Patent Assignment
Reel/Frame 019892/0207
Assignment of Assignor's Interest
Recorded: 2007-09-28
Received: 2007-09-28
Pages: 9
Assignor
SPEEDFAM-IPEC CORPORATION
Executed: 2007-09-14
Assignee
NOVELLUS SYSTEMS, INC.
4000 N. FIRST STREET, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(51)
Method for polishing copper on a workpiece surface
Application:
11/489,874 →
Method and Apparatus for Controlled Slurry Distribution
Application:
11/276,803 →
Work Piece Carrier with Adjustable Pressure Zones and Barriers and a Method of Planarizing a Work Piece
Application:
11/324,038 →
Method and Apparatus for Electrochemical Planarization of a Workpiece
Application:
11/164,270 →
Method for polishing copper on a workpiece surface
Application:
11/117,995 →
Orbiting Indexable Belt Polishing Station for Chemical Mechanical Polishing
Application:
10/711,229 →
Method and Apparatus for the Electrochemical Deposition and Planarization of a Material on a Workpiece Surface
Application:
10/921,666 →
Method and Apparatus for Electrochemical Planarization of a Workpiece
Application:
10/709,598 →
Work Piece Carrier with Adjustable Pressure Zones and Barriers and a Method of Planarizing a Work Piece
Application:
10/830,412 →
Workpiece Handling End-Effector and a Method for Processing Workpieces Using a Workpiece Handling End-Effector
Application:
10/801,404 →
Work Piece Carrier with Adjustable Pressure Zones and Barriers and a Method of Planarizing a Work Piece
Application:
10/672,017 →
Multiprobe Detection System for Chemical-Mechanical Planarization Tool
Application:
10/646,011 →
Apparatus for Electrochemically Depositing a Material Onto a Workpiece Surface
Application:
10/305,860 →
Wear Ring Assembly
Application:
10/293,875 →
Method and Apparatus for Teaching Robot Station Location
Application:
10/195,619 →
Homogeneous Fixed Abrasive Polishing Pad
Application:
10/193,753 →
Method for Processing a Work Piece in a Multi-Zonal Processing Apparatus
Application:
10/147,418 →
Work Piece Carrier with Adjustable Pressure Zones and Barriers and a Method of Planarizing a Work Piece
Application:
10/120,600 →
Polishing Pad Window for a Chemical-Mechanical Polishing Tool
Application:
10/058,743 →
Workpiece Carrier with Adjustable Pressure Zones and Barriers
Application:
10/053,974 →
Method and Apparatus for the Electrochemical Deposition and Planarization of a Material on a Workpiece Surface
Application:
10/044,514 →
Clean Room and Method
Application:
09/993,534 →
Method and Apparatus for Endpoint Detection During Chemical Mechanical Polishing
Application:
10/035,519 →
Workpiece Handling End-Effector and a Method for Processing Workpieces Using a Workpiece Handling End-Effector
Application:
10/040,996 →
Workpiece Carrier with Adjustable Pressure Zones and Barriers
Application:
09/975,450 →
Clean Room Facility and Construction Method
Application:
09/975,600 →
System and Method for Cleaning Workpieces
Application:
09/971,332 →
Multizone Carrier with Process Monitoring System for Chemical-Mechanical Planarization Tool
Application:
09/970,185 →
Work Piece Wand and Method for Processing Work Pieces Using a Work Piece Handling Wand
Application:
09/948,836 →
Laminated Wear Ring
Application:
09/943,699 →
Method and Apparatus for Sensing a Wafer in a Carrier
Application:
09/941,110 →
Method and Apparatus for Optical Endpoint Detection During Chemical Mechanical Polishing
Application:
09/941,109 →
Workpiece Carrier Retaining Element
Application:
09/924,067 →
Apparatus for Distributing a Fluid Through a Polishing Pad
Application:
09/923,172 →
Method and Apparatus for Distributing Fluid to a Polishing Surface During Chemical Mechanical Polishing
Application:
09/893,131 →
Dynamic Slurry Distribution Control for Cmp
Application:
09/859,656 →
Multizone Slurry Delivery for Chemical Mechanical Polishing Tool
Application:
09/863,582 →
Method of Removing Debris from Cleaning Pads in Work Piece Cleaning Equipment
Application:
09/851,866 →
Method for Controlling a Process in a Multi-Zonal Apparatus
Application:
09/846,965 →
Learning Method and Apparatus for Predictive Determination of Endpoint During Chemical Mechanical Planarization Using Sparse Sampling
Application:
09/839,631 →
Method and Apparatus for Using Optical Reflection Data to Obtain a Continuous Predictive Signal During Cmp
Application:
09/838,980 →
Inline Metrology Device
Application:
09/836,789 →
Method and Apparatus for Electrochemically Depositing a Material Onto a Workpiece Surface
Application:
09/832,657 →
Method and Apparatus for Optical Endpoint Calibration in Cmp
Application:
09/829,493 →
Apparatus and Process for Polishing a Workpiece
Application:
09/826,674 →
Rigid Polishing Pad Conditioner for Chemical Mechanical Polishing Tool
Application:
09/817,554 →
Low Amplitude, High Speed Polisher and Method
Application:
09/812,655 →
Method and Apparatus for Electrochemical Planarization of a Workpiece
Application:
09/781,593 →
Method for Selective Removal of Copper
Application:
09/772,722 →
Dual Purpose Handoff Station for Workpiece Polishing Machine
Application:
09/764,245 →
Multi-Zone Pressure Control Carrier
Application:
09/761,336 →