Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.
1. An optoelectronic apparatus, comprising:
a first optoelectronic element having a first side and at least a first optical waveguide, the first optical waveguide comprising a first portion extending in a first direction from a first optical interface at the first side, a second portion extending in a second direction relative to the first portion, the second direction different than the first direction, and a third portion extending in a third direction from the second portion to a second optical interface at the first side, wherein the first optical waveguide further comprises a first inner core and a first outer cladding;
a second optoelectronic element directly bonded to the first inner core of the first optoelectronic element at the first optical interface; and
a third optoelectronic element directly bonded to the first optoelectronic element at the second optical interface, and wherein the first optoelectronic element provides an optical path between the second optoelectronic element and the third optoelectronic element.
2. The optoelectronic apparatus of claim 1 , further comprising a first dielectric direct bond between the first optoelectronic element and the second optoelectronic element and a second dielectric direct bond between the first optoelectronic element and the third optoelectronic element.
3. The optoelectronic apparatus of claim 2 , wherein the first optoelectronic element comprises a first plurality of electrical contacts and the second optoelectronic element comprises a second plurality of electrical contacts, and wherein the first plurality of electrical contacts is direct bonded to the second plurality of electrical contacts.
4. The optoelectronic apparatus of claim 2 , wherein the first and second dielectric direct bonds comprise oxide-to-oxide bonds formed at room temperature or at a temperature near or below room temperature.
5. The optoelectronic apparatus of claim 1 , wherein the first optoelectronic element is an interposer.
6. The optoelectronic apparatus of claim 1 , wherein a composition of the first inner core is selected from a group consisting of Si, ZrO 2 , HfO 2 , TiO 2 , LiNbO 3 , Nb 2 O 5 , SrTiO 3 , and ZnS.
7. The optoelectronic apparatus of claim 1 , wherein a composition of the first outer cladding comprises at least one of a silicon dioxide, a polyimide, or a parylene.
8. The optoelectronic apparatus of claim 1 , wherein the first optical interface comprises a first plurality of electrical contacts.
9. The optoelectronic apparatus of claim 1 , wherein the first optical waveguide transmits a light or an electromagnetic radiation between the second optoelectronic element and the third optoelectronic element.
10. The optoelectronic apparatus of claim 1 , further comprising a second optical waveguide, wherein the second optical waveguide is configured to be an optical trace along a surface of the first optoelectronic element.
11. The optoelectronic apparatus of claim 10 , wherein the optical trace is a rectangular waveguide or a ribbed waveguide.
12. The optoelectronic apparatus of claim 10 , wherein the optical trace is direct oxide bonded to a fourth optoelectronic element and a fifth optoelectronic element and is configured to transmit a light or an electromagnetic radiation between the fourth and the fifth optoelectronic elements.
13. The optoelectronic apparatus of claim 1 , wherein the second optoelectronic element comprises a second optical waveguide comprising a second outer cladding and a second inner core, wherein the first and second outer claddings are direct bonded, and wherein the first and second inner cores are direct bonded.
14. The optoelectronic apparatus of claim 13 , wherein the first and second outer claddings comprise a dielectric, and wherein the first and second inner cores comprise a photonic material.
15. An optoelectronic apparatus, comprising:
a first optoelectronic element having a first side and at least a first optical waveguide, the first optical waveguide comprising a first portion extending in a first direction from a first optical interface at the first side, a second portion extending in a second direction relative to the first portion, the second direction different than the first direction, and a third portion extending in a third direction from the second portion to a second optical interface at the first side, wherein the first optical waveguide further comprises a first inner core and a first outer cladding;
a second optoelectronic element directly bonded to the first optoelectronic element at the first optical interface, wherein the second optoelectronic element comprises a second optical waveguide comprising a second outer cladding and a second inner core, wherein the first and second outer claddings are direct bonded, and wherein the first and second inner cores are direct bonded; and
a third optoelectronic element directly bonded to the first optoelectronic element at the second optical interface, and wherein the first optoelectronic element provides an optical path between the second optoelectronic element and the third optoelectronic element.
16. The optoelectronic apparatus of claim 15 , wherein the first and second outer claddings comprise a dielectric, and wherein the first and second inner cores comprise a photonic material.
17. The optoelectronic apparatus of claim 15 , wherein the first and second outer claddings comprise a first material, wherein the first and second inner cores comprise a second material, and wherein the first material is different than the second material.
18. The optoelectronic apparatus of claim 15 , wherein the first optoelectronic element comprises a first plurality of electrical contacts and the second optoelectronic element comprises a second plurality of electrical contacts, and wherein the first plurality of electrical contacts is direct bonded to the second plurality of electrical contacts.
19. The optoelectronic apparatus of claim 15 , wherein the first optoelectronic element is an interposer.
20. The optoelectronic apparatus of claim 15 , wherein a composition of the first inner core is selected from a group consisting of Si, ZrO 2 , HfO 2 , TiO 2 , LiNbO 3 , Nb 2 O 5 , SrTiO 3 , and ZnS.
21. The optoelectronic apparatus of claim 15 , wherein a composition of the first outer cladding comprises at least one of a silicon dioxide, a polyimide, or a parylene.