assignment of Assignor's Interest Apr 11, 2000
From: TAKIKAWA, KUMIKO; TANAKA, SATOSHI; HASHIMOTO, TAKASHI; OKABE, YOSHIYUKI
To: HITACHI, LTD
Reel/Frame 010715/0969 →
Assignment of Assignor's Interest May 17, 2004
From: HOUSTON ECONOMIC OPPORTUNITY FUND II, L.P.
To: UNIPAL INTERNATIONAL CORPORATION
Reel/Frame 015328/0820 →
Assignment of Assignor's Interest Aug 14, 2007
From: TAURUS INTERNATIONAL S.A.
To: MONDI TECHNOLOGY INVESTMENTS S.A.
Reel/Frame 019690/0293 →
Assignment of Assignor's Interest Mar 30, 2010
From: MONDI TECHNOLOGY INVESTMENTS S.A.
To: UNIPAL INTERNATIONAL,LTD. CO.
Reel/Frame 024160/0290 →
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Merger Sep 20, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025008/0362 →
Merger Sep 23, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025026/0625 →
Merger/Change of Name Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →