IP Library › Granted Patent US 7,839,707
Granted Patent B2
US 7,839,707 · App. 12/207,321 · Granted Nov 23, 2010

Fuses for memory repair

Assignee: Vitesse Semiconductor Corporation
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Quick Facts
Patent No.
US 7,839,707
App. No.
12/207,321
Filed
Sep 9, 2008
Granted
Nov 23, 2010
Kind
B2
Art Unit
2824
USPC
365/200
Abstract

Structures for fuses to control repair of multiple memories embedded on an integrated circuit are provided along with methods of use. A set of fuses is shared to control repair of a plurality of memories. Some of the fuses are associated with a memory to be repaired. Others of the fuses identify how the repair is accomplished.

Claims (53)

1. An integrated circuit, comprising:

a plurality of memories each with a redundant section;

a first set of permanent storage devices to identify one of the plurality of memories, and

a second set of permanent storage devices to specify use of the redundant section of the memory identified by the first set of permanent storage devices.

2. The integrated circuit of claim 1 , wherein the first set of permanent storage devices and the second set of permanent storage devices are fuses.

3. The integrated circuit of claim 2 , wherein the fuses are electrical fuses.

4. The integrated circuit of claim 3 , wherein the plurality of memories comprises a plurality of static random access memories.

5. The integrated circuit of claim 1 , wherein the first set of permanent storage devices and the second set of permanent storage devices are antifuses.

6. The integrated circuit of claim 1 , wherein the plurality of memories comprises a random access memory.

7. The integrated circuit of claim 6 , wherein the random access memory is static random access memory.

8. The integrated circuit of claim 6 , wherein the random access memory is dynamic random access memory.

9. The integrated circuit of claim 1 , further comprising built-in self test circuitry operatively coupled to at least one of the plurality of memories, to the first set of permanent storage devices, and to the second set of permanent storage devices.

10. The integrated circuit of claim 1 , wherein the redundant section comprises a spare column and the second set of permanent storage devices specifies column replacement.

11. The integrated circuit of claim 1 , wherein the redundant section comprises a spare row and the second set of permanent storage devices specifies row replacement.

12. An integrated circuit, comprising:

a plurality of memories each with a redundant section;

a first plurality of sets of permanent storage devices, one associated with each of the plurality of memories, storing data to conditionally enable use of the redundant section of the associated memory;

circuitry sensing data programmed into the first sets of permanent storage devices to generate memory repair enable signals;

a second plurality of sets of permanent storage devices, each specifying a redundancy utilization;

circuitry sensing data programmed into the second sets of permanent storage devices to generate repair control signals; and

multiplexers selecting one of the repair control signals based on the repair enable signals.

13. The integrated circuit of claim 12 , wherein the first set of permanent storage devices and the second set of permanent storage devices are fuses.

14. The integrated circuit of claim 13 , wherein the fuses are electrical fuses.

15. The integrated circuit of claim 14 , wherein the plurality of memories comprises a plurality of static random access memories.

16. The integrated circuit of claim 12 , wherein the first set of permanent storage devices and the second set of permanent storage devices are antifuses.

17. The integrated circuit of claim 12 , wherein the plurality of memories comprises a random access memory.

18. The integrated circuit of claim 17 , wherein the random access memory is static random access memory.

19. The integrated circuit of claim 17 , wherein the random access memory is dynamic random access memory.

20. The integrated circuit of claim 12 , further comprising built-in self test circuitry operatively coupled to at least one of the plurality of memories, to the first sets of permanent storage devices, and to the second sets of permanent storage devices.

21. The integrated circuit of claim 12 , wherein the redundant section comprises a spare column and the second set of permanent storage devices specifies column replacement.

22. The integrated circuit of claim 12 , wherein the redundant section comprises a spare row and the second set of permanent storage devices specifies row replacement.

23. A process for programming fuses for repair of integrated circuit memories, comprising:

testing memories in an integrated circuit;

identifying a faulty memory;

identifying a repair for the faulty memory;

programming first permanent storage devices on the integrated circuit to signal the identified faulty memory; and

programming second permanent storage devices on the integrated circuit to signal the identified repair for the faulty memory.

24. The process of claim 23 , further comprising:

a second testing of memories in the integrated circuit;

a second identifying of a faulty memory;

a second identifying of a repair for the faulty memory;

a second programming of permanent storage devices on the integrated circuit to signal the identified faulty memory; and

a second programming of permanent storage devices on the integrated circuit to signal the identified repair.

25. The process of claim 24 , wherein the testing memories on an integrated circuit is performed on a wafer of integrated circuits and the second testing of memories on the integrated circuit is performed after packaging the integrated circuit.

26. A process for repair of memories embedded in an integrated circuit, comprising:

testing memories in an integrated circuit;

identifying a faulty memory;

identifying a repair for the faulty memory;

programming a first set of permanent storage devices on the integrated circuit to signal the identified faulty memory;

programming a second set of permanent storage devices on the integrated circuit to signal the identified repair,

sensing the status programmed into the permanent storage devices;

identifying a memory for repair from the sensed status; and

repairing the identified memory based on the sensed status.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2017
From: MICROSEMI COMMUNICATIONS, INC.
To: MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 042523/0577 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
MERGER AND CHANGE OF NAME Recorded May 13, 2015
From: VITESSE SEMICONDUCTOR CORPORATION; LLIU100 ACQUISITION CORP.
To: MICROSEMI COMMUNICATIONS, INC.
Reel/Frame 035651/0708 →
SUPPLEMENTAL SECURITY AGREEMENT Recorded Apr 29, 2015
From: MICROSEMI COMMUNICATIONS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035532/0925 →
RELEASE OF SECURITY INTEREST Recorded Apr 28, 2015
From: WHITEBOX VSC, LTD.
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 035526/0090 →
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2014
From: US BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 034176/0162 →
SECURITY AGREEMENT Recorded Dec 9, 2009
From: VITESSE SEMICONDUCTOR CORPORATION
To: WHITEBOX VSC, LTD.
Reel/Frame 023627/0079 →
COLLATERAL ASSIGNMENT (INTELLECTUAL PROPERTY) Recorded Nov 5, 2009
From: VITESSE SEMICONDUCTOR CORPORATION
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 023471/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2008
From: AAKJER, THOMAS
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 021505/0123 →
Continuity (1)
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