Patent Assignment
Reel/Frame 024733/0314
Merger
Recorded: 2010-07-23
Pages: 23
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU KAWASAKI, KANAGAWA, JAPAN
Covered Properties
(14)
Semiconductor Device
Semiconductor Manufacturing Method
Semiconductor Device and a Method of Increasing a Resistance Value of an Electric Fuse
Lead Frame Including Suspending Leads Having Trenches Formed Therein
Fabrication Method of Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit Device
Semiconductor Device Having Plurality of Leads
Semiconductor Package Configuration with Improved Lead Portion Arrangement
Fabrication Method of Semiconductor Integrated Circuit Device
Method of Manufacture of Semiconductor Integrated Circuit Device and Semiconductor Integrated Circuit Device
Multi-Chip Semiconductor Device
Semiconductor Manufacturing Method of Die Pick-Up from Wafer
Semiconductor Device and a Method of Manufacturing the Same
Semiconductor Device and Manufacturing the Same
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 24, 2006
From: SUWA, MOTOO; IKEGAMI, HIKARU; BETSUI, TAKAFUMI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017612/0018 →
Assignment of Assignor's Interest
Jun 1, 2006
From: ABE, YOSHIYUKI; MIYAZAKI, CHUICHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017959/0492 →
Assignment of Assignor's Interest
Mar 13, 2007
From: IWAMOTO, TAKESHI; KONO, KAZUSHI; ARAKAWA, MASASHI; YONEZU, TOSHIAKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 019050/0577 →
Assignment of Assignor's Interest
Jan 9, 2012
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 027534/0453 →
Assignment of Assignor's Interest
Mar 28, 2012
From: RENESAS ELECTRONICS CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027946/0388 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Assignment of Assignor's Interest
May 12, 2017
From: MAKI, HIROSHI; TANI, YUKIO
To: RENESAS TECHNOLOGY CORP.; RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0327 →
Merger
Sep 20, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 043638/0393 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →