Patent Assignment
Reel/Frame 029736/0336
Change of Name
Recorded: 2013-01-31
Pages: 13
Assignor
NIPPON FOUNDRY INC.
Executed: 2013-01-31
Assignee
UMC JAPAN
1580, YAMAMOTO, TATEYAMA CITY, CHIBA, JAPAN
Covered Properties
(15)
Power Protection Circuitry for a Semiconductor Integrated Circuit
Patent:
5,596,474 →
Application:
08/534,541 →
Methodof Making a Mos Device with an Input Protection Circuit Lp
Patent:
5,641,697 →
Application:
08/644,447 →
Method of Fabricating Semiconductor Devices
Patent:
5,821,165 →
Application:
08/654,679 →
Production Method for Semiconductor Device Having Field-Shield Isolation Structure
Patent:
5,869,376 →
Application:
08/709,603 →
Semiconductor Memory Device with Testing Function
Patent:
5,717,643 →
Application:
08/715,069 →
Semiconductor Device with Gate Insulator Film
Patent:
5,789,778 →
Application:
08/726,778 →
Metal Oxide Semiconductor Device
Patent:
5,760,441 →
Application:
08/738,419 →
Wafer Cassette Conveying System
Patent:
6,000,900 →
Application:
08/791,666 →
Semiconductor Integrated Circuit and a Method of Manufacturing the Same
Patent:
5,998,822 →
Application:
08/978,429 →
Metal Oxide Semiconductor Device and Method Manufacturing the Same
Patent:
6,153,911 →
Application:
09/053,817 →
Lead Frame and a Semiconductor Device Having the Same
Patent:
5,990,544 →
Application:
09/110,261 →
Method for Molding a Semiconductor Device Utilizing a Satin Finish
Patent:
6,294,411 →
Application:
09/247,555 →
Method of Manufacturing Semiconductor Device
Patent:
6,066,535 →
Application:
09/368,799 →
Clean room and method of remodeling clean room
Patent:
6,264,550 →
Application:
09/559,410 →
Semiconductor device and a method of manufacturing the same
Patent:
6,274,406 →
Application:
09/597,141 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 1996
From: ASAMI, TERUO
To: NIPPON STEEL SEMICONDUCTOR CORPORATION
Reel/Frame 008152/0394 →
Assignment of Assignor's Interest
Sep 19, 1996
From: IWANAMI, EIICHI; WADA, TOSHIO
To: NIPPON STEEL SEMICONDUCTOR CORPORATION
Reel/Frame 008229/0866 →
Change of Name
Jan 28, 2013
From: NITTETSU SEMICONDUCTOR CO., LTD.
To: NIPPON FOUNDRY INC.
Reel/Frame 029700/0123 →
Change of Name
Jan 28, 2013
From: NIPPON STEEL SEMICONDUCTOR CORPORATION
To: NIPPON FOUNDRY INC.
Reel/Frame 029700/0148 →
Assignment of Assignor's Interest
Feb 18, 2013
From: UMC JAPAN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 029820/0811 →