Patent Assignment
Reel/Frame 019899/0814
Merger
Recorded: 2007-10-02
Pages: 66
Assignor
ASML US, INC.
Executed: 2003-10-10
Assignee
THERMAL ACQUISITION CORP.
440 KINGS VILLAGE ROAD, SCOTTS VALLEY, CALIFORNIA, 95066-4081
Covered Properties
(33)
Diffusion Furnace Multizone Temperature Control
Patent:
4,711,989 →
Application:
06/864,676 →
Semiconductor Wafer Boat Loader Releasable Mounting
Patent:
4,721,424 →
Application:
06/880,460 →
Low Temperature Silicon Nitride Cvd Process
Patent:
4,720,395 →
Application:
06/899,923 →
Wafer Transfer Stand
Patent:
4,721,427 →
Application:
07/048,868 →
Hot Wall Diffusion Furnace and Method for Operating the Furnace
Patent:
4,886,954 →
Application:
07/181,787 →
Chemical Vapor Deposition Reactor and Method of Operation
Patent:
4,993,358 →
Application:
07/386,903 →
Multi-Zone Planar Heater Assembly and Method of Operation
Patent:
5,059,770 →
Application:
07/409,125 →
Electrically Insulating Pipe Coupling Apparatus
Patent:
5,088,773 →
Application:
07/570,122 →
Liquid Source Bubbler
Patent:
5,078,922 →
Application:
07/601,270 →
Method for Producing Highly Conductive and Transparent Films of Tin and Fluorine Doped Indium Oxide by Apcvd
Patent:
5,122,391 →
Application:
07/668,858 →
Gas Heater for Processing Gases
Patent:
5,377,300 →
Application:
07/971,490 →
Thermal Processing Apparatus and Process
Patent:
5,626,680 →
Application:
08/399,108 →
Method of Stress-Relieving Silicon Oxide Films
Patent:
5,786,278 →
Application:
08/704,227 →
Optimization of SIO2 Film Conformality in Atmospheric Pressure Chemical Vapor Deposition
Patent:
5,855,957 →
Application:
08/801,997 →
Thermal Processing Apparatus
Patent:
6,005,225 →
Application:
08/827,542 →
Exhaust Vent Assembly for Chemical Vapor Deposition Systems
Patent:
5,938,851 →
Application:
08/838,882 →
Protective Gas Shield for Chemical Vapor Deposition Apparatus
Patent:
5,944,900 →
Application:
08/976,928 →
Free Floating Shield
Patent:
5,849,088 →
Application:
09/008,024 →
Wafer Carrier and Semiconductor Apparatus for Processing a Semiconductor Substrate
Patent:
6,026,589 →
Application:
09/018,021 →
High Temperature Substrate Transfer Module
Patent:
5,976,258 →
Application:
09/019,349 →
Low K Dielectric Inorganic/Organic Hybrid Films and Method of Making
Patent:
6,660,391 →
Application:
09/361,667 →
Hot Wall Rapid Thermal Processor
Patent:
6,300,600 →
Application:
09/373,894 →
Chemical Vapor Deposition System and Method
Patent:
6,206,973 →
Application:
09/480,730 →
Free floating shield and semiconductor processing system
Patent:
6,352,592 →
Application:
09/492,420 →
Trench isolation process to deposit a trench fill oxide prior to sidewall liner oxidation growth
Patent:
6,387,764 →
Application:
09/541,395 →
Chemical vapor deposition of silicon oxide films using alkylsiloxane oligomers with ozone
Patent:
6,465,044 →
Application:
09/542,612 →
Protective Gas Shield Apparatus
Patent:
6,576,060 →
Application:
09/574,826 →
Method of Chemical Mechanical Polishing
Patent:
6,458,013 →
Application:
09/628,962 →
Hot Wall Rapid Thermal Processor
Patent:
6,462,310 →
Application:
09/638,113 →
Hot Wall Rapid Thermal Processor
Apparatus and Method for Chemical Mechanical Polishing of Substrates
High Flow Rate Bubbler System and Method
System and Method for Hydrogen-Rich Selective Oxidation
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 2004
From: AVIZA TECHNOLOGY, INC.
To: TETREON TECHNOLOGIES LIMITED
Reel/Frame 016038/0772 →
Assignment of Assignor's Interest
Apr 12, 2007
From: ASML US, INC.
To: THERMAL ACQUISITION CORPORATION
Reel/Frame 019161/0213 →
Change of Name
Apr 12, 2007
From: THERMAL ACQUISITION CORPORATION
To: AVIZA TECHNOLOGY, INC.
Reel/Frame 019162/0324 →
Intellectual Property Security Agreement
May 9, 2007
From: AVIZA TECHNOLOGY, INC.; AVIZA, INC.
To: UNITED COMMERCIAL BANK
Reel/Frame 019265/0381 →
Merger
Oct 1, 2007
From: SILICON VALLEY GROUP, THERMAL SYSTEMS LLC
To: SILICON VALLEY GROUP, INC.
Reel/Frame 019899/0516 →
Merger
Oct 2, 2007
From: THERMAL ACQUISITION CORP.
To: AVIZA TECHNOLOGY, INC.
Reel/Frame 019910/0076 →
Merger/Change of Name
Oct 2, 2007
From: SILICON VALLEY GROUP, INC.
To: ASML US, INC.
Reel/Frame 019899/0758 →
Re-Record to Correct the Nature of Conveyance , Previously Recorded at Reel 019899 Frame 0758 from Merger/Change of Name to Change of Name.
Mar 23, 2009
From: SILICON VALLEY GROUP, INC.
To: ASML US, INC.
Reel/Frame 022473/0880 →
Assignment of Assignor's Interest
May 7, 2010
From: AVIZA, INC.
To: APPLIED MATERIALS, INC.
Reel/Frame 024351/0669 →
Assignment of Assignor's Interest
Jun 17, 2010
From: AVIZA TECHNOLOGY, INC.
To: APPLIED MATERIALS, INC.
Reel/Frame 024555/0417 →
Security Interest
Apr 2, 2015
From: SPTS TECHNOLOGIES LIMITED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035364/0295 →
Release of Security Interest
Sep 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 036558/0351 →
Assignment of Assignor's Interest
Feb 17, 2016
From: SPTS TECHNOLOGIES, INC.; SPTS TECHNOLOGIES LIMITED
To: SPP TECHNOLOGIES CO., LTD.
Reel/Frame 037746/0599 →
Release of Security Interest
Jul 5, 2016
From: JPMORGAN CHASE BANK, N.A.
To: SPTS TECHNOLOGIES LIMITED
Reel/Frame 039257/0026 →