IP Library Granted Patent US 6,946,948
Granted Patent B2
US 6,946,948 · App. 09/878,054 · Granted Sep 20, 2005

Crosspoint switch with switch matrix module

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Quick Facts
Patent No.
US 6,946,948
App. No.
09/878,054
Granted
Sep 20, 2005
Kind
B2
Abstract

A crosspoint switch including a switch matrix modules and programming features. A switch matrix modules include input lines tied to inputs of the switch through precompensation networks. The programming features include user initialization states and reduced and grouping command configuration operations.

Claims (49)

1. A crosspoint switch unit comprising:

a first set of transmission lines;

a second set of transmission lines selectively coupled to the first set of transmission lines;

an amplifier chain coupled to the first set of transmission lines;

a passive network coupled to the amplifier chain;

wherein the amplifier chain comprises a differential signal path having a first signal path and a second signal path and wherein the passive network comprises:

a first capacitance;

a second capacitance;

a first resistance;

a second resistance;

wherein the first resistance is coupled to the first capacitance in a first series path and the second resistance is coupled to the second capacitance in a second series path with the first series path coupled to the first signal path and the second series path coupled to the second signal path; and

a shunt resistance with predetermined resistance shunting the first series path to the second series path;

wherein the first and second resistance, the first and second capacitance and the shunt resistance are fabricated on a monolithic integrated circuit substrate, and at least one of the first and second resistance, the first and second capacitance and the shunt resistance is one of segmented, programmable, and a combination thereof; and

wherein an impedance of the at least one of the first and second resistance, the first and second capacitance and the shunt resistance is selectable after being fabricated on the monolithic integrated circuit substrate.

2. The unit of claim 1 wherein an impedance corresponding to the first capacitance at a first corner frequency is approximately equal to an impedance corresponding to the first resistance and the impedance corresponding to the first capacitance at a second corner frequency is approximately equal to an impedance corresponding to the predetermined resistance of the shunt resistance.

3. The unit of claim 2 wherein the impedance corresponding to the first capacitance is greater than the impedance corresponding to the first resistance at low frequencies generally less than the first corner frequency, and the impedance corresponding to the first capacitance is greater than the impedance corresponding to the shunt resistance at high frequencies generally greater than the second corner frequency.

4. The unit of claim 2 wherein the impedance corresponding to the first capacitance is approximately defined at the low frequencies by the relationship between the predetermined resistance of the shunt resistance, RP, and resistance of the first resistance and the second resistance, RS 1 and RS 2 :

RP

(

RP

+

RS1

+

RP2

)

;

and

the impedance corresponding to the first capacitance is approximately unity at higher frequencies.

5. The unit of claim 2 wherein the amplifier chain has a frequency response in a passband from the first corner frequency to the second corner frequency, wherein impedance values corresponding to the first capacitance in the passband is representative of a precompensation network frequency response, and wherein the precompensation network frequency response is approximately the inverse of the frequency response of the amplifier chain.

6. A crosspoint switch unit comprising:

a switch module;

a passive network having a predefined precompensation frequency response and coupled to the switch module;

wherein the passive network comprises:

two series capacitors, each having a capacitance value approximately equal to a predefined capacitance value;

two series resistors, each having a resistance value approximately equal to a predefined series resistance value;

a shunt resistor having a resistance value approximately equal to a predefined shunt resistance value;

wherein one of the two series resistors is coupled to one of the two series capacitors in a first series path and another one of the two series resistors is coupled to another one of the two series capacitors in a second series path;

wherein the first series path is parallel to the second series path and wherein shunt resistor shunts the first series path to the second series path;

wherein the first series path is coupled to a first differential signal path and the second series path is coupled to a second differential signal path; and

wherein at least one of the two series resistors, the two series capacitors, and the shunt resistor is one of segmented, programmable, and a combination thereof, and wherein an impedance value of the at least one of the two series resistors, the two series capacitors, and the shunt resistor is selectable after being fabricated on the circuit substrate.

7. The unit of claim 6 wherein the switch module comprises:

a circuit substrate; and

a plurality of transmission lines coupled to the substrate;

wherein the passive network is fabricated on the substrate.

8. The unit of claim 7 wherein the switch module further comprises an amplifier section having a predefined amplifier frequency response and wherein the passive network provides a predefined precompensation frequency response tuned to a defined correspondence with the predefined amplifier frequency response.

9. The unit of claim 7 wherein the switch module comprises a first set of transmission lines and a second set of transmission lines orthogonal to the first set of transmission lines, and wherein the passive network is coupled to selected ones of the first set of transmission lines.

10. The unit of claim 9 wherein the transmission lines are differential transmission lines.

11. The unit of claim 6 further comprising an impedance corresponding to the predefined capacitance value at a first corner frequency being approximately equal to an impedance corresponding to the predefined series resistance value and the impedance corresponding to the predefined capacitance value at a second corner frequency being approximately equal to an impedance corresponding to the predefined shunt resistance value.

12. The unit of claim 11 further comprising the impedance corresponding to the predefined capacitance value being greater than the impedance corresponding to the predefined series resistance value at low frequencies generally less than the first corner frequency, and the impedance corresponding to the predefined capacitance value being greater than the impedance corresponding to the predefined shunt resistance value at high frequencies generally greater than the second corner frequency.

Assignments (25)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2017
From: MICROSEMI COMMUNICATIONS, INC.
To: MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 042523/0577 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
MERGER AND CHANGE OF NAME Recorded May 13, 2015
From: VITESSE SEMICONDUCTOR CORPORATION; LLIU100 ACQUISITION CORP.
To: MICROSEMI COMMUNICATIONS, INC.
Reel/Frame 035651/0708 →
SUPPLEMENTAL SECURITY AGREEMENT Recorded Apr 29, 2015
From: MICROSEMI COMMUNICATIONS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035532/0925 →
RELEASE OF SECURITY INTEREST Recorded Apr 28, 2015
From: WHITEBOX VSC, LTD.
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 035526/0090 →
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2014
From: US BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 034176/0162 →
COLLATERAL ASSIGNMENT (INTELLECTUAL PROPERTY) Recorded Nov 5, 2009
From: VITESSE SEMICONDUCTOR CORPORATION
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 023471/0267 →
SECURITY AGREEMENT Recorded Oct 22, 2009
From: VITESSE SEMICONDUCTOR CORPORATION
To: WHITEBOX VSC, LTD.
Reel/Frame 023401/0813 →
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2007
From: OBSIDIAN, LLC, AS COLLATERAL AGENT
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 020112/0306 →
SECURITY AGREEMENT Recorded Jun 29, 2006
From: VITESSE SEMICONDUCTOR CORPORATION
To: OBSIDIAN, LLC, AS COLLATERAL AGENT
Reel/Frame 017846/0847 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2001
From: MCCORMACK, GARY; KYLES, IAN A.; MCCAMANT, ANGUS J.; SEITZ, NORBERT J.; SUTER, RICHARD R.
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 012180/0559 →