Patent Assignment
Reel/Frame 016851/0953
Assignment of Assignor's Interest
Recorded: 2005-10-07
Received: 2005-10-07
Pages: 4
Assignor
THERMA-WAVE, INC.
Executed: 2005-09-27
Assignee
TOKYO ELECTRON LIMITED
TBS BROADCAST CENTER, 3-6 AKASAKA 5-CHOME MINATO-KU, TOKYO, JPX, 107-8481, JAPAN
Covered Properties
(40)
Polarimetric Scatterometry Methods for Critical Dimension Measurements of Periodic Structures
Application:
11/105,099 →
Apparatus for Imaging Metrology
Application:
11/048,552 →
Measurement System Cluster
Application:
11/012,940 →
Method and Apparatus to Reduce Spotsize in an Optical Metrology Instrument
Application:
10/957,249 →
Method of Measuring Meso-Scale Structures on Wafers
Application:
10/919,718 →
Overlay Alignment Metrology Using Diffraction Gratings
Application:
10/917,219 →
Multiple Beam Ellipsometer
Application:
10/893,449 →
Apparatus and Method for Measuring Overlay by Diffraction Gratings
Application:
10/858,587 →
Diffracting, Aperiodic Targets for Overlay Metrology and Method to Detect Gross Overlay
Application:
10/858,691 →
Polarimetric Scatterometry Methods for Critical Dimension Measurements of Periodic Structures
Application:
10/857,223 →
Floor cleaning implement
Application:
10/826,739 →
Feed Forward Critical Dimension Control
Application:
10/801,023 →
Accurate Small-Spot Spectrometry Systems and Methods
Application:
10/796,322 →
Database Interpolation Method for Optical Measurement of Diffractive Microstructures
Application:
10/777,353 →
Measurement of Overlay Using Diffraction Gratings When Overlay Exceeds the Grating Period
Application:
10/714,460 →
Integrated Surface Metrology
Application:
10/654,073 →
Interferometry-based method and apparatus for overlay metrology
Application:
10/639,661 →
Method of Measuring Meso-Scale Structures on Wafers
Application:
10/621,218 →
Overlay Metrology Method and Apparatus Using More Than One Grating Per Measurement Direction
Application:
10/613,378 →
Reduced Multicubic Database Interpolation Method for Optical Measurement of Diffractive Microstructures
Application:
10/611,298 →
Wafer Metrology Apparatus and Method
Application:
10/397,917 →
Scatterometry by Phase Sensitive Reflectometer
Application:
10/387,772 →
Method and Apparatus for Position-Dependent Optical Metrology Calibration
Application:
10/317,898 →
Accurate Small-Spot Spectrometry Instrument
Application:
10/290,730 →
Measurement System Cluster
Application:
10/132,538 →
Systems and Methods for Metrology Recipe and Model Generation
Application:
10/132,553 →
Polarimetric Scatterometer for Critical Dimension Measurements of Periodic Structures
Application:
10/112,138 →
Small-Spot Spectrometry Instrument with Reduced Polarization and Multiple-Element Depolarizer Therefor
Application:
10/081,078 →
Overlay Alignment Metrology Using Diffraction Gratings
Application:
10/074,561 →
Multiple Beam Ellipsometer
Application:
10/042,592 →
Bi-Functional nonwoven fabric wipe
Application:
09/997,673 →
Method of Measuring Meso-Scale Structures on Wafers
Application:
09/999,410 →
Spectroscopic Ellipsometer Without Rotating Components
Application:
09/956,356 →
Optimized Aperture Shape for Optical Cd/Profile Metrology
Application:
09/938,415 →
Small-Spot Spectrometry Instrument with Reduced Polarization
Application:
09/932,548 →
Notch and Flat Sensor for Wafer Alignment
Application:
09/932,786 →
Bathless Wafer Measurement Apparatus and Method
Application:
09/927,142 →
Database Interpolation Method for Optical Measurement of Diffractive Microstructures
Application:
09/927,177 →
Optical critical dimension metrology system integrated into semiconductor wafer process tool
Application:
09/927,102 →
Method of Detecting Residue on a Polished Wafer
Application:
09/800,306 →