IP Library › Assignment 013712/0412
Patent Assignment
Reel/Frame 013712/0412

Security Interest

Recorded: 2003-02-04 Pages: 41
Assignors
VISHAY INTERTECHNOLOGY, INC.
Executed: 2002-12-13
Assignee
COMERICA BANK, AS AGENT
39200 W. SIX MILE RD., LIVONIA, MICHIGAN, 48152
Covered Properties (152)
Electrical Resistor
Patent: 4,467,311 →
Application: 06/490,853 →
Reactor and Susceptor for Chemical Vapor Deposition Process
Patent: 4,522,149 →
Application: 06/553,962 →
Direct Current Dot Matrix Plasma Display Having Integrated Drivers
Patent: 4,613,855 →
Application: 06/586,313 →
Two Terminal Axial Lead Suppressor and Diode Bridge Device
Patent: 4,599,636 →
Application: 06/587,392 →
Electrical Resistor
Patent: 4,529,958 →
Application: 06/621,619 →
Method and Apparatus for Assembling Semiconductor Devices Such as Leds or Optodetectors
Patent: 4,590,667 →
Application: 06/643,064 →
Rectifier with Slug Construction and Mold for Fabricating Same
Patent: 4,564,885 →
Application: 06/648,672 →
Solid Electrolyte Capacitor for Surface Mounting
Patent: 4,571,664 →
Application: 06/670,088 →
Precision Power Resistor with Very Low Temperature Coefficient of Resistance
Patent: 4,677,413 →
Application: 06/673,481 →
Rotary Switch with Reflector Coded Actuator Drum
Patent: 4,634,861 →
Application: 06/683,600 →
Schottky Barrier Device and Method of Manufacture
Patent: 4,638,551 →
Application: 06/703,703 →
Method for Forming High Yield Epitaxial Wafers
Patent: 4,659,400 →
Application: 06/750,488 →
Method for Fabricating a Rectifying P-N Junction Having Improved Breakdown Voltage Characteristics
Patent: 4,740,477 →
Application: 06/784,451 →
Plasma Display Having Heater and Method of Making Same
Patent: 4,692,655 →
Application: 06/797,921 →
Fail-Safe Lead Configuration for Polar Smd Components
Patent: 4,660,127 →
Application: 06/810,445 →
Solid Electrolyte Chip Capacitor Method
Patent: 4,688,322 →
Application: 06/826,643 →
Method of Forming a Solid Tantalum Capaitor
Patent: 4,706,375 →
Application: 06/896,686 →
Schottky Barrier Device with Doped Composite Guard Ring
Patent: 4,742,377 →
Application: 06/922,532 →
Immersion Cartesian Ovoid Lens
Patent: 4,869,580 →
Application: 06/933,383 →
Method and Apparatus for Insulating High Voltage Semiconductor Structures
Patent: 4,789,886 →
Application: 07/005,412 →
A Rectifying P-N Junction Having Improved Breakdown Voltage Characteristics and Method for Fabricating Same
Patent: 4,891,685 →
Application: 07/142,737 →
Wafer Level Process for Fabricating Passinated Semiconductor Devices
Patent: 4,904,610 →
Application: 07/143,916 →
Method for Setting the Threshold Voltage of a Vertical Power Mosfet
Patent: 4,859,621 →
Application: 07/150,755 →
Method of Fabricating a Brazed Glass Pre-Passivated Chip Rectifier
Patent: 4,942,139 →
Application: 07/151,066 →
Square Body Leadless Electrical Device
Patent: 4,829,406 →
Application: 07/164,219 →
Adjustment of Thin Film Capacitors
Patent: 4,894,316 →
Application: 07/210,034 →
Surface Mount Wirewound Resistor and Method of Making the Same
Patent: 4,884,053 →
Application: 07/236,718 →
Dot Matrix Plasma Display and Method for Driving Same
Patent: 33,520 →
Application: 07/263,780 →
Brazing Material
Patent: 4,921,158 →
Application: 07/314,808 →
Communication Network
Patent: 4,937,811 →
Application: 07/315,471 →
Alternate Pulse Inversion Encoding Scheme for Serial Data Transmission
Patent: 4,897,854 →
Application: 07/315,557 →
Method for Setting the Threshold Voltage of a Power Mosfet
Patent: 4,929,987 →
Application: 07/358,883 →
Adjustment of Thin Film Capacitors
Patent: 5,004,658 →
Application: 07/365,086 →
Method of Making a Passivated P-N Junction in a Mesa Semiconductor Structure
Patent: 4,980,315 →
Application: 07/365,519 →
Method of Making a Thermistor
Patent: 4,993,142 →
Application: 07/368,281 →
Semiconductor Package, Method of Manufacturing the Same, Apparatus for Carrying Out the Method, and Assembly Facility
Patent: 5,083,193 →
Application: 07/389,718 →
Method of Making a Surface Mount Wirewound Resistor
Patent: 4,926,542 →
Application: 07/396,067 →
Gold Diffusion Thin Film Resistors and Process
Patent: 5,023,589 →
Application: 07/404,590 →
Method for Fabricating a Rectifying Semiconductor Junction Having Improved Breakdown Voltage Characteristics
Patent: 5,010,023 →
Application: 07/404,604 →
Packaged Diode for High Temperature Operation
Patent: 5,008,735 →
Application: 07/447,213 →
Brazed Glass Pre-Passivated Chip Rectifier
Patent: 4,987,476 →
Application: 07/480,367 →
Method for Controlling the Switching Speed of Bipolar Power Devices
Patent: 5,097,308 →
Application: 07/492,117 →
Method for Making a Lead Frame with Fuse and Product Made Thereby
Patent: 5,011,067 →
Application: 07/500,351 →
Thermistor
Patent: 5,160,912 →
Application: 07/579,362 →
Laser-Formed Electrical Component and Method for Making Same
Patent: 5,091,286 →
Application: 07/587,761 →
Two-Terminal Series-Connected Network
Patent: 5,093,774 →
Application: 07/673,714 →
Fuzed Solid Electrolyte Capacitor
Patent: 5,099,397 →
Application: 07/677,203 →
Molded Fuzed Solid Electrolyte Capacitor
Patent: 5,053,927 →
Application: 07/677,204 →
Method for Controlling the Switching Speed of Bipolar Power Devices
Patent: 5,102,810 →
Application: 07/684,682 →
Electrical Resistors and Methods of Making Same
Patent: 5,206,623 →
Application: 07/695,044 →
Wet Tantalum Capacitor with Liner
Patent: 5,105,341 →
Application: 07/709,165 →
Surface Mountable Rectifier and Method for Fabricating Same
Patent: 5,151,846 →
Application: 07/748,876 →
Surface Mounting Diode
Patent: 5,248,902 →
Application: 07/752,749 →
Method of Making Polyaniline Solid Electrolyte Capacitor
Patent: 5,223,002 →
Application: 07/786,315 →
Touch Panel and Method for Controlling Same
Patent: 5,179,369 →
Application: 07/806,143 →
Hermetic Surface Mount Package for a Two Terminal Semiconductor Device
Patent: 5,528,079 →
Application: 07/811,726 →
Low Capacitance Silicon Transient Suppressor with Monolithic Structure
Patent: 5,245,412 →
Application: 07/836,491 →
Semiconductor Devices Having Copper Terminal Leads
Patent: 5,304,429 →
Application: 07/856,715 →
Bulk Metal Chip Resistor
Patent: 5,287,083 →
Application: 07/860,403 →
Monolythic Multilayer Chip Inductor and Method for Making Same
Patent: 5,302,932 →
Application: 07/881,856 →
Passivated Mesa Semiconductor and Method for Making Same
Patent: 5,166,769 →
Application: 07/884,325 →
Monolythic Surge Suprressor
Patent: 5,321,573 →
Application: 07/914,801 →
Surge Protection Circuit Module and Method for Assembling Same
