IP Library › Assignment 016290/0559
Patent Assignment
Reel/Frame 016290/0559

Merger

Recorded: 2005-07-21 Pages: 11
Assignor
DONGBU ELECTRONICS CO., LTD.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR, INC.
891-10 DAECHI-DONG, KANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (5)
Method for Manufacturing Semiconductor Image Sensor with Color Filters and Bonding Pads
Patent: 6,656,762 →
Application: 10/166,618 →
Publication: US 2003/0176010
Method for Forming Shallow Trench Isolation
Patent: 6,649,488 →
Application: 10/304,696 →
Publication: US 2003/0100168
Semiconductor with a Stress Reduction Layer and Manufacturing Method Therefor
Patent: 6,657,299 →
Application: 10/304,697 →
Publication: US 2003/0098501
Method for Forming Metal Lines of Semiconductor Device
Patent: 6,716,735 →
Application: 10/327,858 →
Publication: US 2003/0124860
Apparatus for Analyzing a Failure of a Semiconductor Device and Method Therefor
Patent: 6,732,062 →
Application: 10/429,823 →
Publication: US 2003/0208337
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jul 21, 2006
From: DONGBUANAM SEMICONDUCTOR, INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017971/0272 →
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →
Assignment of Assignor's Interest Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment. Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0536 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →