Image sensor device for blocking noise in the pad area
An image sensor device is disclosed, which blocks noise of a pad area. The image sensor device includes a substrate, a pad, and an impurity area. The substrate includes a first surface and a second surface, and includes first conductive impurities. The pad is disposed at the first surface of the substrate. The impurity area is formed in the substrate to overlap with the pad in a first direction, the impurity area being includes second conductive impurities different from the first conductive impurities.
1 . An image sensor device comprising:
a substrate including a first surface and a second surface, the substrate being configured to have first conductive impurities;
a pad disposed at the first surface of the substrate; and
an impurity area including second conductive impurities different from the first conductive impurities, and disposed at both ends of the substrate with respect to a first direction within the substrate,
wherein the impurity area does not overlap with a lower area of the pad in a second direction.
2 . The image sensor device according to claim 1 , wherein the impurity area is formed to be smaller than the pad in the first direction.
3 . The image sensor device according to claim 1 , wherein the impurity region comprises a first impurity region formed at one side of the substrate in the first direction and a second impurity region formed at the other side of the substrate in the first direction.
4 . The image sensor device according to claim 3 , wherein the first impurity region is disposed not to overlap with the pad in the second direction in a pad region.
5 . The image sensor device according to claim 3 , wherein the second impurity region is disposed not to overlap with the pad in the second direction in a circuit area.
6 . The image sensor device according to claim 3 , wherein the second impurity region is disposed not to overlap with the pad in the second direction in a pad area.
7 . The image sensor device according to claim 1 , further comprising:
a conductive film disposed at the first surface of the substrate to cover a top surface of the substrate at a lower portion of the pad.
8 . The image sensor device according to claim 7 , wherein the conductive film is formed to be larger than the pad in the first direction.
9 . The image sensor device according to claim 7 , wherein the conductive film is formed in a trench exposing a plurality of areas of the substrate.
10 . The image sensor device according to claim 9 , wherein the pad is formed along a top surface and a side surface of the conductive film.
11 . The image sensor device according to claim 7 , further comprising:
a through silicon via disposed at one side of the substrate and being configured to penetrate the substrate in the second direction.
12 . The image sensor device according to claim 11 , wherein the through silicon via is electrically coupled to the pad through the conductive film.
13 . The image sensor device according to claim 1 , wherein the impurity area is formed as a stacked structure of a plurality of impurity layers.
14 . The image sensor device according to claim 13 , wherein the plurality of impurity layers is formed to have a same dimension in the second direction.
15 . The image sensor device according to claim 13 , wherein
at least one of the plurality of impurity layers is formed as a deep well.