Patent: 5,371,647 →
Application: 07/917,778 →
Method for Making Passivated Mesa Semiconductor
Patent: 5,278,095 →
Application: 07/921,900 →
Method for Fabricating a Multilayer Epitaxial Structure
Patent: 5,324,685 →
Application: 08/015,384 →
Low Cost Method of Fabricating Epitaxial Semiconductor Devices
Patent: 5,360,509 →
Application: 08/021,130 →
Method of Growing a Semiconductor Material by Epilaxy
Patent: 5,342,805 →
Application: 08/082,951 →
Method of Making Semiconductor Devices Using Epitaxial Techniques Techniques to Form Si/Si-Ge Interfaces and Inverting the Material
Patent: 5,298,457 →
Application: 08/082,952 →
Case for Semiconductor Circuit of a Surge Protector
Patent: 6,239,987 →
Application: 08/218,802 →
Surge Protector Semiconductor Subassembly for 3-Lead Transistor Outline Pakcage
Patent: 5,512,784 →
Application: 08/229,555 →
Semiconductor Devices Having a Mesa Structure and Method of Fabrication for Improved Surface Voltage Breakdown Characteristics
Patent: 5,399,901 →
Application: 08/230,299 →
Method for Fabricating a Multilayer Epitaxial Structure
Patent: 5,432,121 →
Application: 08/242,877 →
Capacitor Manufacturing Technique
Patent: 5,512,315 →
Application: 08/251,907 →
Fabrication of Hybrid Semiconductor Devices
Patent: 5,484,097 →
Application: 08/273,854 →
Automated Assembly of Semiconductor Devices Using a Pair of Lead Frames
Patent: 5,506,174 →
Application: 08/274,009 →
Method of Making an Electronic Thick Film Component Multile Terminal
Patent: 5,572,779 →
Application: 08/336,538 →
Surface Mount Resistor and Method for Making Same
Patent: 5,604,477 →
Application: 08/350,960 →
Low Cost Method of Fabricating Shallow Junction, Schottky Semi- Conductor Devices
Patent: 5,635,414 →
Application: 08/409,762 →
Gas Flow System for Cvd Reactor
Patent: 5,571,329 →
Application: 08/411,408 →
Laser Slag Removal
Patent: 5,595,668 →
Application: 08/417,092 →
Lead with Slits for Reducing Solder Overflow and Eliminating Air Gaps in the Execution of Solder Joints
Patent: 5,631,806 →
Application: 08/509,378 →
A Method for Encapsulating a Semiconductor Utilizing an Epoxy Resin and an Onium Salt Compound
Patent: 5,610,443 →
Application: 08/524,869 →
Capacitor Terminal Cover Assembly
Patent: 5,679,033 →
Application: 08/531,446 →
Method and Apparatus for Recovering Synchronizing Signals in Scrambled Television Pictures
Patent: 5,644,637 →
Application: 08/534,723 →
Laser Formed Electrical Component and Method for Making the Same
Patent: 5,639,391 →
Application: 08/539,506 →
Electroplating Apparatus
Patent: 5,817,220 →
Application: 08/541,605 →
Monolithic Multilayer Chip Inductor Having a No-Connnect Terminal
Patent: 5,614,757 →
Application: 08/548,555 →
Mesa Semiconductor Structure
Patent: 5,610,434 →
Application: 08/554,749 →
Automated Assembly of Semiconductor Devices Using a Pair of Lead Frames
Patent: 5,614,759 →
Application: 08/579,232 →
Apparatus for the Injection Molding of Semiconductor Elements
Patent: 5,698,242 →
Application: 08/580,070 →
High Voltage Silicon Diode with Optimum Placement of Silicon-Germanium Layers
Patent: 5,640,043 →
Application: 08/580,071 →
Amplifier Using a Single Forward Pilot Signal to Control Forward and Return Automatic Slope Circuits Therein
Patent: 5,724,344 →
