Semiconductor device and fabricating method thereof
A semiconductor device includes a substrate, a semiconductor channel layer, a semiconductor barrier layer, a gate capping layer, a dielectric layer, and a gate electrode. The semiconductor channel layer is disposed on the substrate, and the semiconductor barrier layer is disposed on the semiconductor channel layer. The gate capping layer is disposed on the semiconductor barrier layer, and the dielectric layer conformally covers the gate capping layer and surrounds the periphery of the gate capping layer. The gate electrode is disposed on the dielectric layer and covers at least one sidewall of the gate capping layer.
1. A semiconductor device, comprising:
a substrate;
a semiconductor channel layer disposed on the substrate;
a semiconductor barrier layer disposed on the semiconductor channel layer;
a gate capping layer disposed on the semiconductor barrier layer, wherein the gate capping layer comprises a top surface, a first sidewall, and a second sidewall opposite to the first sidewall;
a dielectric layer conformally covering the gate capping layer and surrounding a periphery of the gate capping layer, wherein the top surface of the gate capping layer is completely covered with the dielectric layer in a top view;
a gate electrode disposed on the dielectric layer, completely covering the dielectric layer on the top surface of the gate capping layer, wherein the gate electrode is completely separated from the gate capping layer by the dielectric layer, and a top surface of the gate capping layer contacts the dielectric layer, wherein the top surface of the gate capping layer is completely covered with the gate electrode in a top view;
an interlayer dielectric layer disposed on the semiconductor barrier layer, wherein a bottom surface of the interlayer dielectric layer is lower than a top surface of the gate capping layer, and the dielectric layer is disposed between the interlayer dielectric layer and the semiconductor barrier layer; and
a source electrode and a drain electrode respectively disposed in a source contact hole and a drain contact hole, wherein the source contact hole and the drain contact hole are disposed in the semiconductor barrier layer, and bottom surfaces of the source contact hole and the drain contact hole are disposed between a top surface and a bottom surface of the semiconductor barrier layer so as to expose the semiconductor barrier layer.
2. The semiconductor device according to claim 1 , wherein a thickness of the dielectric layer is less than a thickness of the gate capping layer.
3. The semiconductor device according to claim 1 , wherein the dielectric layer is disposed between the gate capping layer and the gate electrode.
4. The semiconductor device according to claim 1 , wherein the dielectric layer conformally covers a top surface of the semiconductor barrier layer.
5. The semiconductor device according to claim 1 , wherein the dielectric layer is a high-k dielectric layer.
6. The semiconductor device according to claim 1 , wherein a portion of a bottom surface of the gate electrode is lower than the top surface of the gate capping layer.
7. The semiconductor device according to claim 1 , wherein the gate electrode conformally covers the dielectric layer.
8. The semiconductor device according to claim 1 , wherein a length of the gate electrode is greater than a length of the gate capping layer.
9. The semiconductor device according to claim 1 , wherein a portion of the gate capping layer protrudes from one side of the gate electrode.
10. The semiconductor device according to claim 1 , wherein the gate electrode comprises a body portion and at least one extension portion, the at least one extension portion being disposed at one side of the body portion and a bottom surface of the at least one extension portion being lower than a bottom surface of the body portion.
11. The semiconductor device according to claim 1 , wherein the dielectric layer is disposed between the interlayer dielectric layer and the sidewall of the gate capping layer.
12. A method of fabricating a semiconductor device, comprising:
providing a substrate;
forming a semiconductor channel layer on the substrate;
forming a semiconductor barrier layer on the semiconductor channel layer;
forming a gate capping layer on the semiconductor barrier layer, wherein the gate capping layer comprises a top surface, a first sidewall, and a second sidewall opposite to the first sidewall;
forming a dielectric layer conformally covering the gate capping layer and the semiconductor barrier layer, wherein the top surface of the gate capping layer is completely covered with the dielectric layer in a top view;
forming a gate electrode on the dielectric layer, wherein the gate electrode completely covers the dielectric layer on the top surface of the gate capping layer, and the gate electrode is completely separated from the gate capping layer by the dielectric layer, wherein a top surface of the gate capping layer contacts the dielectric layer, wherein the top surface of the gate capping layer is completely covered with the gate electrode in a top view;
forming an interlayer dielectric layer covering the dielectric layer before forming the gate electrode, wherein a top surface of the interlayer dielectric layer is higher than the top surface of the gate capping layer; and
forming a source contact hole and a drain contact hole and disposing therein a source electrode and a drain electrode, respectively, wherein the source contact hole and the drain contact hole are formed into the semiconductor barrier layer, and bottom surfaces of the source contact hole and the drain contact hole are disposed between a top surface and a bottom surface of the semiconductor barrier layer so as to expose the semiconductor barrier layer.
13. The method of fabricating the semiconductor device according to claim 12 , before forming the gate electrode, further comprising forming a contact hole in the interlayer dielectric layer so as to expose the dielectric layer on the sidewall of the gate capping layer.
14. The method of fabricating the semiconductor device according to claim 12 , after forming the interlayer dielectric layer, further comprising etching through the interlayer dielectric layer and the dielectric layer to form a through hole and expose the semiconductor barrier layer.
15. The method of fabricating the semiconductor device according to claim 12 , wherein the gate electrode conformally covers the dielectric layer.