IP Library › Granted Patent US 12,726,716
Granted Patent B2
US 12,726,716 · App. 18/364,873 · Granted Sep 1, 2026

Image sensor for sensing LED light with reduced flickering

Inventors: Yun-Wei Cheng (Taipei City, TW); Chun-Hao Chou (Tainan City, TW); Kuo-Cheng Lee (Tainan City, TW); Hsin-Chi Chen (Tainan City, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H04N23/745H04N23/73H04N25/40H10F39/182H10F39/199H10F39/8023H10F39/8033H10F39/8053H10F39/8057H10F39/807
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,726,716
App. No.
18/364,873
Granted
Sep 1, 2026
Kind
B2
Abstract

An image sensor device has a first number of first pixels disposed in a substrate and a second number of second pixels disposed in the substrate. The first number is substantially equal to the second number. A light-blocking structure disposed over the first pixels and the second pixels. The light-blocking structure defines a plurality of first openings and second openings through which light can pass. The first openings are disposed over the first pixels. The second openings are disposed over the second pixels. The second openings are smaller than the first openings. A microcontroller is configured to turn on different ones of the second pixels at different points in time.

Claims (56)

1 . An image sensor device, comprising:

one or more first pixels disposed in a substrate, wherein side surfaces of the one or more first pixels form one or more first interfaces with the substrate;

one or more second pixels disposed in the substrate, wherein side surfaces of the one or more second pixels form one or more second interfaces with the substrate; and

a radiation-blocking structure disposed over the substrate, wherein the radiation-blocking structure defines one or more first openings, and wherein the radiation-blocking structure further defines one or more second openings;

wherein:

in at least one of the first pixels or in at least one of the second pixels, a horizontal dimension thereof increases as the depth thereof increases;

the depth corresponds to a distance from the radiation-blocking structure;

the depth extends in a different direction than the horizontal dimension.

2 . The image sensor device of claim 1 , wherein each of the first pixels has a different dopant concentration level than each of the second pixels.

3 . The image sensor device of claim 2 , wherein each of the first pixels has a greater dopant concentration level than each of the second pixels.

4 . The image sensor device of claim 1 , wherein the first pixels and the second pixels have different geometric shapes in a cross-sectional side view or in a top view.

5 . The image sensor device of claim 1 , wherein a number of the first pixels disposed in the substrate exceeds a number of the second pixels disposed in the substrate.

6 . The image sensor device of claim 1 , wherein each of the first pixels has a greater size or a greater quantum efficiency than each of the second pixels.

7 . The image sensor device of claim 1 , wherein:

each of the first openings is vertically aligned with a respective one of the first pixels;

each of the second openings is vertically aligned with a respective one of the second pixels; and

each of the second openings is narrower than each of the first openings in a cross-sectional side view.

8 . The image sensor device of claim 1 , wherein the radiation-blocking structure includes a plurality of first segments that extend in a first direction in a top view and a plurality of second segments that extend in a second direction in the top view, wherein the second direction is different from the first direction.

9 . The image sensor device of claim 1 , further comprising a microcontroller configured to selectively activate the one or more second pixels.

10 . The image sensor device of claim 9 , wherein:

the one or more second pixels include at least a first subset of second pixels and a second subset of second pixels; and

the microcontroller is configured to:

activate the first subset of the second pixels while the second subset of the second pixels are deactivated; and

activate the second subset of the second pixels while the first subset of the second pixels are deactivated.

11 . The image sensor device of claim 1 , further comprising a passivation layer disposed over the substrate, wherein the radiation-blocking structure is embedded within the passivation layer.

12 . An image sensor device, comprising:

one or more of first pixels disposed in a substrate;

one or more second pixels disposed in the substrate, wherein the first pixels have different geometric shapes from the second pixels in a cross-sectional side view; and

a radiation-blocking structure disposed over the substrate, wherein the radiation-blocking structure defines one or more first openings, and wherein the radiation-blocking structure further defines one or more second openings.

13 . The image sensor device of claim 12 , wherein:

at least one of the second pixels has non-uniform widths; or

each of the first pixels has a different dopant or a different doping concentration level than each of the second pixels.

14 . The image sensor device of claim 12 , further comprising a microcontroller configured to turn on different subsets of the second pixels at different time periods, and wherein:

the second pixels include a first subset and a second subset;

during a first time period, the microcontroller turns on the first subset of the second pixels and turns off the second subset of the second pixels; and

during a second time period different from the first time period, the microcontroller turns off the first subset of the second pixels and turns on the second subset of the second pixels.

15 . The image sensor device of claim 12 , further comprising:

a first isolation structure disposed between an adjacent pair of first pixels; and

a second isolation structure and a third isolation structure disposed between one of the first pixels and an adjacently-located second pixel.

16 . An image sensor device, comprising:

a first number of first pixels disposed in a substrate;

a second number of second pixels disposed in the substrate, wherein the first number is substantially greater than or equal to the second number;

a light-blocking structure disposed over the first pixels and the second pixels, wherein the light-blocking structure defines a plurality of first openings and second openings through which light can pass, wherein the first openings are disposed over the first pixels, wherein the second openings are disposed over the second pixels, and wherein the second openings have different sizes than the first openings; and

a microcontroller configured to turn on different ones of the second pixels at different points in time, wherein the microcontroller is configured to turn on the different ones of the second pixels such that:

a first subset of second pixels is turned on while a second subset of the second pixels is turned off; and

the first subset of second pixels is turned off while the second subset of the second pixels is turned on.

17 . The image sensor device of claim 16 , wherein:

each of the first pixels is doped differently than each of the second pixels; or

each of the first pixels is sized differently than each of the second pixels.

18 . The image sensor device of claim 16 , wherein at least one of the second pixels has a width that changes as a function of a depth.

19 . The image sensor device of claim 12 , wherein:

at least one of the first pixels or at least one of the second pixels has a first portion and a second portion that is located closer to the radiation-blocking structure than the first portion in the cross-sectional side view;

the first portion has a first width in the cross-sectional side view;

the second portion has a second width in the cross-sectional side view; and

the second width is smaller than the first width.

