Patent Assignment
Reel/Frame 047614/0081
Change of Name
Recorded: 2018-11-20
Pages: 4
Assignor
CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Executed: 2016-01-07
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Properties
(24)
End of Range (Eor) Secondary Defect Engineering Using Substitutional Carbon Doping
Integrated Circuit with Protected Implantation Profiles and Method for the Formation Thereof
Method to Fabricate Aligned Dual Damascene Openings
Method to Form a Contact Hole
Methods for Elimination of Arsenic Based Defects in Semiconductor Devices with Isolation Regions
High Density Plasma and Bias Rf Power Process to Make Stable Fsg with Less Free F and Sin with Less H to Enhance the Fsg/Sin Integration Reliability
Method for Cuo Reduction by Using Two Step Nitrogen Oxygen and Reducing Plasma Treatment
Method for Reducing Argon Diffusion from High Density Plasma Films
Laser Activation of Implanted Contact Plug for Memory Bitline Fabrication
Composite Stress Spacer
Integrated Circuit System Using Dual Damascene Process
A Method for Using a Cu Beol Process to Fabricate an Integrated Circuit (Ic) Originally Having an Al Design
Method to Fabricate Aligned Dual Damacene Openings
Method to Enhance Device Performance with Selective Stress Relief
Entire Encapsulation of Cu Interconnects Using Self-Aligned Cusin Film
Integrated Circuit with Protected Implantation Profiles and Method for the Formation Thereof
End of Range (Eor) Secondary Defect Engineering Using Chemical Vapor Deposition (Cvd) Substitutional Carbon Doping
Integrated Circuit System Employing Gate Shield and/or Ground Shield
Method of Integrating Triple Gate Oxide Thickness
Method of Manufacture of an Integrated Circuit System with Self-Aligned Isolation Structures
Method to Enhance Device Performance with Selective Stress Relief
Integrated Circuit System Employing Multiple Exposure Dummy Patterning Technology
Integrated Circuit System Employing Stress-Engineered Spacers
Integrated Circuit System Employing Backside Energy Source for Electrical Contact Formation
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 2, 2019
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0775 →
Assignment of Assignor's Interest
Jul 16, 2020
From: ALSEPHINA INNOVATIONS, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 053351/0839 →