Application: 08/626,352 →
Monolithic Multilayer Ultra Thin Chip Inductors and Method for Making Same
Patent: 5,688,711 →
Application: 08/643,308 →
Planar P-N Junction Semiconductor Structure with Multilayer Passivation
Patent: 5,677,562 →
Application: 08/649,135 →
Magnetic Ink and Method for Manufacturing and Sifting Out of Defective Dice by Using the Same
Patent: 5,811,314 →
Application: 08/660,135 →
Monolithic Thick Film Inductor
Patent: 5,986,533 →
Application: 08/665,788 →
Semiconductor Device Having a Shorter Switching Time with Low Forward Voltage
Patent: 5,814,874 →
Application: 08/680,669 →
Method of Fabricating Semiconductor Devices Having a Mesa Structure for Improved Surface Voltage Breakdown Characteristics
Patent: 5,950,068 →
Application: 08/705,616 →
Apparatus and Method for Conformally Coating a Capacitor
Patent: 5,888,590 →
Application: 08/710,364 →
Low Profile Inductor/Transformer Component
Patent: 5,760,669 →
Application: 08/736,333 →
Non Polar Tantalum Capacitor
Patent: 5,777,840 →
Application: 08/740,500 →
Process and Auxiliary Device for Fabricating Semiconductor Devices
Patent: 5,858,808 →
Application: 08/784,002 →
Doped Sintered Tantalum Pellets with Nitrogen in a Capacitor
Patent: 5,825,611 →
Application: 08/790,293 →
Process for Manufacturing Semiconductor Devices with Active Structures
Patent: 5,976,901 →
Application: 08/804,422 →
Semiconductor Device Soldering Process
Patent: 5,830,781 →
Application: 08/845,009 →
Semiconductor Device Having a Mesa Structure for Surface Voltage Breakdown
Patent: 5,773,874 →
Application: 08/854,475 →
Method of Makng Monolithic Thick Film Inductor
Patent: 5,970,604 →
Application: 08/881,480 →
A Method of Injection Molding Elements Such as Semiconductor Elements
Patent: 6,068,809 →
Application: 08/900,651 →
High Self Resonant Frequency Multilayer Inductor and Method for Making Same
Patent: 5,880,662 →
Application: 08/915,875 →
Thick Film Low Value High Frequency Inductor, and Method of Making the Same
Patent: 5,922,514 →
Application: 08/936,193 →
Surface Mount Resistor and a Method of Making the Same
Patent: 6,148,502 →
Application: 08/946,734 →
Fabricating Diode with Improved Reverse Energy Characteristics End Start Method For
Patent: 5,930,660 →
Application: 08/953,670 →
High Current, Low Profile Inductor
Patent: 6,204,744 →
Application: 08/963,224 →
Semiconductor Chips Having a Mesa Structure Provided by Sawing
Patent: 5,882,986 →
Application: 09/050,106 →
Method for Doping Sintered Tantalum Pellets with Nitrogen
Patent: 6,010,660 →
Application: 09/064,475 →
Multi-Tap Thin Film Inductor
Patent: 6,159,817 →
Application: 09/074,185 →
Thick Film Low Value High Frequency Inductor, and Method of Making the Same
Patent: 6,215,387 →
Application: 09/080,494 →
Low Cost Method of Fabricating Transient Voltage Suppressor Semiconductor Devices or the Like
Patent: 6,248,651 →
Application: 09/103,731 →
Via Formation for Multilayer Inductive Devices and Other Devices
Patent: 6,207,234 →
Application: 09/103,962 →
Method for Doping Sintered Tantalum and Niobium Pellets with Nitrogen
Patent: 6,185,090 →
Application: 09/146,685 →
Tantalum Chip Capacitor and Method
Patent: 6,238,444 →
Application: 09/167,690 →
Method for Fabricating Passivated Semiconductor Devices
Patent: 6,291,316 →
Application: 09/233,706 →
Surface Mounted Four Terminal Resistor
Patent: 5,999,085 →
Application: 09/247,490 →
Inductor Coil Structure
Patent: 6,198,375 →
Application: 09/271,748 →
Capacitor Pellet and Lead Assembly
Patent: 6,212,065 →
Application: 09/283,720 →
Capacitor Having Textured Pellet and Method for Making Same
Patent: 6,191,936 →
Application: 09/289,995 →
Controller for Use in an Interconnection System
Patent: 6,239,714 →
Application: 09/353,209 →
Fabrication of Hybrid Semiconductor Devices
Patent: 6,281,043 →
Application: 09/382,131 →
Thick Film Low Value High Frequency Inductor, and Method of Making the Same
Patent: 6,294,756 →
Application: 09/428,186 →
Method and Apparatus for Semiconductor Chip Handling
Patent: 6,283,693 →
Application: 09/440,012 →
Surface Mount Resistor
Patent: 6,184,775 →
Application: 09/441,434 →
Thick Film Low Value High Frequency Inductor, and Method of Making the Same
Patent: 6,201,215 →
Application: 09/448,676 →
Electro-Pyrotechnic Initiator
Patent: 6,324,979 →
Application: 09/466,939 →
Method for Making Overlay Surface Mount Resistor
Patent: 6,401,329 →
Application: 09/471,622 →
Monolithic Heat Sinking Resistor
Patent: 6,181,234 →
Application: 09/474,448 →
Method for Doping Sintered Tantalum and Niobium Pellets with Nitrogen
Patent: 6,410,083 →
Application: 09/514,221 →
High speed trench dmos
Patent: 6,312,993 →
Application: 09/515,749 →
Method for Making Inductor Coil Structure
Patent: 6,449,829 →
Application: 09/546,859 →
Method for Making a High Current Low Profile Inductor
Patent: 6,460,244 →
Application: 09/547,155 →
Semiconductor device fabrication using adhesives
Patent: 6,197,618 →
Application: 09/564,492 →
Capacitor mold and method for using same
Patent: 6,284,555 →
Application: 09/576,825 →
Method for Centering Capacitor in Mold
Patent: 6,368,364 →
Application: 09/577,745 →
Method for Making Capacitor Pellet and Lead Assembly
Patent: 6,319,292 →
Application: 09/586,632 →
Tantalum Chip Capacitor
Patent: 6,380,577 →
Application: 09/612,143 →
Method of forming trench MOS device and termination structure
Patent: 6,309,929 →
Application: 09/668,906 →
Overlay Surface Mount Resistor
Patent: 6,441,718 →
Application: 09/715,252 →
Thick Film Low Value High Frequency Inductor, and Method of Making the Same
Patent: 6,391,526 →
Application: 09/722,853 →
Sintered Tantalum and Niobium Capacitor Pellets Doped with Nitrogen, and Method of Making the Same
Patent: 6,447,570 →
Application: 09/726,866 →
Publication: US 2002/0101645
Center Molded Capacitor
Patent: 6,483,693 →
Application: 09/809,477 →
Publication: US 2002/0048146
Method for Making Conductive Polymer Capacitor
Patent: 6,451,074 →
Application: 09/824,287 →
Publication: US 2001/0018788
Structure of making a thick film low value high frequency inductor
Patent: 6,366,192 →
Application: 09/834,123 →
Publication: US 2001/0019298
Capacitor Termination Assembly
Patent: 6,411,499 →
Application: 09/843,109 →
Publication: US 2001/0044994
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jan 27, 1988
From: SHYR, RICHARD
To: GENERAL INSTRUMENT CORPORATION, A DE. CORP.
Reel/Frame 004820/0933 →
Assignment of Assignors Interest. Feb 1, 1988
From: KORWIN-PAWLOWSKI, MICHAEL
To: GENERAL INSTRUMENT CORPORATION, A CORP. OF DE.
