Multi-chip module (MCM) with multi-port unified memory
Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a common substrate and a first integrated circuit (IC) chip disposed on the common substrate. The first IC chip includes a first memory interface. A second IC chip is disposed on the common substrate and includes a second memory interface. A first memory device is disposed on the common substrate and includes memory and a first port coupled to the memory. The first port is configured for communicating with the first memory interface of the first IC chip. A second port is coupled to the memory and communicates with the second memory interface of the second IC chip. In-memory processing circuitry is coupled to the memory and controls transactions between the first memory device and the first and second IC chips.
1. A chiplet-based multi-chip module (MCM) to mount to a base substrate, the chiplet-based MCM comprising:
a package substrate that is separate from the base substrate;
a first integrated circuit (IC) chiplet coupled to the package substrate and comprising a first memory interface;
a second IC chiplet coupled to the package substrate and comprising a second memory interface; and
a first memory chiplet coupled to the package substrate and comprising
memory comprising a memory space;
a first port coupled to the memory to access any portion of the memory space, the first port to communicate with the first memory interface of the first IC chiplet;
a second port coupled to the memory to access any portion of the memory space, the second port to communicate with the second memory interface of the second IC chiplet; and
in-memory processing circuitry coupled to the memory to control transactions between the first memory chiplet, the first IC chiplet, and the second IC chiplet.
2. The chiplet-based MCM of claim 1 , wherein:
the first port of the first memory chiplet is configurable to allow access to any selected sub-portion of the memory space.
3. The chiplet-based MCM of claim 1 , wherein:
the memory comprises at least one memory IC die; and
the first port, the second port, and the in-memory processing circuitry are formed on a third IC chiplet that is coupled to the at least one memory IC die.
4. The chiplet-based MCM of claim 3 , wherein:
the at least one memory IC die is disposed in a horizontal relationship with the third IC chiplet.
5. The chiplet-based MCM of claim 3 , wherein:
the at least one memory IC die is disposed in a vertical relationship with the third IC chiplet.
6. The chiplet-based MCM of claim 3 , wherein the in-memory processing circuitry comprises:
coprocessing circuitry to perform a processing operation on data stored in the at least one memory IC die on behalf of the first IC chiplet or the second IC chiplet.
7. The chiplet-based MCM of claim 1 , wherein the in-memory processing circuitry comprises:
first network-on-chip (NoC) circuitry to control transfers to and from the first memory chiplet.
8. The chiplet-based MCM of claim 1 , further comprising:
a second memory chiplet comprising a third port coupled to one of the first IC chiplet or the second IC chiplet, the second memory chiplet comprising second in-memory processing circuitry in communication with the in-memory processing circuitry.
9. The chiplet-based MCM of claim 8 , wherein:
the first port of the first memory chiplet is coupled to the first IC chiplet via a first link, the second port of the second memory chiplet is coupled to the second IC chiplet via a second link;
the second port of the first memory chiplet is coupled to the first port of the second memory chiplet via a simultaneous bidirectional link; and
wherein a first memory access to the second memory chiplet by the first IC chiplet occurs concurrent with a second memory access to the first memory chiplet by the second IC chiplet.
10. The chiplet-based MCM of claim 8 , wherein:
the second memory chiplet includes a fourth port; and
wherein the MCM further comprises a third memory chiplet coupled to the fourth port of the second memory chiplet; and
wherein accesses to the third memory chiplet are carried out via the third port and the fourth port of the second memory chiplet.
11. The chiplet-based MCM of claim 8 , wherein:
the second memory chiplet is configured to store first data consistent with a first memory hierarchy; and
wherein the chiplet-based MCM further comprises a third memory chiplet coupled to the second memory chiplet, the third memory chiplet configured to store second data consistent with a second memory hierarchy that is different than the first memory hierarchy.
12. The chiplet-based MCM of claim 1 , wherein:
the first IC chiplet comprises a first processing unit; and
the second IC chiplet comprises a second processing unit.
13. The chiplet-based MCM of claim 12 , wherein:
the first processing unit comprises a first central processing unit (CPU) or a first graphics processing unit (GPU); and
the second processing unit comprises a second CPU or a second GPU.
14. The chiplet-based MCM of claim 1 , wherein the first memory chiplet further comprises:
a third port coupled to the memory to communicate with a third IC chiplet.
15. The chiplet-based MCM of claim 14 , wherein the third IC chiplet comprises:
a second memory chiplet.
16. The chiplet-based MCM of claim 1 , realized as a system-in-package (SiP).
17. The chiplet-based MCM of claim 16 , wherein:
the package substrate comprises an organic standard package substrate.
18. The chiplet-based MCM of claim 17 , wherein:
the first memory chiplet comprises a first high-bandwidth memory (HBM) chiplet.
19. A chiplet-based multi-chip module (MCM) to mount to a base substrate, the chiplet-based MCM comprising:
a package substrate that is separate from the base substrate;
a first integrated circuit (IC) chiplet coupled to the package substrate and comprising a first memory interface;
a second IC chiplet coupled to the package substrate and comprising a second memory interface; and
a first memory chiplet coupled to the package substrate and comprising
at least one dynamic random access memory (DRAM) memory die comprising a memory space;
a logic die coupled to the at least one DRAM memory die, the logic die comprising
a first port coupled to the at least one DRAM memory die to access any portion of the memory space, the first port to communicate with the first memory interface of the first IC chiplet;
a second port coupled to the at least one DRAM memory die to access any portion of the memory space, the second port to communicate with the second memory interface of the second IC chiplet; and
in-memory processing circuitry coupled to the at least one DRAM memory die to control transactions between the first memory chiplet, the first IC chiplet, and the second IC chiplet.
20. The chiplet-based MCM of claim 19 , wherein the in-memory processing circuitry comprises:
coprocessing circuitry to perform a processing operation on data stored in the at least one DRAM memory die on behalf of the first IC chiplet or the second IC chiplet.
21. The chiplet-based MCM of claim 19 , wherein the in-memory processing circuitry comprises:
first network-on-chip (NoC) circuitry to control transfers to and from the first memory chiplet.
22. The chiplet-based MCM of claim 21 , further comprising:
a second memory chiplet coupled to one of the first IC chiplet or the second IC chiplet, the second memory chiplet comprising second NoC circuitry in communication with the first NoC circuitry.
23. The chiplet-based MCM of claim 22 , wherein:
the second memory chiplet is configured to store first data consistent with a first memory hierarchy; and
wherein the chiplet-based MCM further comprises a third memory chiplet coupled to the second memory chiplet, the third memory chiplet configured to store second data consistent with a second memory hierarchy that is different than the first memory hierarchy.
24. The chiplet-based MCM of claim 19 , realized as a system-in-package (SiP).
25. The chiplet-based MCM of claim 24 , wherein:
the package substrate comprises an organic standard package substrate.
26. The chiplet-based MCM of claim 25 , wherein:
the first memory chiplet comprises a first high-bandwidth memory (HBM) chiplet.
27. A method of operation in a chiplet-based multi-chip module (MCM) to mount to a base substrate, the chiplet-based MCM comprising a package substrate that is separate from the base substrate, a first integrated circuit (IC) chiplet coupled to the package substrate, a second IC chiplet coupled to the package substrate, and a first memory chiplet coupled to the package substrate and comprising memory with a memory space and in-memory processing circuitry coupled to the memory, the method comprising:
allocating an entirety of the memory space for access by the first IC chiplet;
allocating the entirety of the memory space for access by the second IC chiplet; and
controlling transactions between the first memory chiplet, the first IC chiplet, and the second IC chiplet with the in-memory processing circuitry.
28. The method of claim 27 , wherein the controlling transactions between the first memory chiplet, the first IC chiplet, and the second IC chiplet with the in-memory processing circuitry comprises:
performing a processing operation on data stored in the memory on behalf of the first IC chiplet or the second IC chiplet.
29. The method of claim 27 , wherein the controlling transactions between the first memory chiplet, the first IC chiplet, and the second IC chiplet with the in-memory processing circuitry comprises:
controlling transfers to and from the first memory chiplet via a packet-based networking protocol.
30. The method of operation in the chiplet-based MCM of claim 27 , realized as a method of operation in a system-in-package (SiP).
31. The method of operation in the chiplet-based MCM of claim 30 , wherein:
the package substrate comprises an organic standard package substrate.
32. The method of operation in the chiplet-based MCM of claim 31 , wherein:
the first memory chiplet comprises a first high-bandwidth memory (HBM) chiplet.