20 . The image sensor device of claim 12 , wherein side surfaces of the one or more first pixels form one or more first interfaces with the substrate, and wherein side surfaces of the one or more second pixels form one or more second interfaces with the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2023
From: CHENG, YUN-WEI; CHOU, CHUN-HAO; LEE, KUO-CHENG; CHEN, HSIN-CHI
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 064752/0394 →
Continuity (4)
Division 17521267 · Nov 8, 2021
Division 16264212 · Jan 31, 2019
Provisional Application 62735886 · Sep 25, 2018
Related Publication 20230403474A1 · Dec 14, 2023
References Cited (142)
US 5018006A · Hashimoto · 1991 [cited by applicant]
US 5714753A · Park · 1998 [cited by examiner]
US 6137100A · Fossum · 2000 [cited by examiner]
US 6235549B1 · Bawolek et al. · 2001 [cited by applicant]
US 6867549B2 · Cok · 2005 [cited by examiner]
US 6885398B1 · Sladen · 2005 [cited by applicant]
US 7095441B2 · Nagano · 2006 [cited by applicant]
US 7126633B2 · Saito · 2006 [cited by applicant]
US 7564115B2 · Chen et al. · 2009 [cited by applicant]
US 7633165B2 · Hsu et al. · 2009 [cited by applicant]
US 7667749B2 · Han · 2010 [cited by applicant]
US 7821553B2 · Ellis-Monaghan · 2010 [cited by applicant]
US 7825024B2 · Lin et al. · 2010 [cited by applicant]
US 7973413B2 · Kuo et al. · 2011 [cited by applicant]
US 8105875B1 · Hu et al. · 2012 [cited by applicant]
US 8158456B2 · Chen et al. · 2012 [cited by applicant]
US 8183578B2 · Wang · 2012 [cited by applicant]
US 8183579B2 · Wang · 2012 [cited by applicant]
US 8227902B2 · Kuo · 2012 [cited by applicant]
US 8278152B2 · Liu et al. · 2012 [cited by applicant]
US 8405442B2 · Chen · 2013 [cited by applicant]
US 8426961B2 · Shih et al. · 2013 [cited by applicant]
US 8436671B2 · Chern et al. · 2013 [cited by applicant]
US 8448100B1 · Lin et al. · 2013 [cited by applicant]
US 8598508B2 · Kanai et al. · 2013 [cited by applicant]
US 8601416B2 · Kuo et al. · 2013 [cited by applicant]
US 8610488B2 · Yu et al. · 2013 [cited by applicant]
US 8625240B2 · Chung et al. · 2014 [cited by applicant]
US 8631372B2 · Yu et al. · 2014 [cited by applicant]
US 8669174B2 · Wu et al. · 2014 [cited by applicant]
US 8669780B2 · Chi · 2014 [cited by applicant]
US 8701073B1 · Fu et al. · 2014 [cited by applicant]
US 8754818B2 · Yen et al. · 2014 [cited by applicant]
US 8762900B2 · Shin et al. · 2014 [cited by applicant]
US 8775993B2 · Huang et al. · 2014 [cited by applicant]
US 8802504B1 · Hou et al. · 2014 [cited by applicant]
US 8803292B2 · Chen et al. · 2014 [cited by applicant]
US 8803316B2 · Lin et al. · 2014 [cited by applicant]
US 8847659B1 · Lan et al. · 2014 [cited by applicant]
US 8887116B2 · Ho et al. · 2014 [cited by applicant]
US 9571760B2 · Kang et al. · 2017 [cited by applicant]
US 9679939B1 · Cheng et al. · 2017 [cited by applicant]
US 10136084B1 · Solheim et al. · 2018 [cited by applicant]
US 10250832B1 · Xu et al. · 2019 [cited by applicant]
US 10257448B1 · Tower et al. · 2019 [cited by applicant]
US 10748945B2 · Oka · 2020 [cited by applicant]
US 20020044209A1 · Saito · 2002 [cited by applicant]
US 20030122948A1 · Uya et al. · 2003 [cited by applicant]
US 20040105021A1 · Hu · 2004 [cited by applicant]
US 20040174754A1 · Lee et al. · 2004 [cited by applicant]
US 20050062863A1 · Takeuchi et al. · 2005 [cited by applicant]
US 20070035653A1 · Hong et al. · 2007 [cited by applicant]
US 20080049133A1 · Bock · 2008 [cited by applicant]
US 20090167893A1 · Susanu · 2009 [cited by examiner]
US 20100002118A1 · Wang et al. · 2010 [cited by applicant]
US 20100110271A1 · Yanagita · 2010 [cited by examiner]
US 20100225791A1 · Nakayama · 2010 [cited by applicant]
US 20100283998A1 · Souchkov et al. · 2010 [cited by applicant]
US 20110273596A1 · Egawa · 2011 [cited by applicant]
US 20120074329A1 · Granfors et al. · 2012 [cited by applicant]
US 20120200749A1 · Boettiger et al. · 2012 [cited by applicant]
US 20120206326A1 · Nakamura et al. · 2012 [cited by applicant]
US 20120307104A1 · Kanai · 2012 [cited by examiner]
US 20130076723A1 · Niioka et al. · 2013 [cited by applicant]
US 20130193311A1 · Yoshida · 2013 [cited by applicant]
US 20130193981A1 · Chen et al. · 2013 [cited by applicant]
