Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a dispensing needle in fluid communication with the semiconductor die, the dispensing needle including a width substantially equal to a width of the semiconductor die; and
dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.
2. The method of claim 1 , further including dispensing the underfill material simultaneously and uniformly across the width of the semiconductor die.
3. The method of claim 1 , further including dispensing the underfill material under pressure across the width of the semiconductor die.
4. The method of claim 1 , wherein the dispensing needle remains stationary during the dispensing of the underfill material between the semiconductor die and substrate.
5. The method of claim 1 , wherein the dispensing needle includes a plurality of pole portions between a shank and an outlet.
6. The method of claim 1 , wherein the dispensing needle includes a plate between a shank and an outlet.
7. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a stationary dispensing needle in fluid communication across a width of the semiconductor die; and
dispensing an underfill material from the stationary dispensing needle between the semiconductor die and substrate.
8. The method of claim 7 , wherein a width of the stationary dispensing needle is substantially equal to the width of the semiconductor die.
9. The method of claim 7 , further including dispensing the underfill material uniformly across the width of the semiconductor die.
10. The method of claim 7 , further including dispensing the underfill material under pressure across the width of the semiconductor die.
11. The method of claim 7 , wherein the stationary dispensing needle includes a plurality of pole portions between a shank and an outlet.
12. The method of claim 7 , wherein the stationary dispensing needle includes a T-shaped shank.
13. The method of claim 7 , wherein the stationary dispensing needle includes a plate between a shank and an outlet.
14. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate; and
disposing a dispensing needle in fluid communication across a width of the semiconductor die and including an outlet disposed adjacent to a gap between the semiconductor die and substrate.
15. The method of claim 14 , further including dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.
16. The method of claim 15 , further including dispensing the underfill material uniformly across the width of the semiconductor die.
17. The method of claim 15 , further including dispensing the underfill material under pressure across the width of the semiconductor die.
18. The method of claim 15 , wherein the dispensing needle remains stationary during the dispensing of the underfill material between the semiconductor die and substrate.
19. The method of claim 14 , wherein a width of the dispensing needle is substantially equal to the width of the semiconductor die.
20. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate; and
disposing a dispensing needle in fluid communication across a width of the semiconductor die.
21. The method of claim 20 , further including dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.
22. The method of claim 21 , further including dispensing the underfill material uniformly across the width of the semiconductor die.
23. The method of claim 21 , wherein the dispensing needle remains stationary during the dispensing of the underfill material between the semiconductor die and substrate.
24. The method of claim 20 , wherein a width of the dispensing needle is substantially equal to the width of the semiconductor die.
25. The method of claim 20 , wherein the dispensing needle includes a plate between a shank and an outlet.