Patent Assignment
Reel/Frame 029820/0811
Assignment of Assignor's Interest
Recorded: 2013-02-18
Pages: 5
Assignor
UMC JAPAN
Executed: 2012-12-01
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Properties
(27)
Power Protection Circuitry for a Semiconductor Integrated Circuit
Patent:
5,596,474 →
Application:
08/534,541 →
Methodof Making a Mos Device with an Input Protection Circuit Lp
Patent:
5,641,697 →
Application:
08/644,447 →
Method of Fabricating Semiconductor Devices
Patent:
5,821,165 →
Application:
08/654,679 →
Production Method for Semiconductor Device Having Field-Shield Isolation Structure
Patent:
5,869,376 →
Application:
08/709,603 →
Semiconductor Memory Device with Testing Function
Patent:
5,717,643 →
Application:
08/715,069 →
Semiconductor Device with Gate Insulator Film
Patent:
5,789,778 →
Application:
08/726,778 →
Metal Oxide Semiconductor Device
Patent:
5,760,441 →
Application:
08/738,419 →
Wafer Cassette Conveying System
Patent:
6,000,900 →
Application:
08/791,666 →
Semiconductor Integrated Circuit and a Method of Manufacturing the Same
Patent:
5,998,822 →
Application:
08/978,429 →
Metal Oxide Semiconductor Device and Method Manufacturing the Same
Patent:
6,153,911 →
Application:
09/053,817 →
Lead Frame and a Semiconductor Device Having the Same
Patent:
5,990,544 →
Application:
09/110,261 →
Semiconductor Memory Integrated Circuit
Patent:
5,943,279 →
Application:
09/241,748 →
Method for Molding a Semiconductor Device Utilizing a Satin Finish
Patent:
6,294,411 →
Application:
09/247,555 →
Method of Manufacturing Semiconductor Device
Patent:
6,066,535 →
Application:
09/368,799 →
Clean room and method of remodeling clean room
Patent:
6,264,550 →
Application:
09/559,410 →
Semiconductor device and a method of manufacturing the same
Patent:
6,274,406 →
Application:
09/597,141 →
Semiconductor Memory Device
Semiconductor Device and Method of Producing the Same
Method for Manufacturing Semiconductor Device
Test Pin Unit
Analytical Simulator and Analytical Simulation Method and Program
Photomask Covered with Light-Transmissive and Electrically-Conductive Polymer Material
Semiconductor Memory Apparatus
Semiconductor Device, and Design Method, Inspection Method, and Design Program Therefor
Lsi Inspection Method and Defect Inspection Data Analysis Apparatus
Semiconductor Device, and Design Method, Inspection Method, and Design Program Therefor
Lsi Inspection Method and Defect Inspection Data Analysis Apparatus
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 1996
From: ASAMI, TERUO
To: NIPPON STEEL SEMICONDUCTOR CORPORATION
Reel/Frame 008152/0394 →
Assignment of Assignor's Interest
Sep 19, 1996
From: IWANAMI, EIICHI; WADA, TOSHIO
To: NIPPON STEEL SEMICONDUCTOR CORPORATION
Reel/Frame 008229/0866 →
Assignment of Assignor's Interest
Jan 4, 2002
From: UKON, ISAMU
To: UMC JAPAN
Reel/Frame 012450/0225 →
Assignment of Assignor's Interest
Jun 5, 2003
From: HATA, YOJI
To: UMC JAPAN
Reel/Frame 014161/0326 →
Change of Name
Jan 28, 2013
From: NITTETSU SEMICONDUCTOR CO., LTD.
To: NIPPON FOUNDRY INC.
Reel/Frame 029700/0123 →
Change of Name
Jan 28, 2013
From: NIPPON STEEL SEMICONDUCTOR CORPORATION
To: NIPPON FOUNDRY INC.
Reel/Frame 029700/0148 →
Change of Name
Jan 31, 2013
From: NIPPON FOUNDRY INC.
To: UMC JAPAN
Reel/Frame 029736/0336 →
Change of Name
Feb 8, 2013
From: NIPPON FOUNDRY INC.
To: UMC JAPAN
Reel/Frame 029777/0788 →