Flexible electronic structure
There is provided a flexible electronic structure for bonding with an external circuit, comprising a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, comprising at least one electronic component; at least one contact member, operatively coupled with said at least one electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and at least one shield member, provided at said first surface so as to shieldingly overlap at least a portion of said at least one electronic component, adapted to withstand a predetermined pressure applied to said first surface and/or said opposing second surface during bonding with the external circuit.
1. A flexible electronic structure for bonding with an external circuit, comprising:
a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, wherein the flexible substrate comprises at least one embedded component;
at least one contact member, operatively coupled with said at least one embedded electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and
at least one mechanical shield member, the at least one mechanical shield member provided at said first surface, the at least one mechanical shield member located between the external circuit and the at least one embedded component during bonding, the at least one mechanical shield member having an overlapping footprint with at least a portion of the at least one embedded component.
2. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member has a predetermined thickness adapted to optimize planarity of said first surface, wherein the at least one mechanical shield member is adapted to withstand a predetermined pressure applied to said first surface and/or said opposing second surface during bonding with the external circuit.
3. The flexible integrated circuit (IC) structure according to claim 1 , wherein any one of said at least one mechanical shield member and said at least one contact member is arranged coplanar with said first surface.
4. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member is operably coupled to said at least one embedded electronic component.
5. The flexible integrated circuit (IC) structure according to claim 4 , wherein said at least one mechanical shield member is configured to provide a ground potential to said at least one embedded electronic component.
6. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member is configured to provide a heat sink or heat spreader for at least a portion of said at least one embedded electronic component.
7. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member is configured to provide electromagnetic shielding to at least a portion of said at least one embedded electronic component.
8. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member comprises a plurality of shield members operably arranged at said first surface.
9. The flexible integrated circuit (IC) structure according to claim 8 , wherein said plurality of mechanical shield members are electrically isolated from one another.
10. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member is electrically isolated from said at least one contact pad.
11. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member is operatively coupled to said at least one contact member.
12. The flexible integrated circuit (IC) structure according to claim 11 , wherein said mechanical shield member is an integral extension of said at least one contact member.
13. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member comprises a patterned contact layout.
14. The flexible integrated circuit (IC) structure according to claim 1 , wherein at least a portion of said at least one mechanical shield member is provided with an insulation layer configured to prevent an electrically conductive connection between said at least one mechanical shield member and the external circuit.
15. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one mechanical shield member is adapted to operably engage with at least a portion of the external circuit.
16. The flexible integrated circuit (IC) structure according to claim 1 , wherein said at least one embedded electronic component is an integrated circuit (IC).
17. The flexible integrated circuit (IC) structure according to claim 1 , wherein said flexible integrated circuit (IC) structure is configured for adhesive bonding with an external circuit.
18. The flexible integrated circuit (IC) structure according to claim 1 , wherein said flexible integrated circuit (IC) structure is configured for solder bump bonding with an external circuit.
19. A flexible electronic structure configured to bond with an external circuit, the flexible electronic structure comprising:
a flexible substrate, having:
a first surface, configured to bond with the external circuit, and
an opposing second surface, configured to engage with a bonding tool, and wherein the flexible substrate comprises at least one embedded component;
at least one contact member, operatively coupled with said at least one embedded electronic component, and associated with the first surface of said flexible substrate, and adapted to operably interface with the external circuit after a bonding has occurred, and
at least one mechanical shield member, the at least one mechanical shield member provided at said first surface, the at least one mechanical shield member located between the external circuit and the at least one embedded component during bonding, the at least one mechanical shield member having an overlapping footprint with at least a portion of the at least one embedded component.