Flexible electronic structure including a support element
There is provided a flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising: a flexible body having a first surface, the flexible body comprising at least one electronic component; at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit.
1. A flexible electronic structure configured to bond with an external circuit, the flexible electronic structure comprising:
a flexible body having a first surface, the flexible body comprising at least one electronic component;
at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and
at least one support element provided at the first surface of the flexible body and in direct contact with the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit,
wherein the at least one contact element comprises a conductive metallic ink, and the at least one contact element is configured to sinter-bond, via the conductive metallic ink, to a corresponding external contact element disposed on the first surface of the external structure, and
wherein the at least one support element is thermally connected to the at least one electronic component and provides heat spreading or heat sinking for the at least one electronic component.
2. The flexible electronic structure of claim 1 , wherein one or more of the at least one support element, the external circuit and the corresponding surface element comprises a conductive metallic ink.
3. The flexible electronic structure of claim 1 , wherein the at least one support element is arranged to provide optical shielding of one or more of the at least one electronic component.
4. The flexible electronic structure of claim 1 , wherein the at least one support element is arranged to provide shielding to one or more of electro-magnetic interference and radiation, for one or more of the at least one electronic component.
5. The flexible electronic structure of claim 1 , wherein the at least one support element and the at least one contact element are formed on the first surface by printing.
6. The flexible electronic structure of claim 1 , wherein the at least one support element and the at least one contact element comprise the same one or more materials.
7. The flexible electronic structure of claim 1 , wherein the flexible electronic structure comprises a plurality of contact elements, wherein the at least one support element is provided between two contact elements of the plurality of contact elements.
8. The flexible electronic structure of claim 1 , wherein the flexible electronic structure comprises a plurality of support elements, each arranged to contact and electrically connect to a corresponding surface element disposed on the surface of external structure, wherein each surface element is an antenna track.
9. The flexible electronic structure of claim 1 , wherein a thermoplastic is provided around the at least one support element to form an underfill between the flexible electronic structure and the external structure.
10. The flexible electronic structure of claim 1 , wherein the at least one contact element and the at least one support element are formed in a redistributive layer (RDL) of the flexible electronic structure.
11. The flexible electronic structure of claim 1 , wherein each support element is configured to bond with the corresponding surface element via a conductive, adhesive, curable fluid, or via sintered metallic ink.
12. The flexible electronic structure of claim 1 , wherein the flexible electronic structure is a thin-film integrated circuit, IC, or a flexible IC.