US 20130246990A1 · Yen et al. · 2013 [cited by applicant]
US 20130320553A1 · Kuo et al. · 2013 [cited by applicant]
US 20140001645A1 · Lin et al. · 2014 [cited by applicant]
US 20140043148A1 · Wang et al. · 2014 [cited by applicant]
US 20140077057A1 · Chao et al. · 2014 [cited by applicant]
US 20140078366A1 · Dokoutchaev · 2014 [cited by examiner]
US 20140092939A1 · Chang et al. · 2014 [cited by applicant]
US 20140101623A1 · Chen et al. · 2014 [cited by applicant]
US 20140126089A1 · Chang et al. · 2014 [cited by applicant]
US 20140126274A1 · Lee et al. · 2014 [cited by applicant]
US 20140167799A1 · Wang et al. · 2014 [cited by applicant]
US 20140191195A1 · Sundaram et al. · 2014 [cited by applicant]
US 20140195728A1 · Hsu et al. · 2014 [cited by applicant]
US 20140201692A1 · Chen et al. · 2014 [cited by applicant]
US 20140203397A1 · Yen et al. · 2014 [cited by applicant]
US 20140211438A1 · Lin et al. · 2014 [cited by applicant]
US 20140225258A1 · Chiu et al. · 2014 [cited by applicant]
US 20140232914A1 · Awatani · 2014 [cited by applicant]
US 20140237435A1 · Chen et al. · 2014 [cited by applicant]
US 20140239427A1 · Huang et al. · 2014 [cited by applicant]
US 20140252572A1 · Hou et al. · 2014 [cited by applicant]
US 20140253754A1 · Papiashvili · 2014 [cited by applicant]
US 20140264772A1 · Horng et al. · 2014 [cited by applicant]
US 20140266273A1 · Wang et al. · 2014 [cited by applicant]
US 20140266386A1 · Huang et al. · 2014 [cited by applicant]
US 20140282337A1 · Yuh et al. · 2014 [cited by applicant]
US 20140304670A1 · Su et al. · 2014 [cited by applicant]
US 20140310675A1 · Liu et al. · 2014 [cited by applicant]
US 20140325464A1 · Hsu et al. · 2014 [cited by applicant]
US 20140339615A1 · Wang et al. · 2014 [cited by applicant]
US 20140362260A1 · Wang · 2014 [cited by examiner]
US 20150028393A1 · Tomita · 2015 [cited by examiner]
US 20150041942A1 · Ebiko et al. · 2015 [cited by applicant]
US 20150054997A1 · Hynecek · 2015 [cited by examiner]
US 20150084144A1 · Suzuki · 2015 [cited by examiner]
US 20150146067A1 · Roh · 2015 [cited by examiner]
US 20150163423A1 · Yin et al. · 2015 [cited by applicant]
US 20150163427A1 · Rotte · 2015 [cited by examiner]
US 20150179695A1 · Lyu · 2015 [cited by examiner]
US 20150221796A1 · Smith et al. · 2015 [cited by applicant]
US 20150228689A1 · Lenchenkov · 2015 [cited by applicant]
US 20150244926A1 · Inoue · 2015 [cited by applicant]
US 20160019329A1 · Eldesouki · 2016 [cited by examiner]
US 20160150165A1 · Grauer · 2016 [cited by examiner]
US 20160150199A1 · Wu et al. · 2016 [cited by applicant]
US 20170077163A1 · Chou et al. · 2017 [cited by applicant]
US 20170078594A1 · Kawabata et al. · 2017 [cited by applicant]
US 20170104910A1 · Kimura et al. · 2017 [cited by applicant]
US 20170104942A1 · Hirota et al. · 2017 [cited by applicant]
US 20170213863A1 · Qian et al. · 2017 [cited by applicant]
US 20170324917A1 · Mlinar · 2017 [cited by applicant]
US 20170359539A1 · Kawabata et al. · 2017 [cited by applicant]
US 20170366726A1 · Yanagida et al. · 2017 [cited by applicant]
US 20180027196A1 · Yang et al. · 2018 [cited by applicant]
US 20180316845A1 · Ouyang · 2018 [cited by applicant]
US 20180359400A1 · Ogina et al. · 2018 [cited by applicant]
US 20190096928A1 · Okuda · 2019 [cited by examiner]
US 20190281226A1 · Wang et al. · 2019 [cited by applicant]
US 20190288020A1 · Ikuma et al. · 2019 [cited by applicant]
US 20200020730A1 · Mlinar · 2020 [cited by examiner]
US 20200045227A1 · Jiang · 2020 [cited by examiner]
US 20200403015A1 · Suzuki · 2020 [cited by examiner]
US 20210281732A1 · Koizumi et al. · 2021 [cited by applicant]
US 20210281737A1 · Iwase et al. · 2021 [cited by applicant]
US 20210356597A1 · Hurwitz et al. · 2021 [cited by applicant]
CN 104854476 · 2015 [cited by applicant]
CN 106057833 · 2016 [cited by applicant]
CN 106549025 · 2017 [cited by applicant]
CN 106997884 · 2017 [cited by applicant]
CN 207369146 · 2018 [cited by applicant]
KR 20160062725 · 2016 [cited by applicant]
TW 201721854 · 2016 [cited by applicant]
TW 201642451 · 2016 [cited by applicant]
TW 201735383 · 2017 [cited by applicant]
TW 201743438 · 2017 [cited by applicant]
WO WO2018105474 · 2018 [cited by applicant]