Reel/Frame 004831/0042 →
Assignment of Assignors Interest. Feb 1, 1988
From: EINTHOVEN, WILLEM G.
To: GENERAL INSTRUMENT CORPORATION, A CORP. OF DE.
Reel/Frame 004822/0934 →
Assignment of Assignors Interest. Mar 4, 1988
From: KORWIN-PAWLOWSKI, MICHAEL
To: GENERAL INSTRUMENT CORPORATION, A DE. CORP.
Reel/Frame 004859/0917 →
Assignment of Assignors Interest. Nov 19, 1992
From: GENERAL SEMICONDUCTOR INDUSTRIES, INC.
To: GI CORPORATION
Reel/Frame 006363/0579 →
Assignment of Assignors Interest. Mar 1, 1993
From: SPRAGUE ELECTRIC COMPANY
To: VISHAY SPRAGUE, INC.
Reel/Frame 006445/0261 →
Security Interest Jul 13, 1995
From: QT OPTOELECTRONICS, A CA CORP., FORMERLY KNOWN AS QUAESTUS CORPORATION
To: GREYROCK BUSINESS CREDIT, A DIVISION OF GREYROCK CAPITAL GROUP, INC.
Reel/Frame 007908/0662 →
Assignment of Assignor's Interest Jul 18, 1995
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: VISHAY INTERTECHNOLOGY, INC.
Reel/Frame 007553/0433 →
Change of Name Aug 14, 1995
From: QUAESTUS CORPORATION
To: QT OPTOELECTRONICS
Reel/Frame 007577/0752 →
Correcting Patent Number in the Attached Recordation of the Assignment and Request for Recordation of Name Change Oct 15, 1996
From: QUALITY TECHNOLOGIES CORPORATION
To: QUAESTUS CORPORATION
Reel/Frame 008178/0916 →
Termination of Security Agreement Sep 9, 1998
From: GREYROCK BUSINESS CREDIT, A DIVISION OF NATIONSCREDIT COMMERCIAL CORPORATION
To: QT OPTOELECTRONICS
Reel/Frame 009436/0846 →
Change of Name Dec 4, 1998
From: GENERAL INSTRUMENT CORPORATION
To: GI CORPORATION
Reel/Frame 009614/0290 →
Change of Name Dec 7, 1998
From: GI CORPORATION
To: GENERAL INSTRUMENT CORPORATION OF DELAWARE
Reel/Frame 009605/0813 →
Merger Dec 10, 1998
From: GENERAL INSTRUMENT CORPORATION OF DELAWARE
To: GENERAL INSTRUMENT CORPORATION
Reel/Frame 009614/0579 →
Change of Name Dec 16, 1998
From: GENERAL INSTRUMENT CORPORATION
To: GENERAL SEMICONDUCTOR, INC.
Reel/Frame 009624/0532 →
Security Interest Nov 12, 1999
From: GENERAL SEMICONDUCTOR, INC.
To: CHASE MANHATTAN BANK, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 010388/0894 →
Release of Security Interest Dec 13, 1999
From: MANUFACTURERS BANK N.A.
To: DALE ELECTRONICS, INC.
Reel/Frame 010452/0180 →
Assignment of Assignor's Interest Dec 30, 1999
From: DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 010514/0379 →
Release of Security Interest Jul 17, 2000
From: MANUFACTURERS BANK N.A., A NATIONAL BANKING ASSOCIATION
To: VISHAY SPRAQUE, INC.
Reel/Frame 010968/0025 →
Terminaiton and Release of Security Interest in Patent Rights Jan 8, 2002
From: CHASE MANHATTAN BANK, THE, AS ADMINISTRATIVE AGENT
To: GENERAL SEMICONDUCTOR, INC.
Reel/Frame 012376/0244 →
Release of Security Interest Feb 11, 2002
From: THE CHASEMANHATTAN BANK
To: GENERAL SENICODUCT
Reel/Frame 012559/0302 →