Substrate distance monitoring
Embodiments disclosed herein include a faceplate having a sensor assembly, a processing chamber having the same, and a method for monitoring a substrate in a processing chamber. In one embodiment, a faceplate is configured to introduce processing gases into a plasma processing chamber. The faceplate has one or more holes. A sensor assembly is disposed in the one or more holes. The sensor assembly has a sensor and a controller.
1. A faceplate configured to introduce processing gases into a plasma processing chamber, the faceplate comprising:
a disk shaped body having first holes formed through the body; and
a first sensor assembly disposed in one of the first holes, the first sensor assembly having second holes in the first sensor assembly, the second holes being configured to permit a gas to flow through the second holes and the one of the first holes in which the first sensor assembly is disposed, the first sensor assembly further comprising:
a sensor configured to provide a metric indicative of a distance defined between a substrate support and the first sensor assembly.
2. The faceplate of claim 1 further comprising:
at least a second sensor assembly and a third sensor assembly disposed in respective ones of the first holes through the body, the second and third sensor assemblies operable to provide a metric indicative of a distance that a substrate is positioned below the faceplate.
3. The faceplate of claim 2 , wherein the sensor assemblies are disposed at different distances from a center of the body.
4. The faceplate of claim 2 , wherein the first, second and third sensor assemblies are disposed in a first region of the body, and wherein a second region of the body includes additional sensor assemblies that are operable to provide a metric indicative of a distance that a substrate is positioned below the faceplate.
5. The faceplate of claim 1 , wherein the first sensor assembly is operable to communicate wirelessly with a control system.
6. The faceplate of claim 1 , wherein the sensor is aligned within +/−3 degrees from perpendicular to a surface of the body configured to face a substrate support.
7. The faceplate of claim 1 , wherein the sensor is assembly a laser sensor.
8. The faceplate of claim 1 , wherein the sensor is a Fabry-Perot sensor.
9. The faceplate of claim 1 , wherein the first sensor assembly comprises a sensor housing, the sensor housing comprising:
a conical mount having alignment holes; and
a mounting head mated to the conical mount, the mounting head having alignment pins, the alignment pins being inserted in respective ones of the alignment holes, the sensor being disposed in the conical mount and mounting head, the second holes being through the conical mount.
10. A faceplate configured to introduce processing gases into a plasma processing chamber, the faceplate comprising:
a disk shaped body;
a plurality of holes formed through the body; and
a first sensor assembly disposed in one of the plurality of holes, the first sensor assembly comprising:
a fiber optic based sensor configured to provide a metric indicative of a distance defined between a substrate support and the first sensor assembly.
11. The faceplate of claim 10 wherein the fiber optic based sensor is a Fabry-Pérot sensor.
12. The faceplate of claim 10 , wherein the first sensor assembly has second holes in the first sensor assembly, the second holes being configured to permit a gas to flow through the second holes and the one of the plurality of holes in which the first sensor assembly is disposed.
13. The faceplate of claim 12 , wherein the first sensor assembly comprises a sensor housing, the sensor housing comprising:
a conical mount having alignment holes; and
a mounting head mated to the conical mount, the mounting head having alignment pins, the alignment pins being inserted in respective ones of the alignment holes, the sensor being disposed in the conical mount and mounting head, the second holes being through the conical mount.
14. The faceplate of claim 10 further comprising:
a second sensor assembly; and
a third sensor assembly, wherein the second sensor assembly and the third sensor assembly are disposed in respective ones of the plurality of holes through the body, the second and third sensor assemblies operable to provide a metric indicative of a distance that a substrate is positioned below the faceplate.
15. The faceplate of claim 14 , wherein the first sensor assembly, the second sensor assembly, and the third sensor assembly are disposed at different distances from a center of the body.
16. The faceplate of claim 10 , wherein the first sensor assembly is operable to communicate wirelessly with a control system.
17. An apparatus comprising:
a faceplate comprising a disk shaped body having body holes formed through the body, the faceplate being configured for a semiconductor processing chamber; and
a first sensor assembly comprising:
a sensor housing engaged with the body in a first body hole of the body holes, the sensor housing having a housing hole, the housing hole being configured to permit a fluid to flow through the housing hole and the first body hole with the sensor housing engaged with the body; and
a sensor disposed in the sensor housing and configured to provide a metric indicative of a distance defined between a surface and the first sensor assembly.
18. The apparatus of claim 17 , wherein the sensor is a fiber optic based sensor.
19. The apparatus of claim 17 , wherein the sensor is a Fabry-Perot sensor.
20. The apparatus of claim 17 , wherein the sensor housing comprises:
a conical mount having alignment holes; and
a mounting head mated to the conical mount, the mounting head having alignment pins, the alignment pins being inserted in respective ones of the alignment holes, the sensor being disposed in the conical mount and mounting head, the housing hole being through the conical mount.