Method for producing 3D semiconductor devices and structures with transistors and memory cells
A method for producing a 3D semiconductor device including: providing a first level, including a single crystal layer; forming memory control circuits in and/or on the first level which include first single crystal transistors and at least two interconnection metal layers; forming at least one second level disposed above the memory control circuits; performing a first etch step into the second level; forming at least one third level on top of the second level; performing additional processing steps to form first memory cells within the second level and second memory cells within the third level, where each of the first memory cells include at least one second transistor including a metal gate, where each of the second memory cells include at least one third transistor; and performing bonding of the first level to the second level, where the bonding includes oxide to oxide bonding.
1. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming memory control circuits in and/or on said first level,
wherein said memory control circuits comprise first single crystal transistors, and
wherein said memory control circuits comprise at least two interconnection metal layers;
forming at least one second level disposed above said memory control circuits;
performing a first etch step into said second level;
forming at least one third level disposed on top of said second level;
performing additional processing steps to form a plurality of first memory cells within said second level and a plurality of second memory cells within said third level,
wherein each of said plurality of first memory cells comprise at least one second transistor,
wherein each of said plurality of second memory cells comprise at least one third transistor, and
wherein said at least one second transistor comprises a metal gate; and
performing bonding of said first level to said second level,
wherein said bonding comprises oxide to oxide bonding.
2. The method according to claim 1 , further comprising:
processing said first memory cells into nonvolatile type memory cells.
3. The method according to claim 1 ,
wherein said second level comprises at least two overlaying layers.
4. The method according to claim 1 ,
wherein said first etch step comprises reactive ion etching (“RIE”).
5. The method according to claim 1 ,
wherein said performing additional processing steps comprises using Atomic Layer Deposition (ALD).
6. The method according to claim 1 ,
wherein said metal gate comprises tungsten.
7. The method according to claim 1 ,
wherein said additional processing steps comprise depositing a gate electrode simultaneously for said at least one second transistor and said at least one third transistor.
8. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming memory control circuits in and/or on said first level,
wherein said memory control circuits comprise first single crystal transistors, and
wherein said memory control circuits comprise at least two interconnection metal layers;
forming at least one second level disposed above said memory control circuits;
performing a first etch step into said second level;
forming at least one third level disposed on top of said second level; and
performing additional processing steps to form a plurality of first memory cells within said second level and a plurality of second memory cells within said third level,
wherein each of said plurality of first memory cells comprise at least one second transistor,
wherein each of said plurality of second memory cells comprise at least one third transistor,
wherein said additional processing steps comprise depositing a gate electrode simultaneously for said at least one second transistor and said at least one third transistor,
wherein said step of forming memory control circuits comprises an annealing step for dopant activation, and
wherein said annealing is reduced to accommodate upcoming annealing steps for said second level and said third level.
9. The method according to claim 8 ,
wherein said performing additional processing steps comprises using Atomic Layer Deposition (ALD).
10. The method according to claim 8 ,
wherein said second level comprises at least two overlaying layers.
11. The method according to claim 8 ,
wherein said gate electrode comprises tungsten.
12. The method according to claim 8 ,
wherein said first etch step comprises reactive ion etching (“RIE”).
13. The method according to claim 8 , further comprising:
performing bonding of said first level to said second level, wherein said bonding comprises oxide to oxide bonding.
14. The method according to claim 8 ,
wherein said memory cells comprise a NAND type memory.
15. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming memory control circuits in and/or on said first level,
wherein said memory control circuits comprise first single crystal transistors, and
wherein said memory control circuits comprise at least two interconnection metal layers;
forming at least one second level disposed above said memory control circuits;
performing a first etch step into said second level;
forming at least one third level disposed on top of said second level;
performing additional processing steps to form a plurality of first memory cells within said second level and a plurality of second memory cells within said third level,
wherein each of said plurality of first memory cells comprise at least one second transistor,
wherein each of said plurality of second memory cells comprise at least one third transistor; and
performing processing steps to form a plurality of vias disposed through said third level and said second level to connect to at least one of said at least two interconnection metal layers.
16. The method according to claim 15 ,
wherein said additional processing steps comprise depositing a gate electrode simultaneously for said at least one second transistor and said at least one third transistor.
17. The method according to claim 15 ,
wherein said second level comprises at least two overlaying layers.
18. The method according to claim 15 ,
wherein said at least one second transistor comprises a metal gate.
19. The method according to claim 15 ,
wherein said memory cells comprise a NAND type memory.
20. The method according to claim 15 , further comprising:
performing bonding of said first level to said second level,
wherein said bonding comprises oxide to oxide bonding.