Patent Assignment
Reel/Frame 027234/0483
Assignment of Assignor's Interest
Recorded: 2011-11-16
Pages: 19
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2011-08-22
Assignee
658868 N.B. INC.
44 CHIPMAN HILL, SUITE 1000, SAINT JOHN, NB, E2L 2A9, CANADA
Covered Properties
(20)
Semiconductor Device Fabrication Method
Patent:
5,882,968 →
Application:
08/576,752 →
Interconnection Structure for Attaching a Semiconductor Device to a Substrate
Patent:
5,703,406 →
Application:
08/587,744 →
Method for Fabricating a Capacitor of a Semiconductor Device
Patent:
5,702,970 →
Application:
08/670,592 →
Semiconductor Memory Device
Patent:
5,757,692 →
Application:
08/727,852 →
Method for Fabricating a Capacitor of a Semiconductor Device and the Structure of the Same
Patent:
5,714,402 →
Application:
08/757,246 →
Interconnection Structure for Attaching a Semiconductor to Substrate
Patent:
5,883,438 →
Application:
08/854,069 →
A Method for Developing Shallow Trench Isolation in a Semiconductor Memory Device
Patent:
5,904,538 →
Application:
08/923,141 →
Method for Fabricating a Capacitor of a Semiconductor Device
Patent:
5,953,576 →
Application:
08/925,060 →
Memory Device Having Divided Global Bit Lines
Patent:
5,864,497 →
Application:
08/961,544 →
Semiconductor Chip Package and Method for Fabricating the Same
Patent:
6,140,700 →
Application:
08/966,703 →
Cell Array and Sense Amplifier Structure Exhibiting Improved Noise Characteristic and Reduced Size
Patent:
6,002,625 →
Application:
08/991,618 →
Method of Fabrication a Source/Drain with Ldd and Halo
Patent:
5,937,293 →
Application:
09/057,537 →
Ball Grid Array Package
Patent:
6,060,778 →
Application:
09/060,981 →
Method of Fabricating Gate Electrodes of Twin-Well Cmos Device
Patent:
6,103,603 →
Application:
09/065,487 →
Method of Preventing Bowing in a via Formation Process
Patent:
6,124,208 →
Application:
09/186,354 →
Semiconductor Device for Improving Short Channel Effect
Patent:
6,078,081 →
Application:
09/326,694 →
Method for Fabricating a Capacitor of a Semiconductor Device
Patent:
6,080,594 →
Application:
09/336,698 →
Multi-Chip Package
Patent:
6,121,682 →
Application:
09/469,131 →
Delay Locked Loop Using Bidirectional Delay
Patent:
6,239,641 →
Application:
09/476,380 →
Semiconductor chip package and method for fabricating the same
Patent:
6,214,648 →
Application:
09/604,762 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 4, 1996
From: SUH, JONG WON
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 008221/0142 →
Change of Name
Apr 9, 2002
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 012795/0502 →
Change of Name
Aug 30, 2011
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 026828/0688 →
Change of Name
Aug 31, 2011
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 026837/0725 →
Corrective Assignment to Correct the Execution Date Previously Recorded on Reel 026837 Frame 0725. Assignor(S) Hereby Confirms the Change of Name.
Sep 2, 2011
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 026855/0660 →
U.S. Intellectual Property Security Agreement (for Non-U.S. Grantors) - Short Form
Jan 10, 2012
From: 658276 N.B. LTD.; 658868 N.B. INC.; MOSAID TECHNOLOGIES INCORPORATED
To: ROYAL BANK OF CANADA
Reel/Frame 027512/0196 →
Change of Name
Mar 13, 2014
From: 658868 N.B. INC.
To: CONVERSANT IP N.B. 868 INC.
Reel/Frame 032439/0547 →
Release of Security Interest
Aug 7, 2014
From: ROYAL BANK OF CANADA
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.; CONVERSANT IP N.B. 868 INC.; CONVERSANT IP N.B. 276 INC.
Reel/Frame 033484/0344 →
U.S. Patent Security Agreement (for Non-U.S. Grantors)
Sep 9, 2014
From: CONVERSANT IP N.B. 868 INC.
To: CPPIB CREDIT INVESTMENTS INC., AS LENDER; ROYAL BANK OF CANADA, AS LENDER
Reel/Frame 033707/0001 →
Assignment of Assignor's Interest
Jul 22, 2015
From: CONVERSANT IP N.B. 868 INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 036159/0386 →
Amended and Restated U.S. Patent Security Agreement (for Non-U.S. Grantors)
Aug 22, 2018
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS, INC.
Reel/Frame 046900/0136 →
Release of U.S. Patent Agreement (for Non-U.S. Grantors)
Oct 12, 2018
From: ROYAL BANK OF CANADA, AS LENDER
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 047645/0424 →
Release of Security Interest
Nov 10, 2020
From: CPPIB CREDIT INVESTMENTS INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 054371/0884 →