IP Library Assignment 017971/0272
Patent Assignment
Reel/Frame 017971/0272

Change of Name

Recorded: 2006-07-21 Pages: 10
Assignor
DONGBUANAM SEMICONDUCTOR, INC.
Executed: 2006-03-24
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, KANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (8)
Method for Manufacturing Semiconductor Image Sensor with Color Filters and Bonding Pads
Patent: 6,656,762 →
Application: 10/166,618 →
Publication: US 2003/0176010
Method for Forming Shallow Trench Isolation
Patent: 6,649,488 →
Application: 10/304,696 →
Publication: US 2003/0100168
Semiconductor with a Stress Reduction Layer and Manufacturing Method Therefor
Patent: 6,657,299 →
Application: 10/304,697 →
Publication: US 2003/0098501
Method for Forming Metal Lines of Semiconductor Device
Patent: 6,716,735 →
Application: 10/327,858 →
Publication: US 2003/0124860
Method for Cleaning a Semiconductor Device
Patent: 6,840,249 →
Application: 10/328,028 →
Publication: US 2003/0121527
Dram Cell Structure Capable of High Integration and Fabrication Method Thereof
Patent: 6,797,590 →
Application: 10/427,974 →
Publication: US 2003/0205748
Apparatus for Analyzing a Failure of a Semiconductor Device and Method Therefor
Patent: 6,732,062 →
Application: 10/429,823 →
Publication: US 2003/0208337
Dram Cell Structure Capable of High Integration and Fabrication Method Thereof
Patent: 6,974,988 →
Application: 10/700,666 →
Publication: US 2004/0090813
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Jul 21, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016290/0559 →
Merger Jul 25, 2005
From: DONGBUANAM SEMICONDUCTOR, INC.; DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016301/0604 →
Corrective Assignment to Correct the Errroneously Listed Assignor, "Dongbuanam Semicounductor, Inc.", Which Should Be Deleted, Previously Recorded on Reel 016301 Frame 0604. Assignor(S) Hereby Confirms the Filing of the Corrective Assignment (Merger) Document. Jul 26, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016301/0913 →
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →
Assignment of Assignor's Interest Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment. Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